Products & Services
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These
- Viscosity: 800 to 1,600 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.4 W/m-K
- Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive
- Use Temperature: -452 to 250 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Epoxy Adhesive / 0.52 oz Syringes
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Epoxy Adhesive / 5.72 oz tub kit
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of two part silver conductive epoxy systems, the EP77M-F has a
- Use Temperature: -452.47 to 257 F
- Thermal Conductivity: 1.442279 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Rubber / Elastomer
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g
- Viscosity: 29,500 to 582,000 cP
- Thermal Conductivity: 4.65 W/m-K
- Tensile Strength (Break): 450 psi
- Elongation: 20 to 30 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik KE 4238 Epoxy Adhesive Resin Silver is a two component adhesive used as a "cold solder" for heat-sensitive components where hot-soldering is impractical. It offers high volume conductivity, bond strength, and reliability. 6 oz Bottle.
- Thermal Conductivity: 21 W/m-K
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 2902 Silver is a two component, room temperature curing epoxy adhesive. It is thermally and electrically conductive, solvent-free, and has good adhesion to a variety of substrates. 2.65 g Kit.
- Viscosity: 20,000 cP
- Thermal Conductivity: 2.99 W/m-K
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Accuris
Description: ADHESIVE, EPOXY, SILVER FILLED, CONDUCTIVE
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Supplier: TE Connectivity
Description: Body Features Color (Cured) : Silver Color (Supplied) : Silver Material Systems Code : 100, 25, 10 Other Curing Method : 20 °C for 24 hr, 80 °C for 1 hr Pot Life (MINUTE) : 60 Packaging Features Packaging Method : Syringe Packaging Quantity : 2 Usage Conditions Heat Resistance
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 83C Silver, formerly Emerson and Cuming ECCOBOND, is an two component, silver filled, epoxy adhesive paste that is used to replace hot soldering for electrical connections and bonding to plastics, metal, ceramics, and glass. It offers excellent
- Thermal Conductivity: 2.6 W/m-K
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production
- Viscosity: 2,000 cP
- Thermal Conductivity: 2.5 to 3 W/m-K
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 55.55555555555556 µin/in-F
- Substrate Compatibility: Ceramic / Glass, Metal
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Supplier: Allied Electronics, Inc.
Description: Cyanoacrylate Adhesive, 1.05 @ 75 ºF Specific Gravity Conductive Epoxy, Silver Epoxy Resin, Mild Odor Conductive Silver Epoxy Provides Excellent Electrical and Thermal Conductivity High Strength Conductive Bonding Repairs Defective Traces and Creates
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Supplier: Accuris
Description: Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Supplier: Allied Electronics, Inc.
Description: electronic components is a factor. 3M™ Scotch-Weld™ epoxy adhesive DP190 gray is a 1:1 by volume mix ratio of 3M™ Scotch-Weld™ epoxy adhesive 2216 B⁄A gray and exhibits good peel, shear and environmental aging properties.
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Supplier: SAE International
Description: This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These
- Viscosity: 25,000 to 45,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 2.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F
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Supplier: Accuris
Description: ADHESIVE, ELECTRICALLY CONDUCTIVE SILVER-FILLED EPOXY RESIN (STABILIZED TYPE)
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Features: Die Bonding Adhesive / Compound, Electrically Conductive, Epoxy (EP), Powder, Specialty / Other
- Industry: Electronics
- Cure / Technology: Two Component System
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting
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Supplier: Allied Electronics, Inc.
Description: CircuitWorks Conductive Epoxy is a two part, silver epoxy used in prototype, repair and general conductive bonding applications. CW2400 features strong mechanical gbonds, excellent electrical conductivity, and quick room temperature curing. CircuitWorks Condcutive Epoxy
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Supplier: Epoxies Etc...
Description: 40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its'
- Use Temperature: -58 to 338 F
- Thermal Conductivity: 14.42279 W/m-K
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
- Tensile Strength (Break): 9,450 psi
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: -67 to 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive
- Features: Electrically Conductive, Epoxy (EP), Silicone, Specialty / Other
- Industry: Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™
- Viscosity: 110,000 to 120,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive
- Use Temperature: -452 to 275 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less
- Viscosity: 80,000 to 85,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other
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Supplier: Techsil Limited
Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies,
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Epoxy, 10 min. Pot Life, High Conductivity
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000
- Use Temperature: -60 to 300 F
- Thermal Conductivity: 1.5865069 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Rubber / Elastomer
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Industrial Adhesives - 3M CircuitWorks Conductive Adhesive - Silver 7 g Syringe - CW2400 - -- CW2400Supplier: R. S. Hughes Company, Inc.
Description: 3M CircuitWorks silver conductive adhesive. Minimum to maximum operating temperatures are -131 F to +212 F.
- Use Temperature: -131 to 212 F
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Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc.
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Tech Tip 12 - Compatible Metallization
Silver epoxy adhesives (ECAs) have been widely used in semiconductor and electronic packaging industries since the 1960s, as a reliable connection method instead of soldering or eutectic joining of metals.
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Silver Filled, Electrically Conductive Adhesives
In the realm of electrically conductive epoxies and silicone, there is nothing like silver. Not only does silver have very high electrical conductivity, it also retains its low resistance over many years, even decades. This is much more desirable than other metals that are highly conductive
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
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Failure analysis of electrical-thermal-optical characteristics of LEDs based on AlGaInP and InGaN/GaN
The silver epoxy adhesive is applied between the reflector cup and AlGaInP LED chip with dimensions of 0.3 × 0.3 × 0.02 mm.
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Thermal transient characteristics of flip chip high power light emitting diodes
At the second die-attached layer, the thermal resistance of silver epoxy adhesion was almost 4.3 ℃/W greater than that of Au-Sn adhesion.
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https://dspace.lib.cranfield.ac.uk/bitstream/1826/127/2/ANThesisno%20appendix.pdf
The conductive silver epoxy adhesive (IONACURE 650) is a two component pure silver filled epoxy adhesive.
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Equivalent electrical network for performance characterization of piezoelectric peristaltic micropump
… above the three chamber structures in the silicon substrate by matching the 12 9 12 mm2 square structure (i.e. PZT chips) to the 12 mm diameter circular structure (i.e. chambers) and were then fixed in place using silver epoxy adhesive .
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https://www.repository.cam.ac.uk/bitstream/handle/1810/245063/SC_thesis_2013_version_for_hardbinding.pdf?sequence=1
One surface was covered with electrically insulating kapton tape, and a smear of silver epoxy adhesive (type 186-3616, Radiospares) was added.
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http://miun.diva-portal.org/smash/get/diva2:548003/FULLTEXT02.pdf
The standard deviation, as indicated by error bars in the graph, show that the largest resistance spread is for copper tape (adhesive 2) and the smallest for silver epoxy ( adhesive 1).
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Microrheology of CNT/silver epoxy composites - HKUST Institutional Repository
To ensure an effective use of these nano fillers without changing the process abilities during practical applications, understanding of the microrheological properties of the nano filler/ silver epoxy adhesives becomes paramount.
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Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials
[31] M. Catelani, V. L. Scarano, R. Singuaroli, F. Bertocci, and P. Palchetti, “RoHS requirements for electronic applications: Measurements of char- acteristics of silver epoxy adhesives solder joints,” in Proc. 16th IMEKO TC4 Symp.
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Sources of silver in the environment
In addition, the electronics industry uses a silver epoxy adhesive to attach parts to a plastic or ceramic computer chip.
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http://dspace.mit.edu/bitstream/handle/1721.1/61916/707091340-MIT.pdf?sequence=2
Gold wires, attached by small amounts of silver epoxy adhesive , can be seen in the photo making contact with the polypyrrole length sensor.