Silicon Wafer Inspection System

Description: The Nanotronics Imaging nSpec® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec® offers fast quantification and qualification of defects

• Measurements: Defects / ADC
• Mounting / Loading: Manual Loading
• Technology: Optical / Imaging System
• Applications: Semiconductor Wafers

Description: surface of a clean, unpatterned, polished or epitaxial wafer of the same type that is to be inspected by the SSIS. Note 1-This practice was developed primarily for use in calibrating SSISs intended for inspecting monocrystalline wafers, in which case pre-deposited bare, monocrystalline

Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This practice covers the determination of the accuracy with which a scanning surface inspection system (SSIS) reports the positions of localized light scatterers on a silicon wafer surface. Note 1-This

Description: It incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements you need–two-dimensional or three-dimensional–inspection and evaluation is exceptionally fast and accurate with this system! The Confocal NEXIV can be optimally

• Applications: Electronics or Semiconductor Inspection, Production & Quality Control
• Image Source: Optical Microscope
• System Type: Turnkey / Complete System

Description: repeatability and nearly instantaneous torque for smooth operation and speed changes. Typical product applications include silicon wafers, flat panels, optics and disk media processing. JST's linear transfer, semi-automated stations allow for loading and unloading of product either

Description: Topside and backside macro inspections are also available for all wafer sizes Thin Wafer Inspection To meet the demands of thin wafer manufacturers, the new arm design of the AL120-LMB-90 model can handle a full cassette of 90 µm wafers. Serial Interface for

• Grade: Benchtop
• Eyepiece Style: Binocular
• Microscope Type: Compound
• Features: Digital Display, Mechanical Stage

Description: No Description Provided

• Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer Bonding,
• Materials: Compound Semiconductor, Glass, Quartz, SOI, Silicon
• Services: Design / Engineering, Pilot / Scale-Up, Production, Prototyping, R & D / Development
• Features: Midwest US Only, North America, Specialty / Other, United States Only

Description: System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and Ga/As wafers with aluminum or copper seed layer. The Semcon 4000 tool is

• Machinery Type: Automated System
• Process / Technology: Electroplating
• Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic

Description: Keystone routinely designs and builds all sorts of material handling equipment. Whether you need to lift a 6,000 lb roll of plastic or place a silicon wafer on a tray, we have the industry knowledge and technical expertise to get it done right the first time. We've done overhead gantry

• Industries Served: Agriculture, Electrical, Electronics, Food / Beverage, Furnace / Heat Treatment, General Industry / Manufacturing, Medical, Microelectronics / Semiconductor
• Services: CAD / CAM Support, Control System Design / Programming, Equipment Design, Factory Automation, Manufacturing Cells, On-site Support / Training, Process Development, Systems Design / Integration, Turnkey Systems
• Capabilities: Carts / Trucks / Dollies, Conveyors, Cranes / Hoists / Winches, Lifts, Pallet Transfer Systems, Parts Feeders, Pick and Place Equipment, Vision Inspection, Web Handling / Converting
• Additional Capabilities: Custom Equipment Design

Description: result, the UV-2600 can accommodate measurements of solar cell anti-reflective films and polycrystalline silicon wafers.

• Wavelength Range: 185 to 1,400 nm
• Spectral Resolution: 0.1 nm
• Wavelength Accuracy: 0.1 nm
• Wavelength Reproducibility: 0.05 nm

Description: The measurement of light scattered by surfaces can be used to locate and identify roughness, particulates, and defects on a wide variety of materials. Applications include the inspection of silicon wafers, optics, and storage media, characterization of thin film roughness,

• Type: Course
• Technology / Subject Expertise: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics
• Delivery: On-site / In Plant

Description: composed of thermally grown silicon dioxide over which a layer of silicon nitride is deposited. This dielectric possesses a low temperature coefficient of capacitance, very high insulation resistance. The devices also exhibit excellent long term stability making them suitable for high

• Capacitance Range: 0.0000008000000000000001 microF
• Applications: RF / Microwave Capacitors
• Configuration / Form Factor: Surface Mount / Chip Capacitor

Description: custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs detectors that are optimized for

• Peak Wavelength: 1,300 nm
• Forward Voltage: 0.85 volts
• Optical Power Output: 1.6 milliwatts
• Viewing Angle: 6 degrees