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Supplier: Ironwood Electronics, Inc.
Description: Many device specific package converters of all types have been lumped into this category.
- Product Type: Package Adapters / Converters
- RoHS Compliant: Yes
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Supplier: Plastronics Socket Company, Inc.
Description: - rapid response and turnaround Extensive catalog - easy purchase With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 amps
- Features: Open Top Socket
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Supplier: ASAP Semiconductor LLC
Description: EVALUATION MOD FOR CDCM7005-QFN Timing Clock Synchronizer - CDCM7005 QFN Package
- Category: Development Board
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Supplier: Plastronics Socket Company, Inc.
Description: With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 to 2.93 amps
- Features: Open Top Socket
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Supplier: Plastronics Socket Company, Inc.
Description: - rapid response and turnaround Extensive catalog - easy purchase With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 amps
- Features: Clamshell Socket
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Supplier: Renesas Electronics Corporation
Description: signal, simply by connecting the corresponding DE485 and span style="text-decorati on: overline"RE485/span pins together. The ISL33354E and ISL33357E also include a shutdown function, which disables the Tx and Rx outputs, disables the charge pumps and places the IC in a low current (55µA) mode. The
- IC Package Type: QFN
- Technology: RS232, RS485
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Supplier: Renesas Electronics Corporation
Description: signal, simply by connecting the corresponding DE485 and span style="text-decorati on: overline"RE485/span pins together. The ISL33334E and ISL33337E also include a shutdown function, which disables the Tx and Rx outputs, disables the charge pumps and places the IC in a low current (40µA) mode. The
- Device Type / Applications: Transceiver
- IC Package Type: QFN
- Technology: RS232, RS485
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Supplier: Sensata Technologies
Description: 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy Optimal thermal
- Contact Plating: Gold Plating
- Contact Resistance: 200 milliohms
- Operating Temperature: 150 C
- Product Type: IC Socket
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Supplier: Plastronics Socket Company, Inc.
Description: With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows
- Contact Resistance: 50 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 0.0500 to 2.93 amps
- Features: Clamshell Socket
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Supplier: Renesas Electronics Corporation
Description: the standby supply current to a 150nA trickle. Tiny 5mmx5mm bQuad Flat No-Lead/b (QFN) packaging and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions.brbr The ISL4221E is a 1 driver,
- Data Rate: 500 kbps
- Features: ESD Protected
- IC Package Type: QFN
- Supply Voltage: 2.7 V, Other
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Supplier: Renesas Electronics Corporation
Description: supply current to a 10nA trickle. Tiny 5mmx5mm Quad Flat No-Lead (QFN) packaging and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions.brbr The ISL4241E, ISL4243E's are 3 driver, 5
- Data Rate: 500 kbps
- Features: ESD Protected
- IC Package Type: QFN
- Supply Voltage: 2.7 V, Other
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Supplier: Ironwood Electronics, Inc.
Description: These patent pending QFN SMT Feet provide a reliable method for interconnecting to QFN pads. These high performance adapters have the same pad configuration as the QFN IC being emulated and a female socket array to which various adapters can be plugged.
- Product Type: IC Probing / Analysis Adapters
- RoHS Compliant: Yes
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Supplier: Texas Instruments
Description: 3?17V 2A Step-Down Converter in 3x3 QFN package 16-QFN -40 to 85
- IC Package Type: Other
- Operating Temperature: -40 to 85 C
- Output Current (IOUT): 2 amps
- Output Voltage Type: Fixed
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Supplier: Texas Instruments
Description: 3?17V 1A Step-Down Converter in 3x3 QFN package 16-QFN -40 to 85
- IC Package Type: Other
- Operating Temperature: -40 to 85 C
- Output Current (IOUT): 1 amps
- Output Voltage Type: Fixed
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Supplier: Texas Instruments
Description: 3-17V 3A Step-Down Converter in 3x3 QFN Package 16-QFN -40 to 85
- IC Package Type: Other
- Operating Temperature: -40 to 85 C
- Output Current (IOUT): 3 amps
- Output Voltage Type: Fixed
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Supplier: Texas Instruments
Description: 3?17V 1A Step-Down Converter in 3x3 QFN package 16-QFN -40 to 85
- IC Package Type: Other
- Operating Temperature: -40 to 85 C
- Output Current (IOUT): 1 amps
- Output Voltage Type: Fixed
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Supplier: ROHM Semiconductor GmbH
Description: BU22210MUV includes 10 channels D/A converters which is high performance 10bit R-2R-type. It is most suitable for applications which have many adjustment items, because it is small size and has many D/A converter channels. Input is serial data transfer system with the DI, CLK and CSB terminal, and
- IC Package Type: Other
- Interface Type: Other
- Operating Temperature: -20 to 85 C
- Packing Method: Tape Reel
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Supplier: Ironwood Electronics, Inc.
Description: {size:8.5in 11.0in; margin:1.0in 1.25in 1.0in 1.25in; mso-header-margin:.5 in; mso-footer-margin:.5 in; mso-paper-source:0;} div.Section1 {page:Section1;} --> These industry leading probing adapters for QFN/MLF allow probing connection to all pins of the chip. A high
- Features: Solderless, ZIF Lock
- Product Type: IC Probing / Analysis Adapters
- RoHS Compliant: Yes
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Supplier: Accuris
Description: SON/QFN Package Pinouts Standardized for 1-, 2-, and 3-Bit Logic Functions
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Supplier: ASAP Semiconductor LLC
Description: TARGET BOARD ZIF SKT MSP430 MCU MSP430 40-Pin Package Board
- Category: Development Board
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Supplier: Ironwood Electronics, Inc.
Description: We offer prototyping adapters for QFN from 8 to 100 pins and body sizes from 2X3mm to 12X12mm. They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold plated pins and short traces insure integrity in mechanical and electrical
- Product Type: Prototyping Adapters
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Supplier: Wolfspeed
Description: Benefits Compact surface-mount package Essentially no switching losses Higher efficiency Reduction of heat-sink requirements Parallel devices without thermal runaway Features 600-volt Schottky rectifier
- Diode Type: Schottky Barrier Diodes
- IF: 3000 mA
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Supplier: Win Source Electronics
Description: Manufacturer: STMicroelectronics Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 989377-STB6000QFN32 Categories: OEM Parts( S ) Alternative Parts (Cross-Reference): STB6000QFN32STB6000 QFN32; Popularity: Low Fake Threat In the
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Supplier: Win Source Electronics
Description: Manufacturer: ams Win Source Part Number: 911704-AS3820 QFN48 DB Features: AS3820 16, Non-Isolated Outputs LED Driver Evaluation Board Package: Bulk Part Status: Obsolete Categories: Development Boards ECCN: EAR99 Popularity: High Fake Threat In the Open Market
- Category: Development Board
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Supplier: Win Source Electronics
Description: Manufacturer: Dialog Semiconductor GmbH Win Source Part Number: 922202-IW3662-01-QFN 5 Operating Temperature Range: -40°C ~ 150°C (TJ) Features: LED Driver IC 1 Output AC DC Offline Switcher Step-Down (Buck), Step-Up (Boost) PWM Dimming - 16-QFN (4x4) Package: 16
- Form Factor: Integrated Circuit (IC)
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Supplier: Win Source Electronics
Description: Manufacturer: Cypress Semiconductor Corp Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1023568-CY3250-32QFN -FK Packaging: Bulk Mounting: SMD (SMT) Number of Pins: 32 Categories: Embedded Processors and Controllers
- Device Type / Applications: Storage Interface
- IC Package Type: Other
- Pin Count: 32 #
- RoHS Compliant: Yes
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Supplier: Broadcom Inc.
Description: used in such applications. The device is hardware configurable and/or software programmable, allowing users to tailor their port configurations and QoS operating characteristics to suit their application requirements. The PEX 8605 is offered in a 10x10mm 136-pin lead free (RoHS & Green) QFN
- Device Type: Packet Switching Fabric Chip
- IC Package Type: QFN
- Interface: PCI Express
- Pin Count: 4 #
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Supplier: Skyworks Solutions, Inc.
Description: The SKY19243-686LF is a Quad Flat No-Lead (QFN) single-pole, double-throw (SPDT) switch designed for antenna tuning applications that require very low RON and COFF. Switching is controlled by an integrated GPIO interface with two control pins. Depending on the logic voltage level applied to
- Actuator Type: SPDT, Other
- Frequency Range: 100 to 3800 MHz
- Package Type: Surface Mount, Other
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Description: This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for
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Supplier: Qorvo
Description: Qorvo’s QPC0045 is an ultra-wide band SOI 6-bit digital step attenuator (DSA). It operates over 0.01 to 48 GHz and provides 31.5 dB attenuation range with a LSB of 0.5 dB. It also achieves a low step error of less than 0.1 dB typical.
- Attenuation: 31.5 dB
- Digital Attenuator: Yes
- Frequency Range: 0.0100 to 48 GHz
- Insertion Loss: 4.8 dB
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Supplier: Littelfuse, Inc.
Description: The Q2L SIDACtor® series provides bidirectional transient voltage protection in a low profile, chip scale package. The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications such as DSLAMs, T1/E1/J1 cards, and other telecommunication equipment
- RoHS Compliant: Yes
- Thyristor Type: Silicon Controlled Rectifier (SCR), Sidac
Find Suppliers by Category Top
Featured Products Top
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industrial and electronic applications, ensuring reliability and industry acceptance. Balanced Supply and Demand: Stable availability reduces procurement risks for manufacturers and engineers. QFN Package: Offers compact, robust design for space (read more)
Browse IC Interfaces Datasheets for Win Source Electronics -
Current industry demands on size and performance require filters to be extremely small and capable of reliably operating at higher and higher frequencies. Marki Microwave’s newest GaAs MMIC filters feature low 1-2 dB passband insertion loss at center frequency and high frequency coverage currently up to 40 GHz in a compact 5x5mm QFN. (read more)
Browse RF Band Pass Filters Datasheets for Marki Microwave LLC -
their applications. LAN8720AI-CP • Low-power architecture with EEE support • Compact 24-QFN package (read more)
Browse Network and Communication Chips Datasheets for Win Source Electronics -
thermal performance, the SKY67180-306LF is rated for operation up to +105 °C. The SKY67180-306LF is provided in a 4 x 4 mm, 16-pin Quad Flat No-Lead (QFN) package. (read more)
Browse RF Amplifiers Datasheets for Skyworks Solutions, Inc. -
The family of RF GaN-on-SiC Ka-Band amplifiers covers power levels from 33 to 44 dBm, and are available in die or QFN-package formats. These devices are fabricated on the proprietary UMS GH15 GaN process, which is optimized up to 42 GHz, delivering high power, high PAE and high linearity, and making it ideal for transmitting modulated waveforms. (read more)
Browse RF Amplifiers Datasheets for Richardson RFPD -
For designers and engineers working with precision metal components, understanding the capabilities of photochemical machining (PCM) is crucial for leveraging its full potential. Whether you’re exploring PCM for the first time or looking for the best service providers, having the right resources at your fingertips can streamline the process. This blog post highlights key sou...
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Browse Electronic Packages and Lids Datasheets for Conard Corporation (The) -
applications. Application Coverage: QFN packages – fine pitch, high-density bonding. SOP / DIP / TSOP – stable performance across storage, communication & automotive applications. Camera (read more)
Browse Semiconductor Wire and Wedge Bonders Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
4510 is available in a low-cost, surface mount 28 lead 5x5mm QFN package and is ideally suited for Point-to-Point Radio, and K-Band VSAT Ground Terminal. (read more)
Browse RF Frequency Converters Datasheets for Qorvo -
Manchester interface for programming through single OUT pin Suite of diagnostics to allow for safety-critical systems fault detection QFN package with wWettable flanks enabling visual inspection of solder joints Learn More (read more)
Browse Pressure Sensor Chips Datasheets for Allegro MicroSystems Inc. -
in standby mode. The QPA9510 is tunable over any sub-bands in the operating range to optimize performance. The amplifiers sit in a 3mmx3mm compact QFN package. (read more)
Browse Amplifier and Comparator Chips Datasheets for Qorvo
Conduct Research Top
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Thermal Pad Design and Process for Voiding Control at QFN Assembly
Quad-flat no-leads (QFN) package designs are receiving more and more attention in the electronics industry. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I
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Kelvin Testing
that are to be measured. A further complication arises when accurate measurements are required in very small packages. Many analog functions are being packaged in MLF/QFN packages. These devices have pitches as low as 0.4mm and lead dimensions in the range of 0.5mm x 0.25mm. A bottom view of an MLF/QFN
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LFPAK88 Takes a Shorter Path to Efficiency
By eliminating internal bond wires and reducing source lead length, Nexperia's LFPAK88 minimizes parasitic source inductance created during switching, resulting in greater efficiency. While alternatives like leadless (QFN) packages or utilizing a Kelvin source connection can offer similar benefits
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Broadcast FM Radio Tuner for Portable Applications
measurement. Programmable de-emphasis (50/75 µs). Adaptive noise suppression. Volume control. Line-level analog output. 32.768 kHz reference clock. 2-wire and 3-wire control interface. 2.7 to 5.5 V supply voltage. Integrated LDO regulator allows direct connection to battery. 3 x 3 mm 20-pin QFN package
More Information Top
Indicates content that may require registration and/or purchase.
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Moisture Sensitivity of Plastic Packages of IC Devices
… 18, and 19 are dedicated to several case studies on moisture-induced fail- ures in a wide range of package types, such as QFP (quat flat package), QFN (quat flat no-lead), and D2Pak (Chapter 14), QFN package (Chapter 15), system-in …
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http://www.microsemi.com/document-portal/doc_download/130006-qfn-an
Assembly and PCB Layout Guidelines for QFN Packages .
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Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
The results in this paper show the emergence of a new prototype Embedded chip- QFN package with contact pads at 400µm pitch and a total number of 84I/Os with dimensions of 10mmx10mm.
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Electrical modeling of quad flat no-lead packages for high-frequency IC applications
In order to predict effectively the package characteristics, the QFN packages were modeled by three-dimensional electromagnetic numerical simulation according to the physical package structures of the real QFN packages.
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http://www.thescipub.com/pdf/10.3844/ajassp.2009.616.625
This study implies the results of FEA for simulating the actual QFN packaging process and the temperature step condition in the Infra Red (IR) reflow process.
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Implementation of chip embedding processes for the creation of miniaturized system-in-packages
The results in this paper show the emergence of a new prototype Embedded chip- QFN package with contact pads at 400llm pitch and a total number of 84110s with dimensions of IOmrnxlOmm.
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A high performance plastic air-cavity QFN solution for future potential microwave package large scale application
Structure of a novel and cost effective plastic air-cavity QFN package .