Products & Services
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Supplier: Plasma Etch, Inc.
Description: The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24” by 18.” Our oxygen service vacuum pump and booster is equipped with a two point purge system to
- Applications & Materials Processed: Research / Surface Analysis, Other
- Automated Loading: Yes
- Coating System Type: Factory / Free Standing
- Gas Control Unit: Yes
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Supplier: Plasma Etch, Inc.
Description: Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active processing surface, our
- Applications & Materials Processed: Research / Surface Analysis, Other
- Automated Loading: Yes
- Coating System Type: Factory / Free Standing
- Gas Control Unit: Yes
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Supplier: Plasma Etch, Inc.
Description: The all aluminum chamber features over 240 square inches of active processing surface with the three level standard configuration. The clean design features an industrial powder coated frame to guard your processing environment from contamination.
- Applications & Materials Processed: Research / Surface Analysis, Other
- Coating System Type: Laboratory / Benchtop
- Integral Process Controller: Yes
- Materials Processed (Deposit or Substrate): Metal, Compound Semiconductors / GaAs, Tungsten / Refractory Metal, Other
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Supplier: Plasma Etch, Inc.
Description: Our welded aluminum vacuum chamber encloses a generous 500 square inches of active plasma processing surface. Surface modification with Plasma Etch yields increased bond strength and cleanliness of most any surface material.
- Applications & Materials Processed: Research / Surface Analysis, Other
- Coating System Type: Laboratory / Benchtop
- Gas Control Unit: Yes
- Integral Process Controller: Yes
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Supplier: 3X Ceramic Parts Company Limited
Description: anodic aluminum oxide low. Therefore, high-purity alumina ceramics are prepared as chamber materials. As a plasma etching resistant cavity material, it has the following characteristics. (1) The production equipment is simple, the degree of automation is high, and the production
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Supplier: HORIBA Instruments, Inc.
Description: This software executes a variety of steps required for process control, from the analysis of plasma behavior to the creation of databases of measured data and remote control of manufacturing equipment. The programmable structure of the measurement recipe enables setting of multiple
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Supplier: Hitachi High Technologies America, Inc.
Description: makers and material / tool suppliers. Hitachi High-Tech's etch system provides superior profile controllability and CD uniformity within wafer with a new microwave ECR (Electron Cyclotron Resonance) plasma etching chamber, high speed wafer temperature control, and high vacuum exhaust
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Metrigraphics LLC
Description: The Metrigraphics Division of DRC is a leading worldwide supplier of ultra-high, precision, custom components for Original Equipment Manufacturers (OEMs). We have applied our core technologies of electroforming, photolithography, and thin-film sputtering to help customers increase the
- Functional / Performance: Conductive, Dielectric
- Industry: Electronics, OEM / Industrial
- Material / Substrate Capabilities: Aluminum, Ceramic, Composites, Copper / Copper Alloys, Glass, Metal, Nickel / Nickel Alloys, Precious Metals, Plastic, Stainless Steel, Steel / Steel Alloys, Titanium
- Regional Preference: North America, United States Only, Northeast US Only
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Supplier: Rogue Valley Microdevices, Inc.
Description: facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm. We offer full Device Fabrication and Design services along with a variety of individual processes to support our growing network of satisfied customers.
- Functional / Performance: Antireflective, Chemical Resistant, Conductive, Dielectric
- Hard Coating / Treatment: Yes
- Material / Substrate Capabilities: Aluminum, Carbide, Composites, Copper / Copper Alloys, Glass, Metal, Nickel / Nickel Alloys, Precious Metals, Titanium
- Material Selection / Design Assistance: Yes
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Supplier: Ushio America, Inc.
Description: This ultraviolet irradiation device is used for photoresist curing in LSI manufacturing lines. Equipped with a super high-pressure UV lamp and an excimer lamp, this system is used for various applications such as enhancing plasma resistance during dry etching, photoresist outgassing
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Supplier: Hendrick Metal Products
Description: Bending Notching Rolling Leveling Degreasing Water jetting Laser cutting and etching Drilling Plasma cutting MIG and TIG welding Spot welding Hardware insertion Heat treating
- Cutting: Laser Cutting, Plasma Cutting, Water Jet Cutting
- Location: North America, United States Only, Northeast US Only, Midwest US Only
- Materials: Metals
- Services Offered: Design Assistance, Prototype Services, Low Volume Production, High Volume Production
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Supplier: Impreglon, Inc.
Description: most metals, alloys and metallic compounds, and to a wide range of substrate materials. Two of the most common PVD methods are "Sputtering" and "Cathodic Arc Deposition." Impreglon provides both sputtered and arc deposited films. Accessory Equipment: Cleaning Line Complimenting our
- Functional / Performance: Abrasion Resistant, Antireflective, Chemical Resistant, Conductive, Corrosion / Rust Preventive, Friction Reducing / Low Friction, Heat Resistant / High Temperature, Mold Release / Nonstick, Oil & Grease Resistant, Reflective, Protective, Waterproof / Water Repellant, Wear / Erosion Resistant
- Hard Coating / Treatment: Yes
- Industry: Aerospace, Automotive, Electronics, Energy / Utilities, Food & Beverage, Government, Machine Tools, Medical / Healthcare, OEM / Industrial
- Material / Substrate Capabilities: Aluminum, Ceramic, Copper / Copper Alloys, Metal, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
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Supplier: Nilfisk Industrial Vacuums
Description: , and plasma etching machines. Included Accessories Nilfisk SS Vapor Vacuum 115V, 1100 W Includes: Disposable Paper Bags (5/pkg), Specially Impregnated Carbon Filter, Positive Twist Safety Latches, Heavy-Duty Trolley Assembly, Container Plug w/Lanyard, Wand End Cap & Microfilter
- Airflow: 87 SCFM
- Applications: Cleanroom, General Cleaning, Toxic Media
- Capacity: 3.25 gallons
- Features: HEPA / ULPA Filter
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Supplier: Fountyl Technologies Pte. Ltd.
Description: Electrostatic chuck has the function of normal use in vacuum atmosphere, and plays the role of holding and temperature control of wafer in high vacuum plasma or special gas environment, assisting semiconductor process equipment to realize the change of electrical characteristics and
- Application: Wafer Chuck
- Chuck Geometry: Round
- Materials of Construction: Ceramic, Other
- Number of Jaws: None / NA
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Supplier: Hendrick Metal Products
Description: Bending Notching Rolling Leveling Degreasing Water jetting Laser cutting and etching Drilling Plasma cutting MIG and TIG welding Spot welding Hardware insertion Heat treating
- Capabilities: Building Materials, Sheet / Film, Wire Cloth / Screen, Specialty / Other
- Location: North America, United States Only, Northeast US Only, Midwest US Only
- Materials: Metal
- Services: Assembly, Coating, Cutting, Finishing, Specialty / Other
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Supplier: Hendrick Metal Products
Description: Bending Notching Rolling Leveling Degreasing Water jetting Laser cutting and etching Drilling Plasma cutting MIG and TIG welding Spot welding Hardware insertion Heat treating
- Additional Services: Assembly Services, Design Assistance, Low to Mid Volume Production, High Volume Production, Prototype Services, Machining
- Arc / Resistance Welding: MIG (GMAW), Resistance - Spot, TIG (GTAW)
- Materials: Aluminum, Copper, Steel - Stainless, Steel - Structural
- Regional Preference: North America, United States Only, Northeast US Only, Midwest US Only
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Supplier: 3X Ceramic Parts Company Limited
Description: type of alumina has higher mechanical strength, excellent corrosion resistance, can produce large component products, in addition, because of its excellent plasma resistance is widely used in the semiconductor industry, such as CVD equipment, etching equipment and other
- Density: 3.92 g/cc
- Material Type: Alumina / Aluminum Oxide
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the service life of anodic aluminum oxide low. Therefore, high-purity alumina ceramics are prepared as chamber materials. As a plasma etching resistant cavity material, it has the following characteristics. (1) The production equipment is simple, the degree of automation is high, and (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Photochemical machining is the industry's preferred moniker for this metal fabrication process. It is also readily called photo or chemical etching, The process derived from the then-nascent printed circuit board industry in the 1950s. The fabrication steps are nearly identical (read more)
Browse Electrochemical, Photochemical, and Chemical Milling Services Datasheets for Conard Corporation (The) -
A "Multi-Tool" for Metal Fabricating Modern solid modeling systems give engineers and designers of precision metal components a wide variety of options for fabricating their creations, whether it be stamping, punching, or digital cutting via laser, plasma or waterjet. However (read more)
Browse Electrochemical, Photochemical, and Chemical Milling Services Datasheets for Conard Corporation (The) -
resistance to aggressive oxygen, chlorine and fluorine-based plasmas. Together with outstanding thermal and mechanical resistance qualities and similarly low particle generation to Perlast® G65HP, Perlast® G67G is ideally suited to wet and dry etching, stripping, cleaning and PVD processes. (read more)
Browse O-rings Datasheets for Precision Polymer Engineering Ltd. -
particle contamination. Its low erosion rate reduces process tool cost of ownership. Perlast G65HP is ideal for use in wet and dry semiconductor processes including: Plasma Etching Ash/Resist Stripping LPCVD, HDPCVD, PECVD, SACVD, ALD Cleaning PVD Perlast G65HP can be molded into O-rings, seals, NW/KF fittings and custom components to suit any application. (read more)
Browse Rubber and Elastomer Molding Services Datasheets for Precision Polymer Engineering Ltd. -
which delivers outstanding plasma resistance in high temperatures. We’re delighted with the results from laboratory testing and customer trials. We’re confident that G7HA will play a key role in cutting equipment downtime and reducing overall cost of ownership across a wide range of (read more)
Browse O-rings Datasheets for Precision Polymer Engineering Ltd. -
In semiconductor equipment manufacturing, engineers often face the challenge of finding materials that can withstand plasma corrosion, extreme temperatures, and demanding precision requirements. Traditional metals cannot deliver the necessary (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Used in lithography, track systems, spin coaters, and plasma etching equipment. (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
for semiconductors as an example, the precision ceramic structural components provided by coorstek cover a series of products, such as special components for photolithography machine, special components for plasma etching equipment, special components for pvd/cvd, special components for ion (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
reliable choice. BN Parts Used in Typical Equipment – Mass spectrometer ion sources – Ion implanters – Plasma etching systems – Electron beam evaporation sources – Hall effect thrusters (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd.
Conduct Research Top
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Detection of hydrocarbon radicals during plasma etching
Optical emission spectroscopy is used to study and monitor the plasma etching of. hydrogenated amorphous carbon (a-C:H) thin films.
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Microvias: For Low Cost, High Density Interconnects
Microvias: For Low Cost, High Density Interconnects. Offering a thorough look at the technology that s changing the nature of printed circuit boards and driving the mobile electronic revolution, this text details mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching
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Designing Atmospheric-Pressure Plasma Sources for Surface Engineering of Nanomaterials
using Deep Reactive Ion Etching (Alcatel Micro. Machining Systems, Annecy, France). Silicon oxide was. grown on the master stamp using thermal oxidation for 4 h at. 10001C and removed with buffered oxide etch (BOE) solvent. This was repeated twice to adequately reduce surface. scalloping and reduce
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Successfully Managing Industrial Chlorinated Processes with Metal Sealed Mass Flow Controllers
period of time. CL2 is used frequently in many applications from making PVC pipe and treating water to plasma etching a computer chip. CL2 is a critical process element in our world. CL2 mass flow controllers typically have a significant life span reduction which can be improved using tightly
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
simple etching. techniques and from a single master, allowing for more. economical fabrication of large-scale systems and mass. production [38-41]. However, it is still difficult to use iDEP. with highly conductive biological samples because joule. heating and bubble formation still occur [42
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A Microfluidic System for Biological Particle Enrichment Using Contactless Dielectrophoresis
. Microfabrication. Deep reactive ion etching (DRIE) was used to etch. a !100O silicon wafer to a depth of 50 mm (Fig. 1AeD). to form the master stamp. Oxide was then grown on the silicon. master using thermal oxidation and removed using. hydrofluoric acid to reduce surface 'scalloping' caused by. the DRIE
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Introduction to Microfabrication 2nd Edition
Wet etching equipment consists of a heated quartz tank or bath plasma etching equipment consists of a vacuum chamber with a RF generator and a gas system.
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2012 Index IEEE Transactions on Semiconductor Manufacturing Vol. 25
Fault Detection and Classi- fication in Plasma Etch Equipment for Semiconductor Manufacturing -Di- agnostics; TSM Feb. 2012 83-93 Horng, S.-C., Yang, F.-Y., and Lin, S.-S., Applying PSO and OCBA to Mini- mize the Overkills and Re-Probes in …
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Silicon-semiconductor technology
There is a plasma etching installation are from a vacuum-reaction chamber paralleled each other in the two electrodes facing.
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New era of silicon technologies due to radical reaction based semiconductor manufacturing
Device yields for various antenna ratios from 1.4 × 103 to 1 × 106 , comparing the current plasma equipment and the new microwave excited very low electron temperature high density plasma etching equipment .
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Practice knowledge Mikrosystemtechnik
By typical manufacturing facilities of the Mikrosystemtechnik (e.g., coating, Lithographie-, plasma etch installations ), many installation manufacturers offer in the meantime the sluice and production persecution systems.
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Atomic Processes in Basic and Applied Physics
0D Global Modeling of ICP Plasma Etching Equipment .................................................
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Infrarot‐Laserabsorptionsspektroskopie with quantum cascade lasers in the industrial application
Still indeed, stands for the industrial use in the plasma process technique in the beginning, but its enormous potential is recognizable already now what is impressively occupied through measurements on plasma etching installations of the semiconductor industry.
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Advanced plasma etch technologies for nanopatterning
Fig. 5 Plasma etch equipment requirements.
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Advanced plasma etch technologies for nanopatterning
Plasma Etch Equipment Requirements .
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PVMaT Cost Reductions in the EFG High-Volume PV Manufacturing Line: Annual Report, August 1998-December 2000
… • Develop database for quality control procedures in EFG wafer manufacturing for diversification of EFG wafer size to 10 cm x 10 cm and 12.5 cm x 12.5 cm areas • Deploy alternative plasma etch equipment and processes for diverse …