-
Supplier: Microchip Technology, Inc.
Description: +95°C. In addition, this device has an internal 256 Byte EEPROM which can be used to store memory module and vendor information. Additional Features Meets JEDEC Specification JC42.4 Temperature Sensor + 2 Kbit Serial EEPROM EEPROM for Serial Presence Detect (SPD) Optimized for
- Operating Temperature: -40 to 125 C
- Memory Category: EEPROM
- Features: Other
- Package Type: SSOP
-
Supplier: ROHM Semiconductor USA, LLC
Description: A serial EEPROM(Electrically Erasable Programmable Read Only Memory) is non-volatile memory that can be overwritten electrically, in units of bytes, and is most suitable for data storage use. ROHM's high reliability serial EEPROMs are among the top of their class. They command a large
- Density: 2 kbits
- Number of Words: 256 k
- Bits per Word: 8 bits
- Operating Current: 2 mA
-
Supplier: ROHM Semiconductor GmbH
Description: A serial EEPROM(Electrically Erasable Programmable Read Only Memory) is non-volatile memory that can be overwritten electrically, in units of bytes, and is most suitable for data storage use. ROHM's high reliability serial EEPROMs are among the top of their class. They command a large
- Density: 2 kbits
- Number of Words: 256 k
- Bits per Word: 8 bits
- Operating Current: 2 mA
-
-
Supplier: Integrated Device Technology
Description: The TSE2004GB2 is a digital temperature sensor with integrated 4 Kbit EEPROM for memory modules. It features accuracy up to ±0.5°C was designed to target applications demanding highest level of temperature readout.
- Input (Supply) Voltage: 2.5 to 3.3 volts
- Operating Temperature: 0 to 70 C
- Sensor Type: Temperature Sensor
-
Supplier: ERSAELECTRONICS PTE. LTD.
Description: datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include SOIC. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, SOIC, Memory IC and Storage Component, Memory
- Operating Current: 30 mA
- Features: Other
- Package Type: SOIC
-
Supplier: ERSAELECTRONICS PTE. LTD.
Description: EEPROM Serial 4-Kb SPD for DDR4 DIMM 4-Kb Serial SPD EEPROM for DDR4 DIMM, 4000-REEL Product overview: N34C04MU3ETG from onsemi is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and
- Density: 4 kbits
- Bits per Word: 8 bits
- Operating Current: 1 mA
- Access Time: 350 ns
-
Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 4Gb. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 4Gb, Memory IC and Storage Component, Memory ICs Products.
-
Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 8Gb. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 8Gb, Memory IC and Storage Component, Memory ICs Products.
-
Supplier: Microchip Technology, Inc.
Description: in a variety of space-saving packaging options. The AT34C02D is designed to support the JEDEC EE1002 and EE1002A Serial Presence Detect (SPD) function used in DDR, DDR2, and DDR3 Dual Inline Memory Modules (DIMM). In order to comply with this standard, the device includes a
- Density: 2 kbits
- Data Rate: 1 MHz
- Endurance: 1,000,000 Write/Erase Cycles
- Operating Temperature: -40 to 85 C
-
Supplier: Microchip Technology, Inc.
Description: a variety of space-saving packaging options with an operating range of 1.7 to 3.6V. The AT34C04 is tailored specifically for DRAM memory modules with Serial Presence Detect (SPD). The device incorporates a Reversible Software Write Protection (RSWP) feature enabling the
- Density: 4 kbits
- Data Rate: 1 MHz
- Endurance: 1,000,000 Write/Erase Cycles
- Supply Voltage: 1.8 V, 2.5 V, 2.7 V, 3 V, 3.3 V, 3.6 V
-
Supplier: Microchip Technology, Inc.
Description: +75°C to +95°C. In addition, this device has an internal 512 Byte EEPROM which can be used to store memory module and vendor information. Additional Features Meets JEDEC Specification- JC42.4-TSE2004B1 Temperature Sensor with 4 Kbit Serial EEPROM for Serial Presence Detect (SPD)
- Operating Temperature: -40 to 125 C
- Memory Category: EEPROM
- Features: Other
-
Supplier: Infineon Technologies AG
Description: Designers who used this product also designed with TLE8242-2L | Constant current control IC for transmission FS05MR12A6MA1B | Silicon Carbide CoolSiC™ MOSFET Modules TLE42764GV | OPTIREG™ linear voltage regulators (LDO) FS03MR12A6MA1B | Silicon Carbide CoolSiC™ MOSFET Modules
- Operating Temperature: -40 to 150 C
- Features: Other
Find Suppliers by Category Top
Featured Products Top
-
Our Custom Black Aluminum Heat Sink is engineered to deliver superior thermal management for high-power memory modules, combining precision design with advanced materials. With compact dimensions of (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
The SUMMIT 2629 integrates novel power amplifiers, low noise amplifiers, T/R switching, beamformers, calibration, gain control, beam table memory, temperature and power telemetry, and high-speed SPI control for a front-end module with optimal partitioning for 5G infrastructure. The (read more)
Browse RF Modules Datasheets for Richardson RFPD -
-generating components and heat sinks, reducing air pockets and improving heat transfer efficiency. In AI smart speakers, they help manage heat from chips, amplifiers, and memory modules in tight internal spaces. In (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
improve heat transfer across component-to-heatsink interfaces. With thermal conductivity up to **45.0 W/m·K**, CSF45 helps dissipate heat from devices such as **5G base station RRUs, chips, memory modules, control boards, relays, shunts, and hard drives**. Its high compressibility (read more)
Browse Carbon, Graphite, and Diamond Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
architecture, this FPGA enables dual 5-LUT output mode, supporting multifunctional roles such as distributed RAM or shift registers, maximizing resource reuse in compact designs. Its configurable on-chip memory with dual-port operation, optional ECC, byte (read more)
Browse Field-Programmable Gate Arrays (FPGA) Datasheets for Win Source Electronics -
The W25Q128JVSIQ is a 128Mbit, equivalent to 16MB, serial NOR Flash memory manufactured by Winbond Electronics. It is designed to provide reliable, high-speed, non-volatile storage in systems where board space, available microcontroller pins (read more)
Browse Memory Chips Datasheets for ERSAELECTRONICS PTE. LTD. -
manufacturing services specializing in complex micro- and optoelectronic modules and systems. Founded in 2000, AEMtec offers a broad technology portfolio spanning wafer back-end services, chip-on-board, flip chip, 3D integration and opto packaging, serving blue-chip customers across the semiconductor (read more)
Browse Device Programming Services Datasheets for Micross Components, Inc. -
Imperative For years, 156.25MHz served as the mainstream clock frequency for optical modules, adequately supporting 10G, 40G, and 100G traditional interconnect scenarios. However, as AI compute clusters evolve from 800G to 1.6T and 3.2T architectures, single-channel transmission rates (read more)
Browse Oscillators Datasheets for Interquip Electronics Co., Ltd.
More Information Top
Indicates content that may require registration and/or purchase.
-
Question on buy new ram for intel Macbook Pro - MacRumors Forums
Apple doesn't define composition, but we assume it to mean the number of chips, the organization of the chips into rows and columns of memory , and the SPD programming on the module .
-
SDRAM Cas Latency
The information is also stored inside a " SPD " chip , a small 6mm chip mounted on one corner of the memory module .
-
Dynamic memory-based physically unclonable function for the generation of unique identifiers and true random numbers
On every DDR3 module , a serial present detect ( SPD ) EEPROM chip is located to store settings of the used memory chips [10].
-
Microchip Technology Announces SPD EEPROMs For DDR2 And DDR3 DIMM Modules
When combined with the already-announced MCP9805 memory module digital temperature sensor and MCP98242 temperature sensor with SPD EEPROM, the 34XX02 devices mean Micro chip now provides a complete family of devices for the SPD and temperature needs of DRAM manufacturers.
-
http://www.nxp.com/documents/leaflet/75015961.pdf
Key features 4 Monitor local temperature within ±1 °C (max) 4 On- chip 2-kbit EEPROM for SPD (SE97 only) 4 Compliant JEDEC JC42.4 4 Compatible … … write protection 4 TSSOP8 and HVSON8 packages Applications 4 Memory modules 4 Notebooks 4 Servers …
-
Affective Computing and Intelligent Interaction
2) SPD Module SPD module makes the FC-DMC NIC holding the same stability of the ordinary memory , and makes the FC-DMC NIC being identified by the North Bridge or CPU. We have done the VHDL programming to simulate the SPD chip .
-
A case for exploiting subarray-level parallelism (SALP) in DRAM
On every DRAM module lies a separate 256-byte EEPROM, called the serial presence detect ( SPD ), which contains infor- mation about both the chips and the module , such as timing, capacity, organization, etc. [19]. … system boot time, the SPD is read by the BIOS, so that the memory controller can correctly …
-
Trustworthy Computing and Services
The SPD chip identifies the module to the BIOS during POST so the Motherboard knows its characteristics and timings that can be used. In the secure memory system, an User- Programmable secret in stored in the SPD device protected register.
-
IT Inventory and Resource Management with OCS Inventory NG 1.02
There are those exceptions when the memory module manufacturer does a poor job at filling in the Serial presence detect ( SPD ) information into the EEPROM of the chips .
-
http://www.intel.com/content/dam/doc/datasheet/e7210-mch-datasheet.pdf
… of two DIMMs per channel, with each DIMM having one or two rows — Up to 4 GB system memory — Up to 16 … … using CKE(S3) — SPD (Serial Presence Detect) Scheme … … DDR266, DDR333, DDR400 DIMM modules • DDR channel operation … … operation ■ MCH Package: — 42.5 mm x 42.5 mm Flip Chip Ball Grid Array …