Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Allied Electronics, Inc.
Description: Silver Print, 27 °C Flash Point, 1.6 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
-
Supplier: Allied Electronics, Inc.
Description: Silver Print, 27 °C Flash Point, 1.6 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
-
Supplier: Allied Electronics, Inc.
Description: Silver Print, 27 °C Flash Point, 1.6 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
-
-
Supplier: Allied Electronics, Inc.
Description: 3M Scotch-Weld™ Epoxy Potting Compound-Adhesives Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Use Temperature: -40 to 300 F
-
Encapsulants and Potting Compounds - Techsil HM 2277 12 Amber Potting Hot melt Adhesive -- PAHM20218Supplier: Techsil Limited
Description: Techsil HM 2277 is a amber colored potting & encapsulating polyamide adhesive. HM 2277 has a very low viscosity that sets very hard. It is used for two main applications; the first is for potting and encapsulation in the electronics industry; secondly it is an ideal substance
- Cure Type / Technology: Thermoplastic / Hot Melt
- Form / Function: Encapsulant / Potting Compound
-
Supplier: DigiKey
Description: TRANSLUCENT EPOXY, POTTING COMPO
- Form / Function: Encapsulant / Potting Compound
-
Supplier: DigiKey
Description: BLACK EPOXY, POTTING COMPOUND
- Form / Function: Encapsulant / Potting Compound
-
Supplier: DigiKey
Description: BLACK EPOXY, POTTING COMPOUND
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Epoxies Etc...
Description: 20-3003 is a low viscosity, potting, encapsulating, and adhesive system. Its low viscosity allows for good flow and wetting of substrates.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 3.61
- Elongation: 4.5 %
- Features: Encapsulanting / Potting
-
Supplier: DigiKey
Description: ADHESIVE SEAL CLEAR NONCORROSIVE
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Epoxies Etc...
Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Epoxies Etc...
Description: 20-2162 is a unique high performance two component urethane system. The 20-2162 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries and substrate wicking. This product offers outstanding durability and adhesion to a variety of
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.4
-
Supplier: Epoxies Etc...
Description: 20-2182 is a unique high performance two component urethane system. The 20-2182 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries and substrate wicking. This product offers outstanding durability and adhesion to a variety of
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.4
-
Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: Protavic America, Inc.
Description: Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
-
Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability. Features:
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
-
Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating. Features: High bond strength High thermal resistance No refrigeration required
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
-
Supplier: Hapco, Inc.
Description: approval. Filter-bond™ R-30-6 Series This series features 3 potting and adhesive systems specifically designed for potting and/or bonding Ultrafiltration products. The products in this series DO NOT CONTAIN AROMATIC AMINES or other carcinogenic or mutenogenic materials
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 8000 to 14000 cP
-
Supplier: Chemence Inc.
Description: Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture
- Applied Thickness / Gap Fill: 0.0500 inch
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
-
Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
-
Supplier: Henkel Corporation - Industrial
Description: Sicomet 100 is a fast curing medium-viscosity ethylcyanoacrylate for bonding a wide range of materials including plastics and rubbers.Features and Benefits: Versatile instant adhesive suitable for a wide range of applications Available in low and medium viscosity and
- Form / Function: Glob Top / Daub
-
Supplier: ACCRAbond, Inc.
Description: INSTAbond® 812 A low viscosity, two part epoxy system that is for all types of room temperature curing adhesive applications including Casting, Encapsulating and 100% solids coatings that require cure at room temperature. INSTAbond® N812 produces a durable, resilient bond or coating that is
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
-
Supplier: Techsil Limited
Description: Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are many applications
- Compound Type: Encapsulating / Potting
- Industry: Electronics
-
Supplier: Techsil Limited
Description: Momentive TSE325 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits Easy to use, one-component material Fast cure at elevated temperature
- Compound Type: Encapsulating / Potting
- Industry: Electronics
-
Supplier: GS Polymers, Inc.
Description: Two part, general purpose potting compound and adhesive
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a
- Features: Encapsulanting / Potting
- Viscosity: 70000 cP
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5545 fast cure polyurethane potting compound is unique when it comes to encapsulation and cable jointing compounds. It extends the standard urethane technology to create specialised properties useful for a host of applications but particularly cable jointing
- Compound Type: Encapsulating / Potting
-
Supplier: Henkel Corporation - Industrial
Description: White to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating components to heat sinks LOCTITE® 384 is a white to off-white, 1-part, thermally conductive, modified acrylic paste adhesive designed for bonding heat generating
- Features: Thermal / Heat Conductive
- Viscosity: 100000 cP
-
Supplier: R. S. Hughes Company, Inc.
Description: Momentive white RTV41 potting & encapsulating compound is compatible with potting, encapsulating, cast-in-place gaskets and molds and providing a surface on metals and fabrics from which paint and adhesives can be easily stripped materials with a 24 hr cure time. Provides a 1 hr
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Dielectric Strength: 520 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.3100 W/m-K
-
Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.67 to 94.44 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 11.35
-
Supplier: SAE International
Description: This SAE Aerospace Recommended Practice (ARP) describes and gives general guidelines on use and applicability of the standard method for mixing resins, adhesives, and potting compounds.
-
Description: ISO 10364:2007 specifies methods for determining the pot life of multi-component adhesives in order to be able to determine whether the pot life conforms to the minimum specified working life required of an adhesive. The test methods described are suitable for assessing
-
Supplier: Chemence Inc.
Description: Krylex KU3104 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture
- Applied Thickness / Gap Fill: 0.1500 inch
- Chemical / Polymer System Type: Cyanoacrylate
- Cure Type / Technology: Anaerobic, UV / Radiation Cured (EB, Light), Reactive / Moisture Cured, Single Component System
- Features: Encapsulating / Potting
Find Suppliers by Category Top
Featured Products Top
-
Ellsworth Adhesives offers low pressure molding services that combine (read more)
Browse Encapsulants and Potting Compounds Datasheets for Ellsworth Adhesives -
DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
. Our Easypoxy®product range of adhesives for industrial applications are versatile epoxy systems that can bond a wide variety of materials. Epoxylite® Hi-Temp adhesives and potting materials have been used in the (read more)
Browse Industrial Adhesives Datasheets for ELANTAS PDG, Inc. -
Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What's more, most bonding, potting, encapsulation (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Resistance to steam sterilization is an important consideration for the selection of polymeric adhesives, sealants and potting compounds for use in medical applications. Select Master Bond adhesives were cast into molds to create a size roughly of 2 inches in diameter, and 0.125 inches thick (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
, construction, and general manufacturing. They find applications in bonding, sealing, potting, encapsulating, and repairing a wide range of components and structures. Some common uses include: Automotive industry: These adhesives are extensively used in automotive (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Polyurethane ELANTAS PDG, Inc. brings innovative bonding and potting solutions to filtration and separation applications, including water and waste water, food and beverage, oil and fuel. These solutions offer design and (read more)
Browse Polyurethane Adhesives and Sealants Datasheets for ELANTAS PDG, Inc. -
,best thermally conductive epoxy,low temperature epoxy adhesive,electronic epoxy encapsulant potting compounds and so on. Epoxy adhesives are high-performance adhesives often used in carpentry and woodworking or for specialized creative uses like making costume jewelry. These practices include not only (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Easypoxy®product range of adhesives for industrial applications are versatile epoxy systems that can bond a wide variety of materials. Epoxylite® Hi-Temp adhesives and potting materials have been used in the aerospace industry since the (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS PDG, Inc. -
DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd
Conduct Research Top
-
The Need of Adhesives Glue for Potting Electronics
Potting involves fillings done using an adhesive or potting compound. When this is done, the components are usually in a recess or housing that has to be filled with adhesive.
-
UV Curing Adhesives and Potting Compounds
Recent advancements in ultraviolet curing have given engineers a new opportunity when choosing adhesives, potting compounds, coatings, and sealants. Until now, most of these systems were either two-component systems requiring mixing, one-component heat cure systems, or solvent-based systems
-
Adhesive Bonding, Potting and Assembly of Automotive Sensors and ECUs
precise, high quality adhesive bonding, dispensing and potting processes come into play.
-
Why is Preparation of Adhesive Bonding and Potting Materials Necessary?
To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity
-
Selecting the Right Potting Compound for Your Application
Many questions arise when trying to select an appropriate potting compound. An experienced materials expert can help identify the primary concerns, recommend materials, provide testing of the materials, and offer information on dielectric strength, adhesive. characteristics, thermal conductivity
-
Tech Tip 26 - Pot Life, Working Life and Gel Time of Epoxies
Pot life, working life, and gel time are properties of an epoxy that can vary greatly from product to product. These properties play a vital role in material selection in choosing an adhesive for a specific manufacturing environment or process. When selecting an epoxy, pot life may be an important
-
Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
-
Lap Shear Testing of Adhesives
Master Bond epoxies exhibit outstanding physical strength properties for high performance bonding, sealing, coating, potting and encapsulation. There are several key strength properties that may be incorporated in our epoxy adhesive formulations: cleavage, compressive, flexural, peel, tensile
More Information Top
Indicates content that may require registration and/or purchase.
-
Potted fiber optic sensor coil by novel adhesives for high-stability FOG
Keywords: Sensor coil, potting adhesive , stress, high stability .
-
Handbook of Materials Selection Complete Document
Potting Adhesive .
-
New flexibilized diallyl phthalate resins for encapsulating electronic display devices
Reduction in cracking due to thermal shock improved potting adhesion to the display cap, and elimination of separation at the plastic-resin interface was achieved by using an aromatic epoxy resin with the DAP/LMA potting resin.
-
International Astronautical Congress (IAF) > Material Considerations in the STEREO Solar Array Design
Film adhesive was used to bond the face- sheets to the aluminum honeycomb core, while core potting adhesive was used to at- tach the insert to the honeycomb core, al- lowing the panel to behave as a cohesive unit.
-
One-pot fabrication and antimicrobial properties of novel PET nonwoven fabricsThis work was presented at the International Union of Materials Research Societie...
Herein, the immobilization of antibacterial peptides on PET fabrics via the one- pot adhesive method was done and evaluated.
-
Effects of package on the performance of MEMS piezoresistive accelerometers
Thus, choosing proper potting adhesive can improve the sensitivity of the sensor.
-
Laminated microfluidic structures using a micromolding technique
The package is compression sealed against the microdevice, then held in place by potting adhesives which surround the chip.
-
Adhesive Layer Shrinkage in Bonds Subjected to Thermal Cycling
Key words: adhesive bonds, adhesive shrinkage, debonding, friction, frictional hysteresis, potting adhesive applications, thermal cycling, thermal ratcheting .