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  • CW Operation of QFN-Packaged Pulsed GaN Power Amplifiers
    This paper addresses thermal issues with using QFN-packaged GaN power amplifiers, originally designed. for pulsed operation, in CW mode. Consideration need to be made for component mounting to provide a low. thermal impedance path to the system heat sink for optimum operation and reliability, using
  • Thermal Pad Design and Process for Voiding Control at QFN Assembly
    Quad-flat no-leads (QFN) package designs are receiving more and more attention in the electronics industry. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I
  • Kelvin Testing
    that are to be measured. A further complication arises when accurate measurements are required in very small packages. Many analog functions are being packaged in MLF/QFN packages. These devices have pitches as low as 0.4mm and lead dimensions in the range of 0.5mm x 0.25mm. A bottom view of an MLF/QFN
  • LFPAK88 Takes a Shorter Path to Efficiency
    By eliminating internal bond wires and reducing source lead length, Nexperia's LFPAK88 minimizes parasitic source inductance created during switching, resulting in greater efficiency. While alternatives like leadless (QFN) packages or utilizing a Kelvin source connection can offer similar benefits
  • Broadcast FM Radio Tuner for Portable Applications
    measurement. Programmable de-emphasis (50/75 µs). Adaptive noise suppression. Volume control. Line-level analog output. 32.768 kHz reference clock. 2-wire and 3-wire control interface. 2.7 to 5.5 V supply voltage. Integrated LDO regulator allows direct connection to battery. 3 x 3 mm 20-pin QFN package
  • Void Reduction Strategy for Bottom Termination Components (BTC) Using Flux Coated Preforms
    As power density on semiconductors rises year-over-year, increased efficiency and reliability of Bottom Terminated Components (BTC) packages like QFN, LCS, QFP, and DPAK are becoming much more difficult to manage using traditional soldering techniques.

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