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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Thermal / Heat Conductive
- Industry: Electronics, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive
- Industry: Electronics
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio.
- Coeff. of Thermal Expansion (CTE): 38.89 to 139 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Flexible / Dampening, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed or pin transferred. It offers fast in-line cure at low temperature. One part
- Coeff. of Thermal Expansion (CTE): 22.22 to 66.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system.
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled
- Industry: Aerospace, Electronics, Medical / Food (Sanitary / FDA), Photonics / Optoelectronics
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and
- Coeff. of Thermal Expansion (CTE): 23.33 to 125 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Aerospace, Electronics, Photonics / Optoelectronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of two part silver conductive epoxy systems, the EP77M-F has a
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Filled, Thermal / Heat Conductive
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Rubber / Elastomer, Other
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and
- Coeff. of Thermal Expansion (CTE): 21.11 to 52.22 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: 40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its'
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Electrically Conductive, Filled
- Industry: Electronics, Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik KE 4238 Epoxy Adhesive Resin Silver is a two component adhesive used as a "cold solder" for heat-sensitive components where hot-soldering is impractical. It offers high volume conductivity, bond strength, and reliability. 6 oz Bottle.
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 21 W/m-K
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity.
- Cure Type / Technology: Two Component System
- Elongation: 20 to 30 %
- Features: Thermal / Heat Conductive
- Tensile Strength (Break): 450 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g
- Cure Type / Technology: Two Component System
- Elongation: 20 to 30 %
- Features: Thermal / Heat Conductive
- Tensile Strength (Break): 450 psi
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Supplier: Techsil Limited
Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies,
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies,
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: SAE International
Description: This specification covers an electrically-conduct ive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 2902 Silver is a two component, room temperature curing epoxy adhesive. It is thermally and electrically conductive, solvent-free, and has good adhesion to a variety of substrates. 2.65 g Kit.
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 2.99 W/m-K
- Viscosity: 20000 cP
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Graphene Laboratories, Inc.
Description: based on advanced proprietary technology that utilizes 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. G6E-HTNS™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. A
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 to 356 F
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Supplier: Master Bond, Inc.
Description: on sensitive components and substrates. Also, the highly flexible EP21TDCSFL is easier to remove than most silver epoxies, making it well suited for repair type applications. Parts A and B are both colored silver. Master Bond EP21TDCSFL adhesive is widely used in the
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Graphene Laboratories, Inc.
Description: materials that are likely to be subjected to vibrations, temperature variations, shock from impact, bending, and mechanical stress. We use a proprietary mix of silver and graphene materials to formulate an adhesive with an outstanding combination of flexibility and low electrical
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 320 F
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Supplier: Graphene Laboratories, Inc.
Description: technology that requires 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-FXNS™ less prone to fracture, thus allowing for stronger adhesion
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 F
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Supplier: DigiKey
Description: SILVER CONDUCTIVE EPOXY, 10 MIN.
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Supplier: DigiKey
Description: SILVER CONDUCTIVE EPOXY, 4 HR PO
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Supplier: DigiKey
Description: SILVER CONDUCTIVE EPOXY, 4 HR PO
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Supplier: DigiKey
Description: SILVER CONDUC EPOXY 15G SYR
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Supplier: Accuris
Description: ADHESIVE, EPOXY, SILVER FILLED, CONDUCTIVE
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Supplier: Materion Corporation
Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Accuris
Description: Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
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Supplier: TE Connectivity
Description: Body Features Color (Cured) : Silver Color (Supplied) : Silver Material Systems Code : 100, 25, 10 Other Curing Method : 20 °C for 24 hr, 80 °C for 1
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 64C, Epoxy, Assembly LOCTITE® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea water causes silver based electrically conductive
- Cure Type / Technology: Two Component System
- Use Temperature: 67 to 266 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 967-1, Epoxy, Die attach LOCTITE® ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. Low temperature cure, electrically conductive paste with reduced risk to delicate components and increase manufacturing through-put
- Cure Type / Technology: Two Component System
- Viscosity: 14000 cP
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Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 83CJ, Epoxy, Assembly LOCTITE® ABLESTIK 83CJ adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures. LOCTITE ABLESTIK
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc.
Conduct Research Top
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Tech Tip 12 - Compatible Metallization
Silver epoxy adhesives (ECAs) have been widely used in semiconductor and electronic packaging industries since the 1960s, as a reliable connection method instead of soldering or eutectic joining of metals.
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Silver Filled, Electrically Conductive Adhesives
In the realm of electrically conductive epoxies and silicone, there is nothing like silver. Not only does silver have very high electrical conductivity, it also retains its low resistance over many years, even decades. This is much more desirable than other metals that are highly conductive
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
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Failure analysis of electrical-thermal-optical characteristics of LEDs based on AlGaInP and InGaN/GaN
The silver epoxy adhesive is applied between the reflector cup and AlGaInP LED chip with dimensions of 0.3 × 0.3 × 0.02 mm.
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Thermal transient characteristics of flip chip high power light emitting diodes
At the second die-attached layer, the thermal resistance of silver epoxy adhesion was almost 4.3 ℃/W greater than that of Au-Sn adhesion.
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https://dspace.lib.cranfield.ac.uk/bitstream/1826/127/2/ANThesisno%20appendix.pdf
The conductive silver epoxy adhesive (IONACURE 650) is a two component pure silver filled epoxy adhesive.
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Equivalent electrical network for performance characterization of piezoelectric peristaltic micropump
… above the three chamber structures in the silicon substrate by matching the 12 9 12 mm2 square structure (i.e. PZT chips) to the 12 mm diameter circular structure (i.e. chambers) and were then fixed in place using silver epoxy adhesive .
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https://www.repository.cam.ac.uk/bitstream/handle/1810/245063/SC_thesis_2013_version_for_hardbinding.pdf?sequence=1
One surface was covered with electrically insulating kapton tape, and a smear of silver epoxy adhesive (type 186-3616, Radiospares) was added.
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http://miun.diva-portal.org/smash/get/diva2:548003/FULLTEXT02.pdf
The standard deviation, as indicated by error bars in the graph, show that the largest resistance spread is for copper tape (adhesive 2) and the smallest for silver epoxy ( adhesive 1).
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Microrheology of CNT/silver epoxy composites - HKUST Institutional Repository
To ensure an effective use of these nano fillers without changing the process abilities during practical applications, understanding of the microrheological properties of the nano filler/ silver epoxy adhesives becomes paramount.
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Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials
[31] M. Catelani, V. L. Scarano, R. Singuaroli, F. Bertocci, and P. Palchetti, “RoHS requirements for electronic applications: Measurements of char- acteristics of silver epoxy adhesives solder joints,” in Proc. 16th IMEKO TC4 Symp.
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Sources of silver in the environment
In addition, the electronics industry uses a silver epoxy adhesive to attach parts to a plastic or ceramic computer chip.
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http://dspace.mit.edu/bitstream/handle/1721.1/61916/707091340-MIT.pdf?sequence=2
Gold wires, attached by small amounts of silver epoxy adhesive , can be seen in the photo making contact with the polypyrrole length sensor.