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Supplier: ASAP Semiconductor LLC
Description: EVALUATION MOD FOR CDCM7005-QFN Timing Clock Synchronizer - CDCM7005 QFN Package
- Category: Development Board
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Supplier: Ironwood Electronics, Inc.
Description: Many device specific package converters of all types have been lumped into this category.
- Output (Bottom) Side Package: DIP
- Features: Other
- Product Type: Package Adapters / Converters
- RoHS Compliant: RoHS Compliant
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Supplier: Accuris
Description: SON/QFN Package Pinouts Standardized for 1-, 2-, and 3-Bit Logic Functions
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Supplier: Texas Instruments
Description: High Brightness White LED Driver in 2mm x 2mm QFN Package 6-SOT-23 -40 to 85
- Input Voltage: 3 to 18 volts
- Output Voltage: 3 to 38 volts
- Efficiency: 90 %
- Number of Channels: 1 #
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Supplier: Texas Instruments
Description: 3-17V 3A Step-Down Converter in 3x3 QFN Package 16-QFN -40 to 85
- Regulated Output Voltage (Volt): 5 volts
- Output Current (IOUT): 3 amps
- Quiescent Current (IQ): 0.000017 amps
- Operating Temperature: -40 to 85 C
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Supplier: Texas Instruments
Description: 3?17V 2A Step-Down Converter in 3x3 QFN package 16-QFN -40 to 85
- Regulated Output Voltage (Volt): 5 volts
- Output Current (IOUT): 2 amps
- Quiescent Current (IQ): 0.000017 amps
- Operating Temperature: -40 to 85 C
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Supplier: Texas Instruments
Description: 3-17V 3A Step-Down Converter in 3x3 QFN Package 16-QFN -40 to 85
- Regulated Output Voltage (Volt): 3.3 volts
- Output Current (IOUT): 3 amps
- Quiescent Current (IQ): 0.000017 amps
- Operating Temperature: -40 to 85 C
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Supplier: ROHM Semiconductor GmbH
Description: BU22210MUV includes 10 channels D/A converters which is high performance 10bit R-2R-type. It is most suitable for applications which have many adjustment items, because it is small size and has many D/A converter channels. Input is serial data transfer system with the DI, CLK and CSB terminal, and
- Resolution: 10 bits
- Operating Temperature: -20 to 85 C
- Screening Level: Commercial
- Features: Other
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Supplier: Renesas Electronics Corporation
Description: and span style="text-decoration: overline"RE485/span pins together. The ISL33354E and ISL33357E also include a shutdown function, which disables the Tx and Rx outputs, disables the charge pumps and places the IC in a low current (55µA) mode. The ISL33357E is a QFN packaged device for space
- ESD: 15 kilovolts
- Package Type: QFN
- Technology: RS232, RS485
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Supplier: Wolfspeed
Description: Benefits Compact surface-mount package Essentially no switching losses Higher efficiency Reduction of heat-sink requirements Parallel devices without thermal runaway Features 600-volt Schottky rectifier Optimized for PFC boost diode application Zero-reverse-recovery current High-frequency
- IF: 3,000 mA
- VRRM: 600 volts
- Features: Other, Schottky Barrier Diodes
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Supplier: Skyworks Solutions, Inc.
Description: The SKY19243-686LF is a Quad Flat No-Lead (QFN) single-pole, double-throw (SPDT) switch designed for antenna tuning applications that require very low RON and COFF. Switching is controlled by an integrated GPIO interface with two control pins. Depending on the logic voltage level applied to
- Frequency Range: 100 to 3,800 MHz
- Features: Other
- Type: SPDT
- Package Type: Surface Mount
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Supplier: Renesas Electronics Corporation
Description: corresponding DE485 and span style="text-decoration: overline"RE485/span pins together. The ISL33334E and ISL33337E also include a shutdown function, which disables the Tx and Rx outputs, disables the charge pumps and places the IC in a low current (40µA) mode. The ISL33337E is a QFN packaged
- ESD: 15 kilovolts
- Package Type: QFN
- Technology: RS232, RS485
- Device Type: Transceiver
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Supplier: Plastronics Socket Company, Inc.
Description: the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package
- Current Rating: 0.05 amps
- Contact Resistance: 50 milliohms
- Operating Temperature: -55 to 150 C
- Number of Contacts: 84
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Supplier: Skyworks Solutions, Inc.
Description: Please note: SKY19256-701LF is being discontinued and is not recommended for new designs. The suggested replacement is SKY59272-707LF The SKY19256-701LF is a Quad Flat No-Lead (QFN) 4X singlepole, single-throw (4xSPST) switch designed for antenna tuning applications that require ultra-low ON
- Frequency Range: 600 to 6,000 MHz
- Features: Other
- Type: SPST
- Package Type: Surface Mount
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Supplier: Skyworks Solutions, Inc.
Description: Please note: SKY19247-686LF is being discontinued and is not recommended for new designs. The suggested replacement is SKY19245-686LF The SKY19247-686LF is a Quad Flat No-Lead (QFN) single-pole, triple-throw (SP3T) switch designed for antenna tuning applications that require very low RON and
- Frequency Range: 100 to 2,700 MHz
- Features: Other
- Package Type: Surface Mount
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Supplier: Qorvo
Description: Qorvo’s QPC2420 is an ultra-wide band SOI Single-Pole, Double–Throw (SPDT) reflective switch.
- Frequency Range: 20 to 30,000 MHz
- Insertion Loss: 1.5 dB
- Isolation (Port to Port): 40 dB
- Switching Speed: 0.00005 ms
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Supplier: Qorvo
Description: Qorvo’s QPC2320 is an ultra-wide band SOI Single-Pole, Double–Throw (SPDT) reflective switch.
- Frequency Range: 20 to 15,000 MHz
- Insertion Loss: 1 dB
- Isolation (Port to Port): 40 dB
- Switching Speed: 0.00005 ms
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Supplier: Ironwood Electronics, Inc.
Description: These patent pending QFN SMT Feet provide a reliable method for interconnecting to QFN pads. These high performance adapters have the same pad configuration as the QFN IC being emulated and a female socket array to which various adapters can be plugged.
- Number of Contacts: 8
- Features: Gold Plating, Other, SMT
- Product Type: IC Probing / Analysis Adapters
- Output (Bottom) Side Package: QFN
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Supplier: Plastronics Socket Company, Inc.
Description: the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package
- Current Rating: 0.05 amps
- Contact Resistance: 50 milliohms
- Operating Temperature: -55 to 150 C
- Number of Contacts: 84
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Supplier: Qorvo
Description: Qorvo’s QPC0045 is an ultra-wide band SOI 6-bit digital step attenuator (DSA). It operates over 0.01 to 48 GHz and provides 31.5 dB attenuation range with a LSB of 0.5 dB. It also achieves a low step error of less than 0.1 dB typical.
- Frequency Range: 0.01 to 48 GHz
- Attenuation: 31.5 dB
- Number of Bits (for Digital Attenuators): 6
- Insertion Loss: 4.8 dB
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include QFN. Search-friendly keywords include development board, programmer, evaluation kit, prototype, QFN, Development Board and Programmer, RF Development
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: SEMTECH NT22L31-QFN-TR TAPE & REEL 22L33 in QFN 4mm x 4mm 24 lead Product overview: NT22L31-QFN-TR from Semtech is a Power Management IC for power sequencing, voltage regulation, battery management, load control, and compact electronic system design. It is useful for engineers
- Features: Other
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: circuits. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include Buck, Boost, QFN. Search-friendly keywords include LED driver IC, constant current,
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Supplier: Accuris
Description: Environmental and endurance testing Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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Supplier: Win Source Electronics
Description: Manufacturer: STMicroelectronics Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 989377-STB6000QFN32 Categories: OEM Parts( S ) Alternative Parts (Cross-Reference): STB6000QFN32STB6000 QFN32; Popularity: Low Fake Threat In the Open Market: 35 pct.
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Supplier: Accuris
Description: Environmental and endurance testing \x96 Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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Supplier: Win Source Electronics
Description: Manufacturer: Microchip Technology Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 980328-DARR80-QFN Categories: OEM Parts(C-E) Popularity: Low Fake Threat In the Open Market: 42 pct. Supply and Demand Status: Shortage
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Supplier: Win Source Electronics
Description: Manufacturer: Cypress Semiconductor Corp Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1023568-CY3250-32QFN-FK Packaging: Bulk Mounting: SMD (SMT) Number of Pins: 32 Categories: Embedded Processors and Controllers Case / Package:
- Pin Count: 32 #
- Features: Other, RoHS Compliant
- Device Type: Storage Interface
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Supplier: Win Source Electronics
Description: Manufacturer: Dialog Semiconductor GmbH Win Source Part Number: 922202-IW3662-01-QFN5 Operating Temperature Range: -40°C ~ 150°C (TJ) Features: LED Driver IC 1 Output AC DC Offline Switcher Step-Down (Buck), Step-Up (Boost) PWM Dimming - 16-QFN (4x4) Package: 16-VQFN Exposed Pad
- Form Factor: Integrated Circuit (IC)
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include QFN. Search-friendly keywords include resistor, SMD, current sense, precision, termination, QFN, Chip Resistor(SMD). This listing supports clearer
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Supplier: Sensata Technologies
Description: 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy Optimal thermal contact for package e-pad Solutions
- Contact Resistance: 200 milliohms
- Operating Temperature: 150 C
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Description: This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for
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Featured Products Top
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industrial and electronic applications, ensuring reliability and industry acceptance. Balanced Supply and Demand: Stable availability reduces procurement risks for manufacturers and engineers. QFN Package: Offers compact, robust design for space (read more)
Browse IC Interfaces Datasheets for Win Source Electronics -
Current industry demands on size and performance require filters to be extremely small and capable of reliably operating at higher and higher frequencies. Marki Microwave’s newest GaAs MMIC filters feature low 1-2 dB passband insertion loss at center frequency and high frequency coverage currently up to 40 GHz in a compact 5x5mm QFN. (read more)
Browse RF Band Pass Filters Datasheets for Marki Microwave LLC -
their applications. LAN8720AI-CP • Low-power architecture with EEE support • Compact 24-QFN package (read more)
Browse Network and Communication Chips Datasheets for Win Source Electronics -
thermal performance, the SKY67180-306LF is rated for operation up to +105 °C. The SKY67180-306LF is provided in a 4 x 4 mm, 16-pin Quad Flat No-Lead (QFN) package. (read more)
Browse RF Amplifiers Datasheets for Skyworks Solutions, Inc. -
The family of RF GaN-on-SiC Ka-Band amplifiers covers power levels from 33 to 44 dBm, and are available in die or QFN-package formats. These devices are fabricated on the proprietary UMS GH15 GaN process, which is optimized up to 42 GHz, delivering high power, high PAE and high linearity, and making it ideal for transmitting modulated waveforms. (read more)
Browse RF Amplifiers Datasheets for Richardson RFPD -
For designers and engineers working with precision metal components, understanding the capabilities of photochemical machining (PCM) is crucial for leveraging its full potential. Whether you’re exploring PCM for the first time or looking for the best service providers, having the right resources at your fingertips can streamline the process. This blog post highlights key sou...
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Browse Electronic Packages and Lids Datasheets for Conard Corporation (The) -
applications. Application Coverage: QFN packages – fine pitch, high-density bonding. SOP / DIP / TSOP – stable performance across storage, communication & automotive applications. Camera (read more)
Browse Semiconductor Wire and Wedge Bonders Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
4510 is available in a low-cost, surface mount 28 lead 5x5mm QFN package and is ideally suited for Point-to-Point Radio, and K-Band VSAT Ground Terminal. (read more)
Browse RF Frequency Converters Datasheets for Qorvo -
Manchester interface for programming through single OUT pin Suite of diagnostics to allow for safety-critical systems fault detection QFN package with wWettable flanks enabling visual inspection of solder joints Learn More (read more)
Browse Pressure Sensor Chips Datasheets for Allegro MicroSystems Inc. -
in standby mode. The QPA9510 is tunable over any sub-bands in the operating range to optimize performance. The amplifiers sit in a 3mmx3mm compact QFN package. (read more)
Browse Amplifier and Comparator Chips Datasheets for Qorvo
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Thermal Pad Design and Process for Voiding Control at QFN Assembly
Quad-flat no-leads (QFN) package designs are receiving more and more attention in the electronics industry. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I
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Kelvin Testing
that are to be measured. A further complication arises when accurate measurements are required in very small packages. Many analog functions are being packaged in MLF/QFN packages. These devices have pitches as low as 0.4mm and lead dimensions in the range of 0.5mm x 0.25mm. A bottom view of an MLF/QFN
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LFPAK88 Takes a Shorter Path to Efficiency
By eliminating internal bond wires and reducing source lead length, Nexperia's LFPAK88 minimizes parasitic source inductance created during switching, resulting in greater efficiency. While alternatives like leadless (QFN) packages or utilizing a Kelvin source connection can offer similar benefits
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Broadcast FM Radio Tuner for Portable Applications
measurement. Programmable de-emphasis (50/75 µs). Adaptive noise suppression. Volume control. Line-level analog output. 32.768 kHz reference clock. 2-wire and 3-wire control interface. 2.7 to 5.5 V supply voltage. Integrated LDO regulator allows direct connection to battery. 3 x 3 mm 20-pin QFN package
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Indicates content that may require registration and/or purchase.
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Moisture Sensitivity of Plastic Packages of IC Devices
… 18, and 19 are dedicated to several case studies on moisture-induced fail- ures in a wide range of package types, such as QFP (quat flat package), QFN (quat flat no-lead), and D2Pak (Chapter 14), QFN package (Chapter 15), system-in …
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http://www.microsemi.com/document-portal/doc_download/130006-qfn-an
Assembly and PCB Layout Guidelines for QFN Packages .
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Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
The results in this paper show the emergence of a new prototype Embedded chip- QFN package with contact pads at 400µm pitch and a total number of 84I/Os with dimensions of 10mmx10mm.
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Electrical modeling of quad flat no-lead packages for high-frequency IC applications
In order to predict effectively the package characteristics, the QFN packages were modeled by three-dimensional electromagnetic numerical simulation according to the physical package structures of the real QFN packages.
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http://www.thescipub.com/pdf/10.3844/ajassp.2009.616.625
This study implies the results of FEA for simulating the actual QFN packaging process and the temperature step condition in the Infra Red (IR) reflow process.
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Implementation of chip embedding processes for the creation of miniaturized system-in-packages
The results in this paper show the emergence of a new prototype Embedded chip- QFN package with contact pads at 400llm pitch and a total number of 84110s with dimensions of IOmrnxlOmm.
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A high performance plastic air-cavity QFN solution for future potential microwave package large scale application
Structure of a novel and cost effective plastic air-cavity QFN package .