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Supplier: Henkel Corporation - Industrial
Description: Polyurethane black hardener that when mixed with the appropriate resin forms a low-shrinkage, low-exotherm potting compound. LOCTITE® UK 3182 is a black polyurethane resin that when mixed with LOCTITE UK 3173 polyurethane resin forms a low-shrinkage, low-exotherm potting
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
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Supplier: Henkel Corporation - Industrial
Description: Rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast cure. LOCTITE® UK 3364™ is a black, rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast cure. Once
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Use Temperature: 200 to 240 F
- Viscosity: 1500 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 0138, Urethane, Potting and Encapsulating, Extended polybutadiene/MDI base Sealant LOCTITE® STYCAST US 0138 is an extended polybutadiene/MDI base encapsulant/sealant formulated for potting electronics or devices for protection against environmental hazards. It
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 0.5600 W/m-K
- UL Approved: Yes
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST U 2516 HTR, Polyurethane, Encapsulant LOCTITE® STYCAST U 2516 HTR flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties allowing complete impregnation of either small slightly wound coils or large castings.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 290 psi
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Supplier: Epoxies Etc...
Description: This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 83.33 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONAP DS-1832 Polyurethane Encapsulant Black is used in electrical potting, casting, or encapsulation. It has high compatibility with most epoxy and urethane systems, heat-stable pigments, and improved heat and light resistance. 1 gal Can.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-2550 Polyurethane Encapsulant is a two-component polyurethane potting system. It is used for potting and encapsulation of electronic components, circuit boards, and related devices. It has low stress cure for protection of sensitive components and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 1090 kV/in
- Elongation: 32 %
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-2550 Polyurethane Encapsulant Black is a two component, filled, non-mercury system that is used for casting high voltage transforms, encapsulating and potting electrical assemblies. It cures at room to elevated temperatures and offers good electrical
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Elongation: 32 %
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Dielectric Strength: 0.0165 kV/in
- Elongation: 155 %
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Encapsulants and Potting Compounds - Techsil® PU23930 Pearl Polyurethane Twinpack 250gm -- TEEP14087Supplier: Techsil Limited
Description: Techsil® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features Excellent long term UV stability Scratch and mark resistant Non-toxic High mechanical strength Easy to mix and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: DigiKey
Description: BLACK RIGID POLYURETHANE POTTING
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: A durable two-part polyurethane encapsulation resin developed for electrical components exposed to extreme conditions. Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting of electronics, such as the next
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: Specialist resin with environmental protection for LEDs and PCBs, preserving optical clarity and color after prolonged UV exposure. Product Overview UR5634 Optically Clear Polyurethane LED Potting Compound is a two-part, semi-rigid polyurethane resin. It is formulated with a
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Industry: Electronics, Optical Grade / Material, Semiconductors / IC Packaging
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond™ R-30-6 Series
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 11000 to 17000 cP
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Supplier: Epoxies Etc...
Description: 70-2800 Polyurethane Elastomer Series are a line of high performance urethane prepolymers based on menthane diisocyanate, MDI. They do not contain MOCA or TDI. 70-2800 Urethanes are very low in viscosity, have extremely low shrinkage, and excellent air release properties.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Features: Encapsulanting / Potting, Flexible / Dampening
- Industry: Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: ACCRAbond, Inc.
Description: CONATHANES® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electroni c potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-O are obtained. EN-2541 and EN-2543 have
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Usage Conditions Flammability Performance : Flame-Retardant
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Flame Retardant / UL 94V-0 Rated: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: RS Components, Ltd.
Description: Optically clear polyurethane 250g - Adhesives & Glues - Potting Compounds
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.2000 W/m-K
- Use Temperature: -40 to 248 F
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol US0154 ) Encapsulant potting urethane.
- Coeff. of Thermal Expansion (CTE): 5.56 µin/in-F
- Compound Type: Encapsulating / Potting
- Elongation: 50 %
- Industry: Electronics
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Supplier: GS Polymers, Inc.
Description: Two part, excellent impact resistance, heat cure
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: ELANTAS North America LLC
Description: The smart meter market, encompassing electric, water, and gas sectors, is pivotal in shaping a sustainable and connected future. As these meters become integral to our utilities, they face multifaceted challenges. From fluctuating environmental conditions to potential electronic interference, the
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethane's including toughness, abrasion resistance and flexibility. Master Bond Polymer System EP30D-7 is formulated to cure at room temperature or more rapidly at elevated
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Sauereisen, Inc.
Description: Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Cure Type / Technology: Two Component System
- Industry Applications: Other
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Supplier: Wacker Chemical Corp.
Description: outstanding resistance to casting resins, particularly polyurethanes Application encapsulation of electrical and electronic components making flexible molds for reproducing models with no or only minor undercuts in all common reproduction materials release coat for rigid molds for the casting
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Elongation: 130 %
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Supplier: Epoxies Etc...
Description: UV Cure 60-7156 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7156 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. It's low durometer (flexibility)
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Features: Encapsulanting / Potting, Elastomeric
- Industry: OEM / Industrial
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Master Bond, Inc.
Description: such as strength, chemical resistance, and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition, EP30D10 has been used successfully in a number of different cryogenic applications. Master Bond Polymer System EP30D-10 is
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 50 µin/in-F
- Dielectric Strength: Over 400 kV/in
- Dissimilar Substrates: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating and is castable beyond 1/8" thick. The cured system has good chemical resistant properties particularly to
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 33 to 39 µin/in-F
- Dielectric Constant (Relative Permittivity): 5.29
- Dissimilar Substrates: Yes
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and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
. State of the art polyurethane materials with UL Relative Thermal Index (RTI) ratings up to 130°C and higher (Conapoxy®, CONAP®, ELAN-Tron®). Unique, one (read more)
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potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
defense industry. We have proudly worked with every branch of the military, fulfilling a wide array of applications. Our flexible, polyurethane open-cell foams are formulated to absorb large amounts of impact energy at controlled rates while cushioning payloads from high G-stress levels. They (read more)
Browse Fabricated Plastic Parts and Semi-Finished Shapes Datasheets for General Plastics Manufacturing Co. -
defense industry. We have proudly worked with every branch of the military, fulfilling a wide array of applications. Our flexible, polyurethane open-cell foams are formulated to absorb large amounts of impact energy at controlled rates while cushioning payloads from high G-stress levels. They (read more)
Browse Armor and Ballistic Shielding Datasheets for General Plastics Manufacturing Co. -
have proudly worked with every branch of the military, fulfilling a wide array of applications. Our flexible, polyurethane open-cell foams are formulated to absorb large amounts of impact energy at controlled rates while cushioning payloads from high G-stress levels. They have been used (read more)
Browse Armor and Ballistic Shielding Datasheets for General Plastics Manufacturing Co. -
have proudly worked with every branch of the military, fulfilling a wide array of applications. Our flexible, polyurethane open-cell foams are formulated to absorb large amounts of impact energy at controlled rates while cushioning payloads from high G-stress levels. They have been used (read more)
Browse Armor and Ballistic Shielding Datasheets for General Plastics Manufacturing Co. -
, which can cause malfunction and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable (read more)
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Master Bond LED401 is a breakthrough system based on LED technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition (read more)
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NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications.
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ES&H development activities for the W89 warhead
Polvumt bane Encapsulant and Polyurethanee Sleeving Polyurethane encapsulant and sleeving are used as insulation material in high voltage areas of the firing set.
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NUWC XP-1 polyurethane-urea: a new, "acoustically transparent" encapsulant for underwater transducers and hydrophones
In the Navy materials community, there is no consensus or formal guidance as to what the maximum allowable amount of water absorption by a polyurethane encapsulant should be because applications are generally unpredictable.
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25th PolyMAC Conference, June 13-15, 1995
Abstract The processing and physical properties requirements for a polyurethane encapsulating foam are much different from the requirements of a stnrctural foam.
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http://www.dtic.mil/cgi-bin/GetTRDoc?AD=ADA294555&Location=U2&doc=GetTRDoc.pdf
For MSI's initial subscale 100 mm transducers, the electrical cable was simply attached at the mid-point of one edge, with a relatively short length of cable contained within the outer polyurethane encapsulation .
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Stretchable electronic systems for wearable and textile applications
In the next process step the components and the copper foil are laminated into a polyurethane encapsulation , see figure 4.
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Integrated Environmental Modeling: Pollutant Transport, Fate, and Risk in the Environment
To address this concern, a more efficient polycondensation catalyst, tetrakis(acetoxydibutyltinoxy)silane (Si[OSn(n-C4 H9 )2 OOCCH3 ]4 , TKAS), was synthesized, encapsulated using the polyurethane encapsulation procedure described above and used in self-healing experiments instead of DMDNT.
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Ruggedized Fiber Optic Cables For Army Communication Systems
The two parallel KEVLARR -49 strength members are embedded in the polyurethane encapsulant during the extrusion process.
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Energy Materials Coordinating Committee (EMaCC): Annual technical report, fiscal year 1993
Toluene Diisocyanate-Free Rigid Polyurethane Encapsulation Foams .
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Pinellas Plant Environmental Baseline Report
methylene dianiline(MDA) polyurethane encapsulant .
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An investigation into the durability of screen-printed conductive tracks on textiles
A cross-sectional micrograph of a typical silver polymer conductive track with polyurethane encapsulation is shown in figure 1. .