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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, BALL VALVE, 1/2INCH SIZE, 0.62INCH INNER DIAMETER, 3-PIECE FULL PORT W/SOCKET WELD, ISO MOUNTING PAD, 316 STAINLESS STEEL STEM AND BALL MATERIAL, RPTFE SEAT MATERIAL. FREE 2 YEAR RADWELL WARRANTY
- Valve Type: Ball Valves
- Features: Socket Weld / Solder
- Primary Material: Stainless Steel, Steel
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Supplier: Indium Corporation
Description: wide process window provides excellent solderability on diffi cult to solder assemblies and reduces solder balling.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: NIBCO INC.
Description: bolt design, Reinforced PTFE seats, Stainless steel ball and stem, Blowout-proof stem, Cast ISO mounting pad, Vented ball, Locking lever handle, Butt weld end connections Conforms to MSS SP-110, API-607 Fourth Edition Fire Safe, API-608 Anti-Static
- Valve Size: 0.25 to 12 inch
- Pressure Rating: 2,000 psi
- Number of Ports: 2
- Media Temperature: 400 F
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Supplier: MacDermid Alpha Electronics Solutions
Description: processes. Its outstanding reflow process window enables reliable soldering on CuOSP with excellent coalescence across varying deposit sizes, strong resistance to random solder balls, and robust mid-chip solder ball performance. The paste provides consistent fine-pitch
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Supplier: NIBCO INC.
Description: Blowout-proof stem, Enclosed bolt design, Reinforced PTFE seats, Stainless steel ball and stem, Cast ISO mounting pad, Vented ball, Locking lever handle, Butt weld end connections Conforms to MSS SP-110, API-607 Fourth Edition Fire Safe, API-608 Anti-Static
- Valve Size: 0.25 to 12 inch
- Pressure Rating: 2,000 psi
- Number of Ports: 2
- Media Temperature: 400 F
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Supplier: Plast-O-Matic Valves, Inc.
Description: The original Engineered Ball Valve features trunnion design, dual sliding seats, blowout proof stem, mounting lugs. 3/8″ to 4″ sizes in PVC, CPVC, Natural Polypro, PVDF with FKM or EPDM. Available with NPT, socket, BSP, Sanitary, and other connection types.
- Valve Size: 0.5 to 4 inch
- Number of Ports: 2
- Flow (Cv): 10 to 768
- Number of Ports/Ways: 2
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Supplier: U.S. Plastic Corporation
Description: PVC valves come standard with a ball that permits the flow to be diverted from the center port to either the left or right ports, there is no off position. True union design makes these valves very easy to maintain by allowing for easy removal from a piping system without breaking down the
- Valve Size: 3 inch
- Number of Ports: 3
- Number of Ports/Ways: 3
- Valve Type: Ball Valves
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Supplier: Velan, Inc.
Description: Resilient-seated ball valves featuring Memoryseal seating technology, low emissions packing chambers, and other value-added technical features for superior performance. Features and benefits • Exclusive Memoryseal™ seats compensate automatically for wear and fluctuations of pressure and
- Valve Size: 0.5 to 12 inch
- Features: ASME, Bolt Flange, Butt Weld, Socket Weld / Solder, Threaded
- Valve Type: Ball Valves, Butterfly Valves
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Supplier: Velan, Inc.
Description: A fire safe resilient-seated ball valve, ideal for use in a wide range of applications. Features and benefits Velan's VTP-2000 3-piece ball valve is a high performance ball valve, ideal for a wide variety of services. Designed for simple, in-line maintenance, and long, reliable
- Valve Size: 0.5 to 2 inch
- Pressure Rating: 1,500 to 2,000 psi
- Valve Type: Ball Valves, Butterfly Valves
- Features: Socket Weld / Solder, Threaded
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Supplier: IPC International, Inc.
Description: select from Class 2 and/or Class 3 acceptance criteria. Course contents cover workmanship standards for dimensional criteria -- such as End Overhang, Side Joint Width, Fillet Height, etc. -- as well as defect identification for such undesirable conditions as Solder Balls, Blowholes,
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Supplier: Velan, Inc.
Description: Resilient-seated ball valves for general use and commodity applications Features and benefits The Velan Valvac three-piece ball valve with integral ISO mounting pad is a low-cost ball valve for many industrial, commercial and OEM automated applications. The ISO mounting pad will
- Valve Size: 0.25 to 2 inch
- Pressure Rating: 1,000 psi
- Valve Type: Ball Valves, Butterfly Valves
- Features: Socket Weld / Solder, Threaded
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Supplier: Bonomi North America, Inc.
Description: Full Port 3 pc. Carbon Steel Ball Valve w/ Locking Lever w/ SW ends and ISO 5211 Mounting Pad
- Valve Size: 2 inch
- Pressure Rating: 150 to 1,000 psi
- Valve Type: Ball Valves
- Features: ISO, Socket Weld / Solder
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Supplier: Bonomi North America, Inc.
Description: Full Port 3 pc. Stainless Steel Ball Valve w/ Locking Lever w/ SW ends and ISO 5211 Mounting Pad
- Valve Size: 3 inch
- Pressure Rating: 150 to 1,000 psi
- Valve Type: Ball Valves
- Features: ISO, Socket Weld / Solder
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Supplier: Assured Automation
Description: Description: The 36 is a full port, 316 stainless steel, 3 piece ball valve. It is available with threaded ends (36N), socket weld ends (36S), quick clamp ends (36C) or quick clamp ends with cavity filler seats (36CCF*). It can be equipped with a manual handle or with pneumatic or electric
- Valve Size: 0.25 to 3 inch
- Pressure Rating: 1,000 psi
- Number of Ports: 2
- Flow (Cv): 13 to 901
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Supplier: Sharpe Valves
Description: Integral ISO mounting pads, steam rated, recessed seats, vented ball
- Valve Size: 2 inch
- Pressure Rating: 1,000 psi
- Number of Ports/Ways: 2
- Flow (Cv): 600
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Supplier: Assured Automation
Description: Description: The PTP Series 3-Way Ball Valves can be used for flow diverting, mixing, or on/off isolation. They will replace a Tee + 2 valve linkage assembly at reduced cost and space, along with shorter installation and maintenance time. The patented seat stop carrier allows for in-line
- Valve Size: 0.5 to 2 inch
- Pressure Rating: 232 psi
- Number of Ports: 3
- Flow (Cv): 2.45 to 224
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Supplier: Bonomi North America, Inc.
Description: Full Port High Performance 3 pc. Carbon Steel Ball Valve w/ Locking Lever and ISO 5211 Mounting Pad and SW ends
- Valve Size: 3 inch
- Pressure Rating: 1,500 to 2,200 psi
- Media Temperature: -50 to 550 F
- Features: API, ISO, Socket Weld / Solder, Threaded
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Supplier: Bonomi North America, Inc.
Description: Full Port High Performance 3 pc. Stainless Steel Ball Valve w/ Locking Lever and ISO 5211 Mounting Pad and SW ends
- Valve Size: 3 inch
- Pressure Rating: 1,500 to 2,200 psi
- Media Temperature: -50 to 550 F
- Features: API, ISO, Socket Weld / Solder, Threaded
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Supplier: BI-TORQ® Valve Automation
Description: Features PVC or CPVC,body construction 1/2" through 4" TFE seats and EPDM, Viton o-ring seals Threaded, socket or flanged end options Patented design to help prevent leakage in case of stem damage ISO 5211 mounting saddles for easy actuation retrofit
- Valve Size: 0.5 to 4 inch
- Number of Ports: 2
- Number of Ports/Ways: 2
- Valve Type: Ball Valves
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Supplier: BI-TORQ® Valve Automation
Description: Features Full port 3-way NPT 316SS ball valve 1/2" through 2" ISO mounting pad for direct mount automation RTFE seats and seals L-port or T-port configurations Ideal for mixing, food and chemical applications 4-seat design for high cycling NPT or socket weld ends (clamp ends also available
- Valve Size: 0.5 to 2 inch
- Pressure Rating: 1,000 psi
- Number of Ports: 3
- Media Temperature: -40 to 450 F
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Supplier: BI-TORQ® Valve Automation
Description: Manual 3-Way Full Port Stainless Steel Ball Valve Features Full port 3-way SS ball valve 1/2" through 2" NPT or SW ends L-port and T-port design 4-seat design for high cycle applications ISO 5211 mounting pad for direct mount actuation 1000 PSI pressure rating Ideal for mixing
- Valve Size: 0.5 to 2 inch
- Pressure Rating: 1,000 psi
- Number of Ports: 3
- Media Temperature: -40 to 450 F
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Supplier: Aries Electronics, Inc.
Description: bottom surface of the device solder balls GENERAL SPECIFICATIONS BODY MATERIAL: PEEK or TORLON 1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe) ESTIMATED CONTACT LIFE: 500,000 cycles COMPRESSION SPRING-PROBES: heat-treated BeCu with 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ min.
- Operating Temperature: -55 to 150 C
- Socket Type: BGA, CSP, LGA, ZIP / SZIP
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Chengdu Fuyu Technology Co., Ltd
Description: workshops or special fields such as electronics and medical equipment, such as film, Discount, IC printing, CCD online testing, solder automation equipment. Series: FSL80 Stroke Range: 100mm~1500mm Position Accuracy: 0.05mm Max Speed: 300mm/s Max Load: 60kg Ball Screw: G1610
- Stroke or X-Axis Travel: 1.968505 to 47.24412 inch
- Y-Axis Travel: 1.968505 to 47.24412 inch
- Z-Axis Travel: 1.968505 to 47.24412 inch
- Rated Speed: 2.36220472440945 to 8.66141732283465 in/sec
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Supplier: Chengdu Fuyu Technology Co., Ltd
Description: CCD on-line detection, precise positioning detection of solder automation equipment, laser (laser cutting/laser marking/Laser engraving/laser drilling, etc.) precision assembly, precision machine tools, semiconductor production equipment, location detection, electronic production equipment,
- Stroke or X-Axis Travel: 1.968505 to 59.05515 inch
- Y-Axis Travel: 1.968505 to 59.05515 inch
- Z-Axis Travel: 1.968505 to 59.05515 inch
- Rated Speed: 13.7795275590551 to 19.6850393700788 in/sec
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Supplier: Allied Electronics, Inc.
Description: Clockwise rotation viewed from rotor. Electrical connection with LZ120 plug and cord set (sold separately), or soldered. Features: External Rotor Shaded-Pole Motor Impedance Protected Against Overloading Metal Housing and Impeller Mounting from Either Face Using Four 4.3 mm Holes Ground Lug on
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Supplier: Gullco International Limited
Description: ground rods and circulator ball bushings to provide 1-3/4" (44mm) of torch float. Supplied complete with hardened stainless steel ball assembly, 1-1/8" (29mm) sq. rack box, 12" (304mm) rack arm and swivel mounting clamp for attachment to Kat Travel Carriage arm.
- Equipment Type: Complete System
- Process Capability: Welding Equipment
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Supplier: Allied Electronics, Inc.
Description: Clockwise rotation viewed from rotor. Electrical connection with LZ 120 plug and cord set or soldered. Features: External Rotor Shaded-Pole Motor Impedance Protected Against Overloading Metal Housing and Impeller Air Exhausts Over Struts Mounting from Either Face Using Four 4.3 mm Holes Electrical
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Supplier: Allied Electronics, Inc.
Description: Clockwise rotation viewed from rotor. Electrical connection with LZ 120 plug and cord set or soldered. Features: External Rotor Shaded-Pole Motor Impedance Protected Against Overloading Metal Housing and Impeller Air Exhausts Over Struts Mounting from Either Face Using Four 4.3 mm Holes Electrical
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Supplier: Allied Electronics, Inc.
Description: Counterclockwise rotation viewed from rotor. Electrical connection with LZ120 plug and cord set (sold separately), or soldered. Features: 1-Inch Flat Axial Fans Metal Housing, Mineral Reinforced Plastic (PA) Impeller Internal Rotor Shaded Pole Motor Impedance Protected Against Overloading Air
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Supplier: DynaQuip Controls
Description: VBE2 series ball valves are designed for hydraulic applications where maintenance is key. Three-piece investment cast steel bodies and endcaps. Available in NPT threaded or socket weld end connections. Valves feature carbon-filled TFM seats, blowout-proof stems, and actuator mounting pad.
- Valve Size: 0.25 to 2 inch
- Pressure Rating: 1,000 psi
- Media Temperature: -20 to 425 F
- Valve Type: Ball Valves
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Supplier: Clark Solutions
Description: All model 83 open/close electrically actuated ball valves sizes 3/8" thru 2" have direct mounted unidirectional 90º turn actuators (115 Vac & 220 Vac, 12/24 AC & DC are reversing). The actuators are weatherproof (NEMA 4X), have a green lead for grounding, and all wire leads protrude from a
- Valve Size: 0.375 to 2 inch
- Pressure Rating: 150 psi
- Number of Ports: 2
- Media Temperature: 30 to 120 F
Find Suppliers by Category Top
Featured Products Top
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ALPHA HRL3 is a lead-free, low temperature, high reliability alloy for use application where low temperature processing is desired. ALPHA HRL3 is available in solder sphere format for ball mount application. The alloy was designed to exhibit improved drop shock and thermal (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
. It is supplied in a 153-ball FBGA package measuring approximately 11.5mm × 13mm × 1.0mm. The surface-mount package provides substantial storage capacity in a compact PCB footprint and (read more)
Browse Memory Chips Datasheets for ERSAELECTRONICS PTE. LTD.
More Information Top
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Developnent of solder bump fabrication in multicalp modules
[3] Shoichi Okuyama, Takeo Kanno, Tetsujf Nitta,etc " DEVELOPMENT OF AUTOMATIC HIGH-DENSITY SOLDER BALL MOUNTER " , i n Proc. OF 1991 JAPAN IEMT SYMPOSIUM, JUNE 26-28, 1991,pp.93 .
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Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials > CHIP- (WAFER)- LEVEL INTERCONNECTS WITH LEAD-FREE SOLDER BUMPS
As a matter of fact, most of the solder ball mounters (e.g., Shibuya, Vanguard, KME, Motorola, Fujitsu, Hitachi, and Toray) available today can place 300-μm solder balls.
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Microvias: For Low Cost, High Density Interconnects > Assembly of Flip Chip on PCB/Substrate
Also, because the solder bumps on the flip chip surface are very small (~100 μm), most of the conventional solder ball mounter cannot be used for reballing.
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Federal Register > Wednesday, February 11, 1998 > [63 FR 6956] Advice Concerning the Proposed Expansion of the Information Technology Agreement
Solder ball mounter for PCB/PWB assembly .
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Characteristics and reliability of fast-flow, snap-cure, and reworkable underfills for solder bumped flip chip on low-cost substrates
Similar phenomena are observed for Underfill B.Also, because the solder bumps on the flip chip surface are very small ( 100 m), therefore most of the conventional solder ball mounter cannot be used for reballing.
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Low-Cost Vacuum Molding Process for BGA Using a Large Area Substrate
After molding, solder balls are placed using a ball mounter .
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Manufacturing process for combination lead frame/TAB BGA
As the solder balls are reflowed prior to die attach, current assembly houses will never need the ball mounter to produce the TBGA.
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Mechanical reliability estimation for μBGA solder joints based on heating factor Qη
In that test, the μBGA CSP46T.75-DC24 balls (diameter 0.3 mm) were mounted on to FR-4 PCBs by a high speed flexible mounter (CASIO YCM-5500V) with a eutectic 63Sn37Pb solder , and a five zone gas convection oven (BTU …
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An Applicatin of Micro-Ball Wafer Bumping to Double Ball Bump for Flip Chip Interconnection
The solder balls were transferred and connected to the whole electrode-pads covered with UBMs of an 8 inch TEG wafers in one stroke using a fully automated micro ball mounter .
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Micro-ball wafer bumping for flip chip interconnection
Micro solder balls with the diameter ranging from 60 µm to 200 µm were first formed with a high level of accuracy and sphericity. … an 8-inch wafer in one stroke using a fully automated micro ball mounter , which was newly …
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