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Supplier: Techsil Limited
Description: tecbond® 7718 is a black, low viscosity polyamide hotmelt adhesive with excellent heat resistance. This material is perfectly suited to be used when potting and encapsulating electrical components. It offers a very fast setting time, with no mixing , no waste and no mess! 7718 offers a
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Supplier: Accuris
Description: Adhesive - Web - Polyamide
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Supplier: Henkel Corporation - Industrial
Description: Hotmelt adhesive, highly sustainable and suited to metals and plastics, particularly plasticized PVC. Good resistance to oils and high temperature. TECHNOMELT® PA 6238 is an amber-colored, polyamide hotmelt adhesive formulated from renewable raw materials. It provides good
- Chemical / Polymer System Type: Polyamide
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Supplier: Henkel Corporation - Industrial
Description: Hotmelt adhesive for bonding and low pressure moulding. Suitable for a wide range of substrates with a very short open time for high speed production. TECHNOMELT® PA 6208 BLACK is a polyamide hotmelt adhesive suitable for bonding and low pressure moulding. Suited to a wide range
- Chemical / Polymer System Type: Polyamide
- Viscosity: 3200 cP
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Supplier: Henkel Corporation - Industrial
Description: Hotmelt adhesive used for moulding applications with good adhesion for higher temperatures such as automotive underhood. Designed to meet low pressure moulding process requirements. TECHNOMELT® PA673 is an amber-colored, high performance thermoplastic polyamide and designed to meet low
- Chemical / Polymer System Type: Polyamide
- Use Temperature: 104 to 284 F
- Viscosity: 3400 cP
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Supplier: Ellsworth Adhesives
Description: Bostik Thermelt 195 Amber is a one component, pure copolymer polyamide hot melt resin. Includes a fast setting time, short open time, good flexibility, and good wetting properties at the application temperature. Designed for molding electronic components, cables, and connectors. Non-reactive
- Chemical / Polymer System Type: Polyamide
- Dielectric Strength: 483 kV/in
- Elongation: 580 %
- Tensile Strength (Break): 1740 psi
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Supplier: Henkel Corporation - Industrial
Description: High melting thermoplastic hotmelt adhesive based on polyamide. It exhibits good chemical resistance and adhesion to a wide variety of substrates. TECHNOMELT® PA 9069 is a high melting thermoplastic hotmelt adhesive based on polyamide. It exhibits good chemical resistance
- Chemical / Polymer System Type: Polyamide
- Cure Type / Technology: Single Component System
- Use Temperature: 410 to 449 F
- Viscosity: Up to 50 cP
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Supplier: Techsil Limited
Description: tecbond® 7784 is a multipurpose hotmelt adhesive which offers both high and low temperature resistance. 7784 is a tough flexible polyamide based hot melt which exhibits excellent adhesion to many difficult to bond substrates. This grade is very versatile and suitable for product
- Cure Type / Technology: Thermoplastic / Hot Melt
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Supplier: Techsil Limited
Description: tecbond® 7784 is a multipurpose hotmelt adhesive which offers both high and low temperature resistance. 7784 is a tough flexible polyamide based hot melt which exhibits excellent adhesion to many difficult to bond substrates. This grade is very versatile and suitable for product
- Cure Type / Technology: Thermoplastic / Hot Melt
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Standards and Technical Documents - ADHESIVE, EPOXY RESIN WITH POLYAMIDE CURING AGENT -- MIL-A-81236Supplier: Accuris
Description: ADHESIVE, EPOXY RESIN WITH POLYAMIDE CURING AGENT
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Supplier: Accuris
Description: Adhesive, Hot Melt, Polyamide, Headling/Wire Harness
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Supplier: Accuris
Description: Adhesive, Hot Melt, Polyamide, Supported Vinyl to Hardboard
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Double-sided adhesive tape allows the standoff to be mounted quickly and easily; allows PCB mounting in non-boss enclosures. Steel nut is installed, it has sufficient thread strength. Convenient for installing PCBs into enclosures without the need for customization. Please ensure
- ANSI Metric Size: M2.5, M3, M4
- Body Length / Working Height: 0.1969 to 0.7874 inch
- Material: Plastic / Polymer, Nylon (Polyamide)
- Mounting: Adhesive Mount
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Supplier: Mitsui Chemicals America, Inc.
Description: ADMER™ Adhesive Resin is a modified polyolefin with functional groups, designed to bond to a variety of polyolefins, ionomers, polyamides, ethylene vinyl alcohol (EVOH), polyesters (PET), polycarbonates, polystyrenes and metals such as steel and aluminum. Essentially, ADMER™
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Technomelt PA 7804 polyamide hot melt, formerly known as Hysol 7804, is a elastomeric, tough, high performance adhesive that is recommended for demanding applications where substrates may be exposed to extreme temperatures.
- Chemical / Polymer System Type: Polyamide
- Cure Type / Technology: Thermoplastic / Hot Melt, Single Component System
- Dielectric Strength: 600 kV/in
- Elongation: 900 %
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Supplier: Zippertubing Co. (The)
Description: Z-Block Tape is a Polyamide hot-melt adhesive designed to “water block†electrical wire and cables that utilize a secondary heat shrinkable outer jacket. The adhesive is compatible with high performance, heat shrink tubing materials such as Polyolefin, Viton and
- Adhesive: Hot Melt / Heat Activated
- Backing: Specialty / Other
- Temperature Resistance: -55 to 135 C
- Thickness: 0.0120 inches
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Supplier: Zippertubing Co. (The)
Description: Z-Block Tape is a Polyamide hot-melt adhesive designed to “water block†electrical wire and cables that utilize a secondary heat shrinkable outer jacket. The adhesive is compatible with Polyolefin, Polyvinylchloride, and EVA type heat shrinkable tubing plus Copper
- Adhesive: Hot Melt / Heat Activated
- Backing: Specialty / Other
- Temperature Resistance: -55 to 100 C
- Thickness: 0.0120 inches
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Supplier: Techsil Limited
Description: Techsil HM 2277 is a amber colored potting & encapsulating polyamide adhesive. HM 2277 has a very low viscosity that sets very hard. It is used for two main applications; the first is for potting and encapsulation in the electronics industry; secondly it is an ideal substance for knot
- Cure Type / Technology: Thermoplastic / Hot Melt
- Features: Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: Power Adhesives Tecbond 7718 Hot Melt Adhesive Amber is a polyamide adhesive. It is used in potting and encapsulation in the electronics industry and knot filling/wood repair in the woodworking industry. 0.5 in x 12 in Stick, 11 lb Case.
- Cure Type / Technology: Thermoplastic / Hot Melt, Single Component System
- Dielectric Strength: 762 kV/in
- Industry: Electronics
- Substrate / Material Compatibility: Wood / Wood Product
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Supplier: Essentra Components
Description: Adhesive Base Supports come with a double sided adhesive tape with a release tab for quick installation and the non-locking types are ideal for a quick release
- Material: Plastic / Polymer, Nylon (Polyamide), Specialty / Other
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: Essentra Components
Description: Adhesive Base Supports come with a double sided adhesive tape with a release tab for quick installation. It locks onto the board but is releasable with a pinch.
- Material: Plastic / Polymer, Nylon (Polyamide), Specialty / Other
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: Ellsworth Adhesives
Description: Bostik HM4229 Hot Melt Adhesive Light Amber is a thermoplastic dimer-acid polyamide in pellet form. It offers low application viscosity, good high and low temperature performance and easy application. 1100 lb Skid.
- Cure Type / Technology: Thermoplastic / Hot Melt, Single Component System
- Elongation: 350 %
- Substrate / Material Compatibility: Metal, Plastic, Wood / Wood Product
- Tensile Strength (Break): 790 psi
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Supplier: Essentra Components
Description: Adhesive Base Supports come with a double sided adhesive tape with a release tab for quick installation and the snap-locking types are ideal for quick installation with a low profile option for space saving capabilities
- Material: Plastic / Polymer, Nylon (Polyamide), Specialty / Other
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: Keystone Electronics Corp.
Description: Part Number: 9080 Length: .187 [4.74] Material: Nylon 6/6-V-0 Style: Lock-in with Adhesive Base
- Body Length / Working Height: 0.1870 inch
- Material: Plastic / Polymer, Nylon (Polyamide)
- Mounting: Adhesive Mount
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: Keystone Electronics Corp.
Description: Part Number: 9073 Length: .500 [12.7] Material: Nylon 6/6-V-0 Style: Mini Lock-in with Adhesive Base
- Body Length / Working Height: 0.5000 inch
- Material: Plastic / Polymer, Nylon (Polyamide)
- Mounting: Adhesive Mount
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: Keystone Electronics Corp.
Description: Part Number: 9081 Length: .250 [6.4] Material: Nylon 6/6-V-0 Style: Lock-in with Adhesive Base
- Body Length / Working Height: 0.2500 inch
- Material: Plastic / Polymer, Nylon (Polyamide)
- Mounting: Adhesive Mount
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: Keystone Electronics Corp.
Description: Part Number: 9070 Length: .187 [4.74] Material: Nylon 6/6-V-0 Style: Mini Lock-in with Adhesive Base
- Body Length / Working Height: 0.1870 inch
- Material: Plastic / Polymer, Nylon (Polyamide)
- Mounting: Adhesive Mount
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Nomex paper is a calendered polyamide insulating paper with excellent mechanical strength, dielectric strength, flexibility and resilience.
- Backing: Paper
- Dielectric Strength: 2.00E7 V/m
- Features: Anti-static / ESD Control, Dielectric / Insulating, Electrically Conductive
- Thickness: 0.0071 inches
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Supplier: DigiKey
Description: Board Support Snap Lock / Adhesive Nylon
- Material: Nylon (Polyamide)
- Mounting: Adhesive Mount
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: Gelest, Inc.
Description: Application Employed as a coupling agent for polyamides.1 In combination with glutaraldehyde immobilizes enzymes.2 Reference 1. Arkles, B. et al. SPI 42nd Composite Inst. Proc., 21-C, 1987 2. Cramer, S. et al. Biotechnol. Bioeng. 1989
- Chemical / Polymer System Type: Silicone
- Industry: Other
- Viscosity: 125 to 175 cP
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Supplier: Henkel Corporation - Electronics
Description: (Known as MACROMELT 6211 ) Macromelt® 6211™ is a polyamide hot melt adhesive that exhibits excellent low temperature flexibility. This product is suitable for bonding plastics, metal, flexible vinyl, and ABS. It is an excellent adhesive for telecommunication and power cables. It
- Cure Type / Technology: Thermoplastic / Hot Melt
- Industry: Electronics
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Supplier: RS Components, Ltd.
Description: Thermally conductive foil discs. Double-sided adhesive layers. Replaces mechanical fastenings Thickness = 0.127mm Diameter = 23mm Thermal Conductivity = 0.37W/m·K Material = Polyamide Self-Adhesive = Yes Minimum Operating Temperature = -30°C Maximum Operating Temperature =
- Chemical / Polymer System Type: Polyamide
- Material Type: Pad
- Thermal Conductivity: 0.3700 W/m-K
- Use Temperature: -22 to 257 F
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Supplier: Dymax
Description: Dymax Multi-Cure® 6-621-GEL adhesive cures upon exposure to light and is designed for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other materials. Dymax 6-621-GEL adhesive is specially formulated to cure with heat in applications
- Cure Type / Technology: UV / Radiation Cured (EB, Light)
- Dissimilar Substrates: Yes
- Industry: Other
- Substrate / Material Compatibility: Ceramic / Glass, Other
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Supplier: RS Components, Ltd.
Description: Moulded polyamide attachments, UL 94-V2 standards, self-extinguishing, with a lock mechanism and holding springs for ribbon cables. These models offer excellent adhesion. Cable Clip/Clamp Style = Ribbon Affixing Method = Adhesive Material = Polyamide Colour = Grey Length = 600mm
- Material: Other
- Type: Adhesive Mount Clip, Other
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Supplier: RS Components, Ltd.
Description: Colour - Pale yellow. Excellent Impact resistance. Room temperature curing, high strength and toughness. Versatile and excellent resistance to dynamic loading. Ideal for large areas of bonding and/or a long working time Material Compatibility = Polyamide Colour = Yellow Package Type
- Use Temperature: 113 to 176 F
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Featured Products Top
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In search of high-performance adhesive and dispensing solutions? Ellsworth Adhesives has exceptional offerings including filter assembly applications for gasketing, die cut materials, and adhesives. We offer EVAs, polyamides, polyesters, polyolefins/APAOs, polyurethanes, pressure sensitive (read more)
Browse Polyurethane Adhesives and Sealants Datasheets for Ellsworth Adhesives -
ADMERTM Adhesive Resin is a modified polyolefin with functional groups, designed to bond to a variety of polyolefins, ionomers, polyamides, ethylene vinyl alcohol (EVOH), polyesters (PET), polycarbonates, polystyrenes and metals such as steel and aluminum. The material functions as a (read more)
Browse Specialty Polymers and Resins Datasheets for Mitsui Chemicals America, Inc. -
epoxies, silicones, polyurethanes, polysulfides, UV cures and other specialty adhesive systems. We are true specialists in our field and are recognized by many as the preeminent adhesive formulation company in the world. Through research and development, we have been able to create innovative (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Ellsworth Adhesives strives to improve our Customer-centric value proposition by offering an integrated supply chain solution that quantifiably reduces procurement costs. We will accomplish this by intimately understanding our Customers’ unique supply chain opportunities, by removing waste (read more)
Browse Industrial Adhesives Datasheets for Ellsworth Adhesives -
Eliminate the weighing and mixing of adhesives and resins. Ellsworth Adhesives works with KitPackers, a custom resin packager that offers pre-mixed and frozen (PMF (read more)
Browse Industrial Adhesives Datasheets for Ellsworth Adhesives -
EP42HT-2LTE Master Bond EP42HT-2LTE is an innovative, two component epoxy system with an ultra low coefficient of thermal expansion. It can be used as an adhesive, sealant, coating and, in some cases, as a casting system. EP42HT-2LTE (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Parker LORD® 7542A-B Urethane Adhesive is a two-component adhesive system that is used for bonding primed metals, SMC, FRP, and plastics. It is environmentally friendly, non-flammable, and resistant to weathering, chemicals, sunlight, and humidity. 1:1 mix ratio by volume. (read more)
Browse Industrial Adhesives Datasheets for Ellsworth Adhesives -
Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients Master Bond Supreme 70CN is a two part epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This moderate viscosity unfilled epoxy is black in color and (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP54TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively.
(read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Cryogenically serviceable Supreme 12AOHT-LO combines superior thermal conductivity with reliable electrical insulation properties in an easy to use, no mix system.
(read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc.
Conduct Research Top
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What is the Difference between Epoxy and Adhesive?
Epoxy is a term used to describe a class of resins characterized by their excellent adhesion, versatility, and durability. Epoxy resins are formed by the reaction of a polyamine with a polyamide. The resultant polymer 's three-dimensional network gives it superior mechanical and chemical properties
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What is the Difference Between Glue and Adhesive?
of glue used in school glue sticks. Other types of glue include white glue, made from a resin called polyvinyl chloride, and hot glue, made from a resin called polyamide. Hot glue is used for projects that require a strong bond, such as woodworking.
More Information Top
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Chain modifier/branching agent in polyamides ( adhesives , films, inks, plastics); flexibilizer in adhesives, wet str. paper applics.; in cat- ionic emulsifiers; in cationic collectors for ore flocculation; chelating agents; corrosion/scale inhibitor; epoxy curing agent; flocculating agent; PU extender or catalyst .
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Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
Uses: Chain modifier/branching agent in polyamides ( adhesives , films, inks, plastics); flexibilizer in adhesives, wet str. paper applics.; in cationic emulsifiers; in cationic collectors for ore flocculation; chelating agents; corrosion/scale inhibitor; epoxy curing agent; flocculating agent; PU extender or catalyst .
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Handbook of Textile Processing Chemicals
Chem. Descrip.: Thermoplastic polyamide adhesive resin CAS 25038-54-4 .
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Handbook of Corrosion Inhibitors
Uses: Chain modifier/branching agent in polyamides ( adhesives , films, inks, plastics); flexibilizer in adhesives, wet str. paper applics.; in cationic emulsi- fiers; in cationic collectors for ore flocculation; chelating agents; corrosion/ scale inhibitor; epoxy curing agent; flocculating agent; PU extender or cat- alyst .
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Adhesives
Pretreating tin-free steel for cans with an aqueous solution of an unsaturated carboxylic acid polymer (e-g., an aconitic acid-itaconic acid copolymer) improves the bond strength when the steel is bonded tith, e.g., a polyamide adhesive .
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Polyamide Resins (Non-nylon types)
In 2012, polyamide adhesives accounted for approximately 8% of the total hot-melt market and about 35% of the specialty (high- performance) hot-melt market, which includes polyester-, polyurethane- and ionomer-based adhesives.
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Handbook of Adhesion Technology
Polyamide adhesives have been reviewed by Rossitto (1990).
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Polyamides other than Nylons, Part II
"Preparing Hot-Melt ( Polyamide ) Adhesives by Anionic Polymerization," Netherlands 71,01465 (Aug. 8, 1972) (Abstract .
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Electrical embedding-new polyamides
GORDONisinternationaltechnicalserv- ices manager for polyamide adhesive resins for the DevelopmentandTechnicalServicesLabora- tory,Union CampCorp., Savannah, Georgia.
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Polymer Technology
Polyamide adhesives have also been used as side-seam cements in tin cans, as pressure-sensitive adhesives, shoe cements, and bookbinding adhe- sives.
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