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Supplier: Accuratus Corporation
Description: Accuratus maintains an inventory of standard aluminum nitride substrates for fast delivery requirements. They are stocked in industry standard thicknesses of .025 inches and .040 inches. We will be happy to provide a quotation. Call us at 908-213-7070 or fax your requirement to 908-213-7069.
- Applications: Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 4.5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9 #
- Dielectric Strength: 1.70E7 V/m
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Description: Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6" aluminum nitride wafers and 8" AlN wafer substrates . AlN Wafers can be produced in various thicknesses from 0.125mm to 1mm with polished or lapped sides, customized sizes or
- Applications: Other
- Performance Features: Specialty / Other
- Shape / Form: Wafer / Substrate
- Specialty Ceramic Type: Aluminum Nitride
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Description: Alumina substrate, also known as aluminum oxide substrate or ceramic substrate, is primarily composed of aluminum oxide (Al2O3). The excellent electrical, thermal, and mechanical characteristics of alumina, a well-known ceramic material, lead to its selection. The manufacturing
- Applications: Corrosion Protection, Electrical / HV Parts, Electronics / RF-Microwave
- Density: 3.7 g/cc
- Material Type: Alumina / Aluminum Oxide, Silicon Carbide
- Max Use / Curie Temperature: 1500 to 1650 C
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Supplier: Knowles Precision Devices
Description: High-K substrates are used for circuit miniaturization. DLI offers complete fabrication services!
- Applications: Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 0.5500 to 10.1 µm/m-C
- Length: 1 to 4 inch
- Material Type: Alumina / Aluminum Oxide, Aluminum Nitride, Quartz, Silica / Silicate Materials
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Supplier: Polyflon Company - a Crane Co. Company
Description: Polyflon has taken advantage of the qualities of PTFE and coupled them with a proprietary plating process to produce a microwave substrate whose electrical performance cannot be equaled by any other substrate at this time.
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Supplier: CoorsTek
Description: systems, such as: Altimeters L1 and L2 GPS RF Communications (UHF/VHF) Traffic Avoidance Collision Systems (TCAS) Broadband WiFi Ceramic Components for Antennas, RF, & Microwave Metallized Antenna Components
- Materials of Construction: Specialty / Other
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Description: DPC ceramic substrates are typically composed of aluminium nitride or alumina ceramic materials, to which a copper layer is directly bonded on one or both sides. DPC ceramic substrates are frequently used in applications like electronic packaging and power electronics because they are
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Material Type: Aluminum Nitride, Specialty Ceramic
- Performance Features: Metallized / Silvered
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Description: Unipretec offers 99.6% alumina substrates. This high purity alumina substrate exhibits excellent physical, chemical, and mechanical properties, including exceptional insulating properties, high thermal conductivity, low dielectric constant, low dielectric loss, high flexural strength,
- Applications: Chemical / Materials Processing, Corrosion Protection, Electrical / HV Parts, Electronics / RF-Microwave
- Density: 3.9 to 3.95 g/cc
- Material Type: Alumina / Aluminum Oxide
- Max Use / Curie Temperature: 1500 to 1650 C
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Supplier: CoorsTek
Description: Ceramic print head substrates provide reliable long-life print performance for high-resolution printers. CoorsTek provides custom engineered components and precision assemblies for a wide variety of computer peripheral and data storage electronics. Advanced technical ceramics provide high
- Applications: Electronics / RF-Microwave, Other
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Description: AlN substrate possesses a wide range of superior physical properties, including high breakdown electric field strength, thermal conductivity, resistivity, and so forth. In fields like LED packaging, power modules, wafer bonding, power resistors, and metalized substrates (such as thin
- Applications: Chemical / Materials Processing, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperatures
- Material Type: Aluminum Nitride
- Performance Features: Sintered / Fired
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Description: 300?) guarantee the quality of ceramic and the metallized layer, also reduce the cost. Direct Plated Copper Substrate Applications:- High Power LED Packaging- Hybrid and electric automobile power management electronics- RF microwave communication- Substrates for solar
- Applications: Other
- Material Type: Specialty Ceramic
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Supplier: 3X Ceramic Parts Company Limited
Description: Alumina Ceramic Substrate Description Alumina Ceramic Substrate is a new type of precision thermal conductive ceramic chip, industrial thermal conductive ceramic chip and functional thermal conductive ceramic chip product. Due to the high cost of raw materials and the particularity of
- Applications: Electronics / RF-Microwave
- Density: 3.6 to 3.9 g/cc
- Material Type: Alumina / Aluminum Oxide
- Shape / Form: Bar Stock, Fabricated / Custom Shape, Rod Stock
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Supplier: APITech
Description: 2 to 40 GHz Ideal for broadband multiplexing Chebyshev and elliptic response Well suited for high shock and vibration applications Highly repeatable (ideal for matched filters) Broadband receivers Easily integrated with other components Design a Filter
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Supplier: Samsung Electro-Mechanics
Description: Features of Products (Technology) Can realize small packages and low costs as multiple ICs and passive components are integrated into one module. Small body RF-SiP substrate Small body RF-SiP substrate Can realize ultrasmall substrates for communication module
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Supplier: LG Chemical of America Inc.
Description: LCD Glass Substrate A key material for TFT-LCD LCD glass substrate is a thin glass board on which a thin circuit is deposited with precision. It is a key material for LCD. Ever since LG Chem ventured into the LCD market in 2009, it has remained fully committed to relentless research
- Applications: Electronics / RF-Microwave
- Shape / Form: Plate
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Supplier: CoorsTek
Description: CoorsTek is the leader in custom and standard thin-film ceramic substrates. Four thin-film substrate material options combine smooth surface finish, strong flexural strength, and consistent electrical properties. Contact CoorsTek to help you design a specific thin-film substrate
- Applications: Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 7 to 8.2 µm/m-C
- MOR / Flexural Strength: 89923 psi
- Material Type: Alumina / Aluminum Oxide
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Supplier: Anatech Electronics, Inc.
Description: 19500 MHz Suspended Substrate Low Pass Filter
- Connector Type: SMA, Other
- Frequency (Fc): 19500 MHz
- Package Type: Connectorized
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Supplier: Anatech Electronics, Inc.
Description: 12000 MHz Suspended Substrate Low pass filter
- Connector Type: Type N, Other
- Insertion Loss: 1 dB
- Package Type: Connectorized
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Supplier: CoorsTek
Description: CoorsTek is the leader in custom and standard thin-film ceramic substrates. Four thin-film substrate material options combine smooth surface finish, strong flexural strength, and consistent electrical properties. Contact CoorsTek to help you design a specific thin-film substrate
- Applications: Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 7 to 8.3 µm/m-C
- MOR / Flexural Strength: 85862 psi
- Material Type: Alumina / Aluminum Oxide
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Supplier: Anatech Electronics, Inc.
Description: 4.8 GHz Suspended Substrate High Pass Filter
- Connector Type: SMA, Other
- Frequency (Fc): 4800 MHz
- Insertion Loss: 1 dB
- Package Type: Connectorized
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Supplier: Anatech Electronics, Inc.
Description: 18 GHz – 40 GHz Suspended Substrate High Pass Filter
- Connector Type: Other
- Frequency (Fc): 18000 MHz
- Insertion Loss: 2 dB
- Package Type: Connectorized, Other
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Supplier: Kyocera Corporation
Description: The most widely used and best-known fine ceramic material. Good mechanical strength, electrical insulation, high-frequency loss, thermal conductivity, and resistance to heat, wear and corrosion. Sapphire is single-crystal alumina.
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 7.8 µm/m-C
- Hollow Stock / Shape: Yes
- Material Type: Alumina / Aluminum Oxide
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Supplier: Kyocera Corporation
Description: Sapphire is single-crystal alumina, a transparent material with excellent chemical stability and valuable mechanical, thermal and optical properties. Its material properties are vastly superior to glass, quartz and other mass-produced transparent materials.
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 7 to 7.7 µm/m-C
- Dielectric Constant (Relative Permittivity): 9.3 to 11.5 #
- Dielectric Strength: 4.80E7 V/m
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Description: -of-the-art area of fully-integrated wireless sensor modules on organic substrates and show the first ever 2D sensor integration with an RFID tag module on paper, as well as the possibility of 3D multilayer paper-based RF/microwave structures. Table of Contents: Radio Frequency
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Supplier: Hitachi High Technologies America, Inc.
Description: High Precise & Fine Patterning Technology for Al2O3 and AlN Substrate High Grade Al2O3 Substrate
- Applications: Electronics / RF-Microwave
- Shape / Form: Wafer / Substrate
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Supplier: Monocrystal, Inc.
Description: performance characteristics and a favorable price/quality ratio; also, it is considerably widely used. Among new and interesting applications of sapphire, it is worth mentioning the application of sapphire substrates in the production of blue semi-conductive lasers for systems requiring high
- Applications: Electronics / RF-Microwave
- Material Type: Sapphire
- Shape / Form: Wafer Carrier / Holder
- Thickness / Wall Thickness: 0.0059 to 0.0394 inch
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Supplier: 3M Advanced Materials Division
Description: Heavy-duty diesel engines. Jet engine igniters. Oil wells thousands of feet underground. When extreme conditions like these push equipment to its limits, 3M™ Silicon Nitride industrial ceramics deliver high performance where other materials fail. 3M silicon nitride is 60% lighter than steel but
- Applications: Electronics / RF-Microwave, Other
- Hollow Stock / Shape: Yes
- Material Type: Silicon Nitride
- Shape / Form: Fabricated / Custom Shape, Tube Stock
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Supplier: Kyocera Corporation
Description: Silicon nitride is optimal for engine parts due to its toughness at high temperatures, superior thermal shock resistance, light weight and corrosion resistance.
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 2.6 to 3.3 µm/m-C
- Dielectric Constant (Relative Permittivity): 9.6 #
- Dielectric Strength: 1.00E7 to 1.30E7 V/m
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Supplier: Kyocera Corporation
Description: The strongest and toughest of all fine ceramic materials, it is used to make scissors and knives which products once considered impossible to make from ceramic. Single-crystal zirconia is also prized as a jewel, as its refractive index creates a diamond-like-brightn ess.
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 10 to 11.4 µm/m-C
- Dielectric Strength: 2.80E7 to 3.30E7 V/m
- Electrical Resistivity: 1000 to 1.00E14 ohm-cm
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Supplier: San Jose Delta Associates, Inc.
Description: San Jose Delta maintains an in-house inventory of most grades of alumina ceramics as BARS-RODS-TUBES and SHEETS. The availability of fired “grinding stock” ceramic makes the production of small quantity and prototype orders less costly and offers shorter lead-times. For larger production quantity
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 7.9 µm/m-C
- Dielectric Constant (Relative Permittivity): 8.6 #
- Dielectric Strength: 223 to 350 V/m
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator. Macor is
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
- Dielectric Strength: 6.24E7 V/m
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator. Macor is
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
- Dielectric Strength: 6.24E7 V/m
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator. Macor is
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
- Dielectric Strength: 6.24E7 V/m
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Supplier: Materion Corporation
Description: Materion Ceramics has the capabilities to manufacture complex and custom designs by the addition of a variety of machining functions. Input material used for customized products can be dry pressed, isopressed or extruded in form and consist of Materion Ceramics' Thermalox 99.5% material.
- Applications: Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 16.2 µm/m-C
- Dielectric Constant (Relative Permittivity): 6.7 #
- Material Type: Beryllia / Beryllium Oxide
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Supplier: Materion Corporation
Description: Materion Ceramics has the capabilities to manufacture complex and custom designs by the addition of a variety of machining functions. Input material used for customized products can be dry pressed, isopressed or extruded in form.
- Applications: Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 16.2 µm/m-C
- Dielectric Constant (Relative Permittivity): 6.7 #
- Material Type: Beryllia / Beryllium Oxide
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Supplier: Materion Corporation
Description: Materion Ceramics has the capabilities to manufacture complex and custom designs by the addition of a variety of machining functions. Input material used for customized products can be dry pressed, isopressed or extruded in form and consist of Materion Ceramics' BW1000 "high strength" material.
- Applications: Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 16.2 µm/m-C
- Dielectric Constant (Relative Permittivity): 6.7 #
- Material Type: Beryllia / Beryllium Oxide
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Supplier: DigiKey
Description: PRINTED-SUBSTRATE
- Amplifier Type: Low Noise Amplifier, Power Amplifier
- Frequency Range: 40 to 1000 MHz
- Maximum Operating Voltage: 24 volts
- Minimum Operating Voltage: 24 volts
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Supplier: Accuratus Corporation
Description: Accuratus maintains an inventory of standard extruded and cast aluminum oxide, mullite and sialon shapes for fast delivery requirements. These are low cost, quality rods and tubes that can be quickly cut to precision lengths. (See Mullite Sizes, Aluminum Oxide Sizes and Sialon Sizes). Accuratus will
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Bore Diameter (I.D.): 0.5000 inch
- Coeff. of Thermal Expansion (CTE): 8.1 to 8.4 µm/m-C
- Dielectric Constant (Relative Permittivity): 9 to 9.8 #
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Supplier: Accuratus Corporation
Description: Accuratus maintains an inventory of standard extruded and cast aluminum oxide, mullite and sialon shapes for fast delivery requirements. These are low cost, quality rods and tubes that can be quickly cut to precision lengths. (See Mullite Sizes, Aluminum Oxide Sizes and Sialon Sizes). Accuratus will
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Bore Diameter (I.D.): 0.1260 inch
- Coeff. of Thermal Expansion (CTE): 8.1 to 8.4 µm/m-C
- Dielectric Constant (Relative Permittivity): 9 to 9.8 #
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Supplier: Accuratus Corporation
Description: Accuratus maintains an inventory of standard extruded and cast aluminum oxide, mullite and sialon shapes for fast delivery requirements. These are low cost, quality rods and tubes that can be quickly cut to precision lengths. (See Mullite Sizes, Aluminum Oxide Sizes and Sialon Sizes). Accuratus will
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Coeff. of Thermal Expansion (CTE): 8.1 to 8.4 µm/m-C
- Dielectric Constant (Relative Permittivity): 9 to 9.8 #
- Dielectric Strength: 14.6 to 1.69E7 V/m
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Supplier: Superior Technical Ceramics Corp.
Description: Sharp edges at the ends may be broken to prevent chipping. Thread may be countersunk a maximum of 1/16" deep to prevent chipping. .006"/ inch max camber allowance. Threads must accept a Class 1 metal screw to the above minimum thread depth. Threads will be perpendicular within 2 degrees of ends or
- Applications: Electrical / HV Parts, Electronics / RF-Microwave
- Length: 0.5000 inch
- Material Type: Alumina / Aluminum Oxide
- Shape / Form: Ferrule / Eyelet, Rod Stock
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: is etched into the copper and located in the substrate. It also provides a very short impedance path for the charge to the device from directly beneath it. Examples: Memory module substrates, Folded Stacked Die packages, CA TV Filters, Power modules, Chip package substrates,
- Features: Dielectric / Insulating
- Thickness: 6.30E-4 to 9.84E-4 inches
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: capacitor with its vias, pad, and traces. By using Faradflex the device is etched into the copper and located in the substrate. It also provides a very short impedance path for the charge to the device from directly beneath it. Examples: Memory module substrates, Folded Stacked Die
- Electrical Resistivity: 1.20E13 to 1.90E13 ohm-cm
- Features: Dielectric / Insulating
- Thickness: 3.15E-4 to 4.72E-4 inches
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Supplier: FX PCB Co., Ltd.
Description: Description What is Transparent Glass PCB? As we know it is normal for designers to use Fr4 (fiberglass-reinforc ed epoxy) or other materials for their printed circuit board(PCB), with the requirements on the PCB substrate of flatness, transparent, deformation, heat
- Materials of Construction: Specialty / Other
- Thickness: 0.0197 to 0.1575 inches
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Supplier: FX PCB Co., Ltd.
Description: Description Rogers PCB Introduction-2024 Rogers PCB is mostly used in high-frequency and high-power applications such as RF and microwave. the Rogers material normally has the advantages of low dielectric loss, stable dielectric constant, high thermal conductivity, thermal
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Supplier: MACOM
Description: MACOMs Mounting Capacitors are designed for transient protection for MICs and FETs. Since the capacitor substrate is silicon, it provides an optimum match both thermally and mechanically with the device to be mounted. A wide range of sizes and capacitance values are available as standard
- Applications: High Frequency, RF / Microwave Capacitors
- Capacitance Range: 5.00E-6 to 0.0036 microF
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Supplier: Richardson RFPD
Description: The ADRF5424 is a reflective, single-pole double-throw (SPDT)switch manufactured in a silicon process attached on a galliumarsenide (GaAs) carrier substrate. The substrate incorporates thebond pads for chip and wire assembly, and the bottom of the deviceis metalized, connected to
- Actuator Type: SPDT, Other
- Frequency Range: 100 to 60000 MHz
- Insertion Loss: 1.3 dB
- Isolation (Port to Port): 35 dB
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Supplier: Richardson RFPD
Description: many broadband wireless applications. No blocking capacitors are required if DC voltage is not present on the RF ports. The PE42522 is manufactured on Peregrine’s UltraCMOS® process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate.
- Actuator Type: SPDT, Other
- Frequency Range: 0.0090 to 26500 MHz
- Insertion Loss: 2.55 dB
- Isolation (Port to Port): 42 dB
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Supplier: Richardson RFPD
Description: mode. No blocking capacitors are required if DC voltage is not present on the RF ports. The PE42850 is manufactured on Peregrine’s UltraCMOS® process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the
- Actuator Type: Other
- Frequency Range: 30 to 1000 MHz
- Insertion Loss: 0.5000 dB
- Isolation (Port to Port): 30 dB
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Supplier: Richardson RFPD
Description: The MASW-011029 is a W-Band SP3T Switch manufactured using MACOM’s patented AlGaAs PIN Diode MMIC process, on a semi-insulating GaAs substrate. The device is fully passivated with silicon nitride and has an additional layer of BCB for scratch protection. This protective coating prevents
- Actuator Type: Other
- Frequency Range: 75000 to 100000 MHz
- Insertion Loss: 1.3 dB
- Isolation (Port to Port): 33 dB
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Rogers PCB is mostly used in high-frequency and high-power applications such as RF and microwave. the Rogers material normally has the advantages of low dielectric loss, stable dielectric constant, high thermal conductivity, thermal stability, etc. That’s why there are so many (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
product requirements. Increasing the layer numbers can provide more signal channels and electrical performance, and it can make them ideal for high-speed digital circuits and complex RF applications. Multilayer PCB applications and (read more)
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temperatures. The high signal loss at high frequencies makes it not suitable for 5G/RF applications. 3, Transparent Glass PCB It is a new material for the PCB, using glass as the PCB substrate instead of traditional materials like FR4 or (read more)
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substrates are particularly valued in: Power Electronics: The high thermal conductivity and electrical insulation of AIN substrates are crucial in power electronic devices, where efficient heat dissipation and electrical isolation are required. RF and Microwave Devices: AIN’s low (read more)
Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
In high-frequency applications, including microwave and RF circuits, ceramic substrates are used to maintain signal integrity and reduce signal loss. Their low dielectric constant and low loss tangent are crucial for minimizing signal attenuation and ensuring high performance in (read more)
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surface finish possibilities, board thickness considerations, wide ranges of reliability requirements, and even substrate-material choices. In addition, RF/microwave designs can require special manufacturing equipment. Fortunately, Summit has made significant investments in the equipment and field (read more)
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designed for applications in harsh environments. Planar X Series provides system engineers with a high performance, compact solution for critical RF filtering in X band. The Planar X Series leverages thin film process technology on various substrates which are (read more)
Browse RF Low Pass Filters Datasheets for Molex Signal Tech Industrial Ltd. -
of military and commercial aircraft, weapon systems, some U.S. Navy ships and NASA’s Space Shuttle fleet. Photochemical etching is a very effective solution for producing heat transfer and dissipation components that are used in applications including LED lighting, chilling systems, RF (read more)
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environment. EES are a class of passive metasurfaces that enhance wireless coverage at microwave and millimeter-wave frequencies via printed conductive patterns on substrates such as plastic or glass. When placed on a wall, window, or other structure, the scattering properties of (read more)
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Conduct Research Top
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Comparison of RF Terminations with BeO and ALN Substrates
Terminations designed to dissipate significant amounts of power at RF frequencies have traditionally been fabricated on beryllium oxide (BeO) substrates. The high thermal conductivity and moderate dielectric constant make BeO an ideal choice for this application. Increased regulation regarding
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PTFE Microwave Substrates For Automotive Applications
With PTFE's low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF Microwave industry to design and develop lower-cost PCB substrates for the requirements of an ever
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RF Power: GaN Moves In for the Kill
Is gallium nitride (GaN) the wide bandgap material that will turn RF power generation on its head and relegate gallium arsenide (GaAs) and LDMOS (Laterally Diffused Metal Oxide Semiconductor) to the annals of history? Well you'd certainly think so, based on articles in the trade press, symposium
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How PTFE Can Compete With The Best In Thermosets
With PTFE's low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established. The growth in wireless-technology has by extension, driven the RF Microwave industry to design and develop lower-cost PCB substrates for the requirements of an ever
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RFID Battles the Elements
By Paul Thomas, Managing Editor Understanding how the elements might impact RF signals takes a bit of black magic, since little hard data exists, notes Bert Moore of IDAT Consulting (Atlanta). Often, the product is the problem. Geritol, he says, is not RF-friendly because of its high iron
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Metrigraphics Article in Today's Medical Developments
. Then an electrolytic bath is used to deposit electroplatable metal onto a photographically-produced conductive patterned surface. Once the plating material has been built up - plated-up - to the desired thickness, the electroformed part is stripped away from the master substrate, yielding high-quality
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RF and Microwave Microelectronics Packaging
RF Substrate Materials Thermal and Electrical Properties . . . .
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Substrate Noise Coupling in RFICs
The flow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the floor planning, circuit design and validation phases.
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http://dspace.mit.edu/bitstream/handle/1721.1/87329/52060481-MIT.pdf?sequence=2
This research showed that the primary advantage of SOI in RF power applica- tions was the reduction of RF substrate loss due to the presence of the buried oxide.
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The effect of low frequency pulse-shaped substrate bias on the remote plasma deposition of a-Si : H thin films
We have applied both sinusoidal and pulse-shaped rf substrate biasing techniques to the expanding thermal plasma deposition of hydrogenated amorphous silicon.
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RF Performance of SOI CMOS Technology on Commercial 200-mm Enhanced Signal Integrity High Resistivity SOI Substrate
Due to their higher sensitivity to substrate effects at the SiO2/Si interface, CPW structures were built to investigate the RF substrate losses, true effective resistivity, and nonlinear behavior of both the eSI and HR-SOI substrates.
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Physics of Semiconductor Devices
The RF substrate bias power supply is concurrently switched on.
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Springer Handbook of Electronic and Photonic Materials
1278 55.6.1 RF Substrate Materials ...............
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http://dspace.mit.edu/bitstream/handle/1721.1/38922/164876342-MIT.pdf?sequence=2
High-resistivity polycrystalline silicon as RF substrate in wafer- level packaging.
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A Study on the Tuned Bias of Substrate in an Inductively-Coupled Plasma Source
Fig.6 Variation of tuned rf substrate DC bias volt- . age V,, with variable capacitance in the grounded upper . cover case. .
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Dynamic potential formation of a rf sheath near the substrate in a dc discharge plasma
Here, we restrict ourselves to the sheath structure of the rf substrate in the absence of supplementary ionization, unlike the conventional rf electrode producing the plasma. .