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Supplier: ROHM Semiconductor USA, LLC
Description: share and are available in a range of capacities, bus interfaces (Microwire, I²C, SPI), operating voltages (1.8V to 5.5V, 2.5V to 5.5V) and package types, making them ideal for battery powered devices. The entire series are both lead-free and RoHS-compliant.This Family is Plug & Play memory
- Bits per Word: 8 bits
- Data Retention: 40 years
- Density: 2 kbits
- Endurance: 106 Write/Erase Cycles
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Supplier: ROHM Semiconductor USA, LLC
Description: share and are available in a range of capacities, bus interfaces (Microwire, I²C, SPI), operating voltages (1.8V to 5.5V, 2.5V to 5.5V) and package types, making them ideal for battery powered devices. The entire series are both lead-free and RoHS-compliant.This Family is Plug & Play memory
- Bits per Word: 8 bits
- Data Retention: 40 years
- Density: 2 kbits
- Endurance: 106 Write/Erase Cycles
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Supplier: ROHM Semiconductor GmbH
Description: share and are available in a range of capacities, bus interfaces (Microwire, I²C, SPI), operating voltages (1.8V to 5.5V, 2.5V to 5.5V) and package types, making them ideal for battery powered devices. The entire series are both lead-free and RoHS-compliant. This Family is Plug & Play memory
- Bits per Word: 8 bits
- Data Retention: 40 years
- Density: 2 kbits
- IC Package Type: Other
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Supplier: ROHM Semiconductor GmbH
Description: share and are available in a range of capacities, bus interfaces (Microwire, I²C, SPI), operating voltages (1.8V to 5.5V, 2.5V to 5.5V) and package types, making them ideal for battery powered devices. The entire series are both lead-free and RoHS-compliant. This Family is Plug & Play memory
- Bits per Word: 8 bits
- Data Retention: 40 years
- Density: 2 kbits
- IC Package Type: TSSOP
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Supplier: Microchip Technology, Inc.
Description: Microchip Technology Inc.’s MCP98243 digital temperature sensor converts temperature from -40°C and +125°C to a digital word. This sensor meets JEDEC Specification JC42.4 Mobile Platform Memory Module Thermal Sensor Component. It provides an accuracy of
- IC Package Type: SSOP, Other
- Memory Category: EEPROM
- Operating Temperature: -40 to 125 C
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Supplier: Integrated Device Technology
Description: The TSE2004GB2 is a digital temperature sensor with integrated 4 Kbit EEPROM for memory modules. It features accuracy up to ±0.5°C was designed to target applications demanding highest level of temperature readout.
- Input (Supply) Voltage: 2.5 to 3.3 volts
- Operating Temperature: 0.0 to 70 C
- Sensor Type: Temperature Sensor
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Description: 4 Kbit I2C bus / SMBus Serial EEPROM, SPD for DRAM Modules (DDR4)
- Access Time: 350 ns
- Density: 32 kbits
- IC Package Type: Other
- Memory Category: DRAM, EEPROM
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Supplier: Microchip Technology, Inc.
Description: is available in a variety of space-saving packaging options with an operating range of 1.7 to 3.6V. The AT34C04 is tailored specifically for DRAM memory modules with Serial Presence Detect (SPD). The device incorporates a Reversible Software Write Protection (RSWP) feature
- Data Rate: 1 MHz
- Density: 4 kbits
- Endurance: 1.00E6 Write/Erase Cycles
- IC Package Type: SOIC, SSOP, Other
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Supplier: Microchip Technology, Inc.
Description: is available in a variety of space-saving packaging options. The AT34C02D is designed to support the JEDEC EE1002 and EE1002A Serial Presence Detect (SPD) function used in DDR, DDR2, and DDR3 Dual Inline Memory Modules (DIMM). In order to comply with this standard, the device
- Data Rate: 1 MHz
- Density: 2 kbits
- Endurance: 1.00E6 Write/Erase Cycles
- IC Package Type: SOIC, SSOP, Other
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Supplier: Microchip Technology, Inc.
Description: The Microchip AT30TSE004A is a 1.7V rated minimum operating voltage combination Serial EEPROM and temperature sensor device containing 4096-bits of EEPROM organized as 512-bytes of eight bits each. The Serial EEPROM operation is tailored specifically for DRAM memory modules with Serial
- IC Package Type: Other
- Memory Category: EEPROM
- Operating Temperature: -20 to 125 C
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Question on buy new ram for intel Macbook Pro - MacRumors Forums
Apple doesn't define composition, but we assume it to mean the number of chips, the organization of the chips into rows and columns of memory , and the SPD programming on the module .
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SDRAM Cas Latency
The information is also stored inside a " SPD " chip , a small 6mm chip mounted on one corner of the memory module .
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Dynamic memory-based physically unclonable function for the generation of unique identifiers and true random numbers
On every DDR3 module , a serial present detect ( SPD ) EEPROM chip is located to store settings of the used memory chips [10].
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Microchip Technology Announces SPD EEPROMs For DDR2 And DDR3 DIMM Modules
When combined with the already-announced MCP9805 memory module digital temperature sensor and MCP98242 temperature sensor with SPD EEPROM, the 34XX02 devices mean Micro chip now provides a complete family of devices for the SPD and temperature needs of DRAM manufacturers.
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http://www.nxp.com/documents/leaflet/75015961.pdf
Key features 4 Monitor local temperature within ±1 °C (max) 4 On- chip 2-kbit EEPROM for SPD (SE97 only) 4 Compliant JEDEC JC42.4 4 Compatible … … write protection 4 TSSOP8 and HVSON8 packages Applications 4 Memory modules 4 Notebooks 4 Servers …
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Affective Computing and Intelligent Interaction
2) SPD Module SPD module makes the FC-DMC NIC holding the same stability of the ordinary memory , and makes the FC-DMC NIC being identified by the North Bridge or CPU. We have done the VHDL programming to simulate the SPD chip .
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A case for exploiting subarray-level parallelism (SALP) in DRAM
On every DRAM module lies a separate 256-byte EEPROM, called the serial presence detect ( SPD ), which contains infor- mation about both the chips and the module , such as timing, capacity, organization, etc. [19]. … system boot time, the SPD is read by the BIOS, so that the memory controller can correctly …
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Trustworthy Computing and Services
The SPD chip identifies the module to the BIOS during POST so the Motherboard knows its characteristics and timings that can be used. In the secure memory system, an User- Programmable secret in stored in the SPD device protected register.
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IT Inventory and Resource Management with OCS Inventory NG 1.02
There are those exceptions when the memory module manufacturer does a poor job at filling in the Serial presence detect ( SPD ) information into the EEPROM of the chips .
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http://www.intel.com/content/dam/doc/datasheet/e7210-mch-datasheet.pdf
… of two DIMMs per channel, with each DIMM having one or two rows — Up to 4 GB system memory — Up to 16 … … using CKE(S3) — SPD (Serial Presence Detect) Scheme … … DDR266, DDR333, DDR400 DIMM modules • DDR channel operation … … operation ■ MCH Package: — 42.5 mm x 42.5 mm Flip Chip Ball Grid Array …