Products & Services
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Supplier: JST Manufacturing, Inc.
Description: The unit is programmed for mechanical agitation. During this agitation cycle, the stripping solvent is recirculated through the reservoir where it is filtered and returned to the agitation bath. This continual filtration prevents redeposition of the metals onto the wafers. A removeable filter
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Supplier: Technic, Inc.
Description: unloading port located at the same end of the tool as the loading port. The unloading port also has a sliding drawer mechanism to allow easy unloading of the cassette from the tool. The tool may be configured with darkened outside inspection panels for light sensitive junction
- Machinery Type: Automated System
- Process / Technology: Electroplating
- Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
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Supplier: Cosmic Equipment SpA
Description: enables efficient test-program creation and debug through features such as waveform capture, automated data-sheet generation, schmoo plotting, and parameter-analysis tools. Together, this combination of multi-site performance, adaptable hardware, and intuitive software creates a test solution
- Component / Product Tested: Active Components / Semiconductors
- Type / Form: Measure Unit / Monitor, Test Platform / System
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Supplier: Fluoro-Plastics, Inc.
Description: Because of its unique molecular structure, granular PTFE does not melt. It cannot be molded into complex forms like other plastics. However, it is easily machined on all standard equipment, including the most advanced CNC machining equipment. PTFE can be cut, bored, milled and turned using standard
- Function: Abrasion / Sliding Wear
- Liner Materials: Fluoropolymer
- Features: Other
- Industry / Application: Plastic
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice
- Applied Thickness / Gap Fill: 0.01968505 to 0.393701 inch
- Use Temperature: -76 to 392 F
- Thermal Conductivity: 3.2 W/m-K
- Tensile Strength (Break): 63.81620931716668 psi
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Supplier: Materion Corporation
Description: BrushBronze EQX20 is a fine-grained copper, anode alloy that was developed specifically for the emerging interconnect plating needs of the semiconductor industry. By applying our EquaCast process to produce an extremely uniform, fine grained microstructure of this unique phosphorous
- Shape / Form: Bar Stock, Rod / Round Bar Stock, Semi-finished Shape / Mill Stock, Strip
- Features: Cast (Continuous, Centrifugal, etc.), Leaded / Free Machining, Non-ferrous - Any Type
- Nonferrous: Copper, Brass or Bronze Alloy (UNS C), Nickel / Nickel Alloy (UNS N)
- Applications: Electrical / HV Parts, Wear Parts / Tooling
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Supplier: Infineon Technologies AG
Description: Synchronous rectification for AC-DC SMPS Motor control for 48 V–80 V systems (i.e. domestic vehicles, power-tools, trucks) Isolated DC-DC converters (telecom and datacom systems Or-ing switches and circuit breakers in 48 V systems Class D audio amplifiers Uninterruptable power supplies (UPS)
- rDS(on): 0.0045 ohms
- TJ: -55 to 175 C
- VGS(off): 2 to 3.5 volts
- Features: MOSFET, Other, Power MOSFET
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Supplier: Infineon Technologies AG
Description: ratio Attractive price position for high performance technology Potential Applications Consumer applications charger Adapter TV power supply Lighting Applications Cordless power tools and outdoor power equipment Industrial automation LED strips and signage
- rDS(on): 0.36 ohms
- QG: 16.4 nC
- TJ: -40 to 150 C
- VGS(off): 2.5 to 3.5 volts
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Supplier: Wisconsin Foam Products, Inc.
Description: foam or other materials • Die cutting • Water jet cutting - low tooling cost & low concavity • Convoluting • Closed cell splitting and slitting - F & K Machinery • Wire cutting - vertical slitting - Baumer Equipment • Part stripping • Compression cutting, special shape cutting and much more.
- Industry / Application: Aerospace / Avionics, Agriculture / Forestry, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Marine, Medical / Health Care, Military / Defense
- Services: Design / Development, High Volume Production, Just-in-Time Delivery, Low Volume Production, Packaging
- Capabilities: Foam Fabrication
- Features: Midwest US Only, North America, United States Only
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Supplier: General Magnaplate Corporation
Description: diagnostics, pharmaceuticals, aerospace, semiconductors and many more. Please see the industries section of our site for more details on the typical applications we process on a daily basis. The technical team at General Magnaplate works alongside manufacturers to solve wear, corrosion, and
- Material: Aluminum, Metal, Titanium
- Capabilities: Anodizing, Chemical Finish / Conversion, Hard Coat Anodizing, Passivation
- Services: Buffing / Polishing, Burn-off / Thermal Cleaning, Degreasing, New / OEM Parts, Scrub Tank / Immersion Washing, Stripping / Coating Removal, Ultrasonic Cleaning
- Features: Canada Only, East Asia / Pacific Only, Europe Only, North America, Northeast US Only, Southern US Only, Southwest US Only, United States Only
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Supplier: Titan Tool Supply, Inc.
Description: Micrometers are available as separate options. The size of the TM-10 stage is 5.375" X 9.00". For holding small steel stampings, cutting tools, shafts and irregular shaped parts, may we recommend our Miniature Magnetic V Block No. 2076, or Large Magnetic V Block Model MV-50 or Magnetic
- Total Magnification: 10 to 400 X
- Grade: Benchtop
- Application: Measuring / Toolmaker
- Features: Mechanical Stage, Monocular
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Supplier: ValueTronics International, Inc.
Description: The BSA7500B is an analyzer from SyntheSys Research. Analyzers are key tools to test electronic equipment in the engineering, medical, automotive, and technological industries. Use analyzers for monitoring the performances of many different types of electronic devices. You may need analyzers
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safety practices to extend the lifespan of your tools, whether you’re using a valve wrench, (read more)
Browse Hand Tools Datasheets for Lowell Corporation -
particle contamination. Its low erosion rate reduces process tool cost of ownership. Perlast G65HP is ideal for use in wet and dry semiconductor processes including: Plasma Etching Ash/Resist Stripping LPCVD, HDPCVD, PECVD, SACVD, ALD Cleaning PVD Perlast G65HP can be molded into O-rings, seals, NW/KF fittings and custom components to suit any application. (read more)
Browse Rubber and Elastomer Molding Services Datasheets for Precision Polymer Engineering Ltd. -
tool productive period, or uptime, leading to lower cost of consumables. Perlast® G65HP incorporates a unique formulation developed specifically for critical semiconductor processes where the seals are in direct contact with plasma. This new material grade provides (read more)
Browse O-rings Datasheets for Precision Polymer Engineering Ltd.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
the Enviro Advanced Dry Strip System, is a multi-chamber, single-wafer photoresist stripper and polymer-removal tool that incorporates both microwave downstream and low-energy plasma. Singapore's STATS lowers forecast for next two quarters SINGAPORE -- Citing a slowdown in its IC-packaging, assembly
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Metrigraphics Article in Today's Medical Developments
, taking multiple dies on a tool, a high-pressure press, and stamping out the parts. "You are able to get a high volume of parts that require minimal tolerances with not a lot of variety in terms of complexity of the part," says Luke Volpe, director of product development engineering. Metrigraphics has
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Correlation of IEC60270, HFCT RF spectra and HFCT PQN patterns for HV cable fault
point removed to simulate a clean termination, a special semiconductor layer stripping tool was used for this purpose.
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http://usitc.gov/publications/332/pub3868.pdf
Machine tool for wet-etching or - stripping semiconductor wafers; machine tool for wet-etching, -developing or -stripping flat panel screens . . . . . . . . . . . . . . . . . . . . . . . . .
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Semiconductor: Pure Water and Process Analytics for Semiconductor Applications
Wafer cleaning tools used in semiconductor chip manu- facturing processes–such as photoresist strip and post- ash clean, oxide etch, nitride etch, and wafer reclaim–require accurate flow measurement for the trans- port of ultrapure water, chemicals, or combinations of both.
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Deposition Equipment Company Links
Original equipment manufacturer of plasma etch (reactive ion etch), strip and plasma enhanced chemical vapor deposition tools for the compound semiconductor , MEMS, opto-electronic and other markets.
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Manufacturers Company Links
Original equipment manufacturer of plasma etch (reactive ion etch), strip and plasma enhanced chemical vapor deposition tools for the compound semiconductor , MEMS, opto-electronic and other markets.
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Single wafer all-wet photo resist strip process for LDD implant in CMOS technology
[1] Roadblocks and Critical Aspects for Sub-45-nm Wafer Cleaning and Possible Solutions, Mertens et.al., ISTC, 2008 [2] Evaluation of all wet PR Strip Clean by Using Single Wafer Clean Tool , Steven Piao, ( Semiconductor International China, Wafer Cleaning Seminar …
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Mattson Technology, Inc. Receives Next-Generation Order For Suprema Photoresist System From Leading Global Semiconductor Manufacturer
… Technology, Inc., a leading supplier of advanced process equipment used to manufacture semiconductors, recently announced that it has received a next-generation development tool order for the Company's Suprema photoresist strip system from a leading global semiconductor manufacturer for high-k …
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Uncertainty Clouds Semicon West '98
For example, the company debuted its 300 mm Aspen III Strip system, announcing that a tool has been shipped to the Siemens/Motorola Semiconductor 300 project.
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Approaches to Innovations in the Aerospace Sector through Green Engineering and Green Chemistry
This process has been finding successful applications in industry, which include the removal of adherent particles in semiconductors [25], cleaning of molds and tools in manufacturing [26], and paint stripping in aircraft [27].
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Top-down contact lithography fabrication of a
TiO2 nanowire
array over a SiO2
mesa
For the reasons explained above, the implementation of a cheap and fast process for the fabrication of nanometre- size semiconductor channels may result in a useful tool for this kind of … … nm large gas sensitive strip with lateral surfaces exposed …