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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance. Silicone free Halogen free RoHS compliant Easily peelable without residues Zero outgassing @ 100
- Chemical / Polymer System Type: Polyamide
- Form / Function: Encapsulant / Potting Compound
- Use Temperature: 40 to 212 F
- Viscosity: 4000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low dielectric constant and dissipation factor. It is designed for airborne
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 200 psi
- Use Temperature: 85 to 500 F
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Supplier: Henkel Corporation - Industrial
Description: is compatible with most conformal coating materials in the industry. Silicone free Halogen free RoHS compliant Easily peelable without residues Zero outgassing @ 100 °C Ultra fast process time 100% Solids material Solidifies upon cooling, no additional curing process required Good resistance
- Cure Type / Technology: Thermoplastic / Hot Melt
- Form / Function: Encapsulant / Potting Compound
- Viscosity: Up to 4000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating LOCTITE® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features primerless
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Viscosity: 2230 cP
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Encapsulants and Potting Compounds - Techsil RTV27905 Clr Silicone Gel Encapsulant 10kg -- TESI19154Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Techsil® RTV27905 Clr Silicone Gel Encapsulant 2kg -- TESI19128Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2 CN Clear, formerly Emerson and Cuming, is a two component, room temperature curing, silicone encapsulant that is used for potting, replacing, and repairing applications. It offers good visibility, high temperature properties, repairability, and flexibility. 1
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 1700 cP
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ ME-4132 Silicone Encapsulant Black is a one component encapsulant that has high purity, excellent adhesion, low modulus of elasticity, and no byproducts during cure. It is primarily used for the micro- and optoelectronic packing industry. 453 g Bottle.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 508 kV/in
- Elongation: 138 %
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 567 Primerless Silicone Encapsulant Black is a two component material that is used in potting applications for automotive assemblies, power supplies, high voltage resistor packs, LED lighting, industrial controls, and connectors. It offers unprimed adhesion, heat curing
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 525 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ X3-6211 Encapsulant Clear is a one component, UV curing, thixotropic gel that is used for stress relief, electrical insulation, and protection against moisture, high voltages, and extreme temperatures. It is flexible, flowable, and fast curing. 175 mL Cartridge.This is a Dow
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 432 kV/in
- Elongation: 220 %
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Supplier: CHT USA Inc.
Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 353 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: CHT USA Inc.
Description: CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 315 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Elongation: 35 %
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Supplier: Accuris
Description: ENCAPSULANT, SILICONE DIELECTRIC GEL
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Supplier: Techsil Limited
Description: Momentive TSE3033 is a two-component, transparent heat curable silicone rubber designed for electrical and electronic potting. This silicone adheres to various types of materials such as metals, plastics, glass and ceramics without the use of primers. It comes in a convenient 1:1 mix
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating & encapsulating compound
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
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Supplier: Novagard Solutions
Description: Non-corrosive, single component alkoxy cure silicone sealant/adhesive
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
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Supplier: Techsil Limited
Description: Momentive RTV566 is a two-part silicone rubber compound processed and tested for applications where low outgassing is required. Supplied as a kit with RTV566 A (base compound) and RTV566 B (curing agent). Product Benefits Room temperature cure Excellent release
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
- Use Temperature: -115 to 260 F
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone sealant, self-leveling liquid
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the elastomer resists
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity. Special features
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 470 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: CHT USA Inc.
Description: CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 500 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Electronics
Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for encapsulating
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Bluestar Silicones USA Corp.
Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 4.44 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 1 : 1 mixing ratio low viscosity rapid heat cure very low hardness (silicone
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Features: Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening
- Index of Refraction: 1.4
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Supplier: Epoxies Etc...
Description: 20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 183 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Description: For gasket and sealing applications. The product has high resilience. This product is usually used from -53°C to 250°C.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured
- Form / Function: Conformal / Encapsulating Coating
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Supplier: MacDermid Alpha Electronics Solutions
Description: A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: DigiKey
Description: POTTING COMPOUND SILICONE 2 PART
- Form / Function: Encapsulant / Potting Compound
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Supplier: Wacker Chemical Corp.
Description: WACKER SILGEL® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 10 : 1 mixing ratio very low viscosity rapid curing at room temperature with
- Chemical / Polymer System Type: Silicone
- Industry: Electronics, Energy Conversion (Battery/Fuel Cell/PV)
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Silicones for Electronic Protection and Long-term Performance Electronics function in many different applications. However, there is a common requirement to protect sensitive components and systems from (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
In the transportation sector, designing lighter weight components has widely become a key trend especially to reduce energy consumption and maximize the range of electric vehicles. CHT’s advanced Silicone Foam is designed to reduce weight – as well as mitigate thermal (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Silicone gels are two-component, addition (platinum) cure chemistry and most are designed with a one-to-one mix ratio system. Silicone gels will cure at either room temperature or can be heat cured for faster processing and can be either automatically or hand dispensed. Specialty gels can also (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
CoolTherm® SC-320 silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications while retaining desirable properties associated with silicones. (read more)
Browse Silicone Adhesives and Sealants Datasheets for Ellsworth Adhesives -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Why are silicones used in LED & Lighting applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Industries Association named Naoyuki Akikusa, chairman of Fujitsu Ltd., as its new chairman, at a time when the Japanese electronics industry is growing strongly. Dow Corning sees LED makers transitioning to silicones Dow Corning has launched an expanded family of silicone materials for the light emitting
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
transitioning to silicones Dow Corning has launched an expanded family of silicone materials for the light emitting diode market, including three new LED-protecting encapsulants and a moldable resin. Siano launches chipset for mobile digital TV Mobile digital television (MDTV) chip developer Siano
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Optical Transmission Properties of Adhesives
700nm to 1 mm, you have "infrared light", (IR) which can be further broken down into near infrared (0.75-2 µm), middle infrared (2-15 µm), and far infrared 15 µm to 1mm. Most optically clear epoxies, polysulfides, and silicones exhibit excellent light transmission across the visible, and near IR
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LED Package-use Encapsulation Material Report - 2013
LED silicone encapsulant market to nearly double in size by 2017 compared to 2012 .
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http://dspace.mit.edu/bitstream/handle/1721.1/32693/43319679-MIT.pdf?sequence=2
portion of wire which penetrated the silicone encapsulation and entered the surrounding fluid .
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Miniaturization of package for an implantable heart monitoring device
Fig. 5 Left model of the silicone encapsulation .
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Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices
This statistical approach is the same as that already used for the validation of the silicone encapsulation .
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Solid State Lighting Reliability
Delam- ination can either occur between the die and silicone encapsulant [15], between the encapsulant and packaging lead frame [145], or between the LED die and die attach [146, 147], as shown in Fig. 3.25.
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Comparison of effect of epoxy and silicone adhesive on the lifetime of plastic LED package
From TTF data, statistical analysis was performed and reliability parameters such as acceleration factor (AF) and B10 lifetime at 40°C were estimated according to types of bonding adhesive and silicone encapsulant in plastic LED packages, with 90% confidence.
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Materials for Advanced Packaging
As shown in Fig. 18.4(a), a typical high power white LED package structure is comprised of a leadframe with a reflector cup, an LED die, a die attach adhesive, gold wires, and a silicone encapsulant mixed with phosphor material.
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High Performance Packaging Solutions for Low Cost, Reliable PV Modules: Final Subcontract Report, 26 May 2005 - 30 November 2008
2 Figure 1 – Silicone Encapsulation Concepts .................................................................................................
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Encapsulation process development for flexible-circuit based chip scale packages
… will eliminate the die attach voids, the under filling process between the nubbins and under the die is extremely slow, addi- tionally, encapsulation voids under the die can be spotted even under vacuum environment due to the high viscosity silicone encapsulant used.
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Volume structuring of high power LED encapsulates by femtosecond laser direct writing
which was subsequently trickled with respect to the frame surface, yielding silicone encapsulation layers of 45 µm thickness (with respect to the top of the sapphire substrate) after curing at a temperature of 80◦C for 4 hours.