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Supplier: Nanotronics Imaging
Description: The Nanotronics Imaging nSpec® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec® offers fast quantification and qualification of defects
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Measurement Capability: Defects / ADC
- Mounting / Loading: Manual Loading
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Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This practice covers the size calibration of a scanning surface inspection system (SSIS) by observing the distribution of monodisperse polystyrene latex (PSL) spheres that have been pre-deposited in controlled fashion on
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Supplier: Nikon Metrology
Description: NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card. Key benefits Simultaneous wide-area height measurement with Nikon
- Applications / Capabilities: Electronics or Semiconductor Inspection, Production & Quality Control
- Image Source: Optical Microscope
- System Type: Turnkey / Complete System
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Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This practice covers the determination of the accuracy with which a scanning surface inspection system (SSIS) reports the positions of localized light scatterers on a silicon wafer surface. Note 1-This
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Supplier: JST Manufacturing, Inc.
Description: precise position repeatability and nearly instantaneous torque for smooth operation and speed changes. Typical product applications include silicon wafers, flat panels, optics and disk media processing. JST's linear transfer, semi-automated stations allow for loading and unloading
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Supplier: Integrated Sensing Systems, Inc.
Description: No Description Provided
- Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing,
- Location: North America, United States Only, Midwest US Only
- Materials: Silicon, Compound Semiconductor, Glass, Quartz, SOI
- Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
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Supplier: Technic, Inc.
Description: System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and Ga/As wafers with aluminum or copper seed layer. The Semcon 4000 tool is
- Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
- Equipment / System Type: Automated System
- Process / Technology: Electroplating
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Supplier: Evident Scientific
Description: to optimize inspection results. Easy to Operate To meet the demands of varying inspection routines, the AL120 is recipe driven with ten programmable system configurations including specific cassette types, wafer specifications and transfer speed. Quick push button
- Application: Semiconductor Inspection
- Grade: Benchtop
- Mechanical Stage: Yes
- Microscope Type: Compound
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Supplier: Keystone Automation, Inc.
Description: Keystone routinely designs and builds all sorts of material handling equipment. Whether you need to lift a 6,000 lb roll of plastic or place a silicon wafer on a tray, we have the industry knowledge and technical expertise to get it done right the first time. We've done overhead gantry
- Additional Capabilities: Custom Equipment Design
- Capabilities: Carts / Trucks / Dollies, Conveyors, Cranes / Hoists / Winches, Lifts, Pallet Transfer Systems, Parts Feeders, Pick and Place Equipment, Vision Inspection, Web Handling / Converting
- Industries Served: Agriculture, Electrical, Electronics, Food / Beverage, Furnace / Heat Treatment, General Industry / Manufacturing, Medical, Microelectronics / Semiconductor
- Location: North America, United States Only, Northeast US Only
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Supplier: Shimadzu Scientific Instruments, Inc.
Description: range of conventional models can be extended to 1400 nm. As a result, the UV-2600 can accommodate measurements of solar cell anti-reflective films and polycrystalline silicon wafers.
- Application Software Included: Yes
- Computer Interface: Yes
- Detector Type: Photomultiplier, Other Detector
- Display Options: None
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Supplier: SPIE - Education
Description: The measurement of light scattered by surfaces can be used to locate and identify roughness, particulates, and defects on a wide variety of materials. Applications include the inspection of silicon wafers, optics, and storage media, characterization of thin film roughness,
- Modality: On-site / In Plant
- Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics
- Type: Course
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Supplier: Skyworks Solutions, Inc.
Description: Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame.
- Applications: RF / Microwave Capacitors
- Capacitance Range: 4.70E-5 microF
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Supplier: Skyworks Solutions, Inc.
Description: Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame.
- Applications: RF / Microwave Capacitors
- Capacitance Range: 3.33E-4 microF
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Supplier: Skyworks Solutions, Inc.
Description: Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame.
- Applications: RF / Microwave Capacitors
- Capacitance Range: 1.50E-5 microF
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Supplier: Skyworks Solutions, Inc.
Description: Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame.
- Applications: RF / Microwave Capacitors
- Capacitance Range: 6.80E-5 microF
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Supplier: Marktech Optoelectronics
Description: happy to work with you to develop a custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs
- Color: Infrared
- Forward Voltage: 1 volts
- Optical Power Output: 5 milliwatts
- Peak Wavelength: 1300 nm
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Supplier: Marktech Optoelectronics
Description: happy to work with you to develop a custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs
- Color: Infrared
- Forward Voltage: 1.1 volts
- Lens Type: Domed Lens
- Optical Power Output: 8 milliwatts
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Supplier: Marktech Optoelectronics
Description: happy to work with you to develop a custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs
- Color: Infrared
- Forward Voltage: 1.2 volts
- Lens Type: Flat Lens
- Optical Power Output: 1.2 milliwatts
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Supplier: Marktech Optoelectronics
Description: happy to work with you to develop a custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs
- Color: Infrared
- Forward Voltage: 0.7000 volts
- Lens Type: Domed Lens
- Optical Power Output: 0.7500 milliwatts
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Display (FPD) Production: High-speed material handling across LCD and OLED cleanroom assembly lines. Photovoltaic and New Energy Systems: High-throughput silicon wafer transport, solar module positioning, and automated visual inspection platforms (read more)
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production equipment, designed to absorb, fix, transfer, and handle silicon wafers and various delicate workpieces. Manufactured from high-performance materials such as silicon carbide or alumina ceramic, this chuck offers outstanding temperature, chemical, and mechanical resistance, making it ideal (read more)
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working with thick silicon substrates that require extremely high geometric quality and defect-free surfaces. Thanks to their high processing speed, Marposs systems can monitor wafer processing directly inside CMP machines, even in challenging environments where slurry is present and the table (read more)
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Conduct Research Top
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SmartMore Efficient Vision Inspection System for Silicon Wafer
Chipsets are typically designed to work with a specific series of microprocessors because it regulates the communication between the processor and the external devices. It plays a vital role in determining system performance. In the chip production process, wafer bumps critical chip components need
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
drives MicroSensors receives patent for silicon micromachined gyro sensor France's Soitec, Gemplus target SOI wafers for smart-card ICs Veeco adds thin-film inspection, ion-beam deposition through two mergers PMC-Sierra's networking-chip strategy lifts earnings Patton leaves Schlumberger
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (June 22) Heard on the Beat (June 22) Commentary & analysis of week's chip news UMC says fab closure report is 'speculation' United Microelectronics Corp is keeping quiet about rumors that it will temporarily shut down one of its 8-inch wafer fabrication facilities due to low
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
wafer plant In what could ultimately drive down the costs of silicon-on-insular (SOI) technology, Shanghai Simgui Technology Co. Ltd. has opened the first commercial SOI wafer plant in China. Chartered to halt fabs for eight days, says report SINGAPORE -- Foundry Chartered Semiconductor Manufacturing
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
software with IA-64 patents NEW YORK -- A flurry of more than 20 new patents suggests Intel Corp. is expanding its time-tested legal strategy to prevent cloning of its new, flagship IA-64 architecture. ADE claims KLA-Tencor violating wafer inspection patent WESTWOOD, Mass. -- ADE Corp. here has
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
cells K &S shows first 300-mm solder bumped wafer produced by Flip Chip venture Hyundai aims to be $1 billion silicon foundry supplier with converted DRAM fabs Avnet says quarterly earnings will exceed expectations by 10% Microchip sets record shipments, earnings in quarter Microsemi announces InGaP HBT
More Information Top
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SEM review of unpatterned particle monitor wafers
This paper defines a method for utilizing x I y defect coordinate locations on unpattemed wafers, obtained on a laser-scanning bare silicon wafer inspection system to accurately and repeatability obtain SEM images and EDS materials information in a manufacturing environment.
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SEM/EDS analysis method for bare silicon particle monitor wafers
This paper defines a method for utilizing x / y defect coordi- nate locations on unpattemed wafers, obtained on a laser- scanning bare silicon wafer inspection system to accurately and repeatability obtain SEM images and EDS materials infor- mation in a manufacturing …
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Handbook of Optics: Volume V – Atmospheric Optics, Modulators, Fiber Optics, X-Ray and Neutron Optics, Third Edition > SCATTEROMETERS
SEMI M52-0307— Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm, 90 nm, 65 nm, and 45 nm Technology Generations.
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Surface inspection using optical fiber sensor
Figure 6 shows the measurement results of application of this method using the optical fiber sensor to in—process automated inspec— tion system for silicon wafer surface.
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Nearly Perfect Reticles For Direct Wafer Steppers
An automatic wafer inspection system for silicon wafers is not presently .
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IR-MEMS Inspector - Schott and Moritex - Imaging and Machine Vision Europe
Schott and Moritex have released an innovative inspection system for silicon wafers in MEMS manufacturing.
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REPEAT/ADE Announces Initial Sale of Its WaferSight Wafer Geometry Tool for 90nm and Below
About ADE Corporation ADE Corporation is a leading supplier of metrology and inspection systems for the silicon wafer , magnetic data storage and optics manufacturing industries.
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ADE signs exclusive agreement to market advanced particle deposition systems
ADE Corporation is a leading supplier of metrology and inspection systems for the silicon wafer and computer disk manufacturing industries.
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WaferAnalyzer Software Application Saves Time in Data Collection and Analysis Process
ADE Corporation>, a supplier of metrology and inspection systems for the silicon wafer and computer disk manufacturing industries, introduces the release of WaferAnalyzer 2.0 (WA 2.0), a powerful software application designed to aid engineers in solving defect problems in silicon …
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ADE Corp. Consolidating Metrology Operations
ADE Corporationompany%>,a supplier of metrology and inspection systems for the silicon wafer and computer disk manufacturing industries, is consolidating its Charlotte, NC operations and certain of its Milpitas, CA operations into its Massachusetts facilities.
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