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Supplier: Primarius
Description: , NanoSpice handles generic circuit simulation with 50M+ elements circuit size, an incomparable advantage no other SPICE simulator has, and delivers better performance as compared to other parallel SPICE simulators for large simulation jobs. NanoSpice also has an
- Operating System: Linux
- Use: Professional
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Supplier: Primarius
Description: NanoSpice Giga™ is the industry's first and only GigaSpice, designed for accurate verification and signoff of advanced memory designs, an area where FastSPICE is meeting fundamental limitations. With its innovative parallel simulation engine built on a big data architecture,
- Operating System: Linux
- Use: Professional
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Supplier: Primarius
Description: BSIMProPlus™ is industry's leading SPICE modeling platform for advanced semiconductor devices. As the technology and market leader for SPICE modeling, it has been adopted as the standard modeling tool by over 100 worldwide leading semiconductor companies for over
- Use: Professional
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Description: An expert guide to understanding and making optimum use of BSIM Used by more chip designers worldwide than any other comparable model, the Berkeley Short-Channel IGFET Model (BSIM) has, over the past few years, established itself as the de facto standard MOSFET SPICE
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Supplier: Primarius
Description: impact of these evaluation and benchmarking results on circuit designs, providing further guidance or assistance to improve them.ME-Pro offers pre-configured projects with hundreds of check items and great computation efficiency through a built-in parallel SPICE simulator. It allows easy
- Use: Professional
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Supplier: Autec Power Inc.
Description: “The Spice” is another choice in the Industrial Power Supplies category and is a bit more versatile of a unit when compared to many other models. This unit is a DC-DC brick power supply with a power rating of 20W, and input voltage of 9–36Vdc; 18–75Vdc, an output current
- DC Input Voltage: 9 to 75 volts
- DC Output Power: 20 watts
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Supplier: Accuris
Description: Medical device software - Medical SPICE - Process assessment model
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Supplier: Accuris
Description: Medical device software - Medical SPICE Process assessment model
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Supplier: Accuris
Description: Medical device software - Medical SPICE - Process assessment model - Corrigendum concerning standard VDI 5702 Part 1:2025-05 (Draft)
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Supplier: COMSOL, Inc.
Description: system, the AC/DC Module also lets you couple your component-level finite element model to a SPICE model of a complete electrical system. You can then extend your analysis by running a single simulation of a mixed system of lumped and high-fidelity models.
- Deployment: Web-Based
- Operating System: Windows, MAC, Linux, Chrome
- Source Code: Proprietary
- Use: Professional
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Supplier: COMSOL, Inc.
Description: interaction between the plasma and an external circuit is an important part of understanding the overall characteristics of a discharge. The Plasma Module provides tools to add circuit elements directly to a 1D, 2D or 3D model, or import an existing SPICE netlist into the model.
- Deployment: Web-Based
- Operating System: Windows, MAC, Linux, Chrome
- Source Code: Proprietary
- Use: Professional
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Supplier: COMSOL, Inc.
Description: The design and modeling of microscale electro-mechanical systems (MEMS) is a unique engineering discipline. At small length scales, designs must consider the effects of several physical phenomena. For example: electromagnetic-stru ctural, thermal-structural, and fluid
- Deployment: Web-Based
- Operating System: Windows, MAC, Linux, Chrome
- Source Code: Proprietary
- Use: Professional
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Supplier: Sonnet Software, Inc.
Description: combinations with vias, vertical metal sheets (z-directed strips), and any number of layers of metal traces embedded in stratified dielectric material. The Sonnet® Suites™ develop precise RF models (S-, Y-, Z-parameters or extracted SPICE model) for planar circuits and antennas
- Use: Educational, Professional
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Supplier: Sonnet Software, Inc.
Description: combinations with vias, vertical metal sheets (z-directed strips), and any number of layers of metal traces embedded in stratified dielectric material. The Sonnet® Suites™ develop precise RF models (S-, Y-, Z-parameters or extracted SPICE model) for planar circuits and antennas
- Use: Educational, Professional
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Supplier: Sonnet Software, Inc.
Description: combinations with vias, vertical metal sheets (z-directed strips), and any number of layers of metal traces embedded in stratified dielectric material. The Sonnet® Suites™ develop precise RF models (S-, Y-, Z-parameters or extracted SPICE model) for planar circuits and antennas
- Use: Educational, Professional
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Supplier: Sonnet Software, Inc.
Description: combinations with vias, vertical metal sheets (z-directed strips), and any number of layers of metal traces embedded in stratified dielectric material. The Sonnet® Suites™ develop precise RF models (S-, Y-, Z-parameters or extracted SPICE model) for planar circuits and antennas
- Use: Educational, Professional
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Supplier: CST - Computer Simulation Technology
Description: specific CAD files and the extraction of SPICE parameters enhance design possibilities and save time. In addition, CST MWS is embedded in various industry standard workflows through the CST design environment. CST MICROWAVE STUDIO® is seen by an increasing number of engineers as an industry
- Source Code: Proprietary
- Use: Professional
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Description: formats or languages such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default simulation environment to cover all the conducted emissions. This standard also specifies requirements for information that shall be incorporated in each ICEM-CE model or
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Supplier: Seedburo Equipment Company
Description: The Model M Roller Mill from Seedburo is a scaled down version of the industrial mill, and is specifically designed for customers with easy-to-grind products and low tonnage requirements. The Model M mills are commonly used for feeds and cereal grains, spices, nuts, plastics and
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Supplier: Seedburo Equipment Company
Description: The Model M Roller Mill from Seedburo is a scaled down version of the industrial mill, and is specifically designed for customers with easy-to-grind products and low tonnage requirements. The Model M mills are commonly used for feeds and cereal grains, spices, nuts, plastics and
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Supplier: Seedburo Equipment Company
Description: The Model M Roller Mill from Seedburo is a scaled down version of the industrial mill, and is specifically designed for customers with easy-to-grind products and low tonnage requirements. The Model M mills are commonly used for feeds and cereal grains, spices, nuts, plastics and
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Supplier: Seedburo Equipment Company
Description: The Model M Roller Mill from Seedburo is a scaled down version of the industrial mill, and is specifically designed for customers with easy-to-grind products and low tonnage requirements. The Model M mills are commonly used for feeds and cereal grains, spices, nuts, plastics and
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Description: Describes a model for EMI simulation due to IC internal activities. Gives more accurately the electromagnetic emissions of electronic equipment by taking into account the influence of internal activities. Gives general data which could be implemented in different format such as IBIS, IMIC,
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Supplier: CSA Group
Description: Describes a model for EMI simulation due to IC internal activities. Gives more accurately the electromagnetic emissions of electronic equipment by taking into account the influence of internal activities. Gives general data which could be implemented in different format such as IBIS, IMIC,
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Supplier: NSI Industries LLC
Description: 6 AWG MIN. CONDUCTOR SIZE 4/0 AWG MAX. CONDUCTOR SIZE ALUMINUM/COPPER CONDUCTOR MATERIAL UL (CANADA AND US) APPROVAL 600 V VOLTAGE RATING ALUMINUM ALLOY BODY MATERIAL NON-INSULATED INSULATION TYPE 2 SCREW(S) NUMBER OF PORTS 2 TEMPERATURE RATING 90 DEG C APPLICATION WIRE SPICING SR
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Supplier: NSI Industries LLC
Description: -INSULATED INSULATION TYPE 4 SCREW(S) NUMBER OF PORTS 2 TEMPERATURE RATING 90 DEG C APPLICATION WIRE SPICING SR MODEL
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Supplier: NSI Industries LLC
Description: 250 KCMIL MIN. CONDUCTOR SIZE 750 KCMIL MAX. CONDUCTOR SIZE ALUMINUM/COPPER CONDUCTOR MATERIAL UL (CANADA AND US) APPROVAL 600 V VOLTAGE RATING ALUMINUM ALLOY BODY MATERIAL NON-INSULATED INSULATION TYPE 4 SCREW(S) NUMBER OF PORTS 2 TEMPERATURE RATING 90 DEG C APPLICATION WIRE SPICING 750
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Supplier: NSI Industries LLC
Description: 3/0 AWG MIN. CONDUCTOR SIZE 500 KCMIL MAX. CONDUCTOR SIZE ALUMINUM/COPPER CONDUCTOR MATERIAL UL (CANADA AND US) APPROVAL 600 V VOLTAGE RATING ALUMINUM ALLOY BODY MATERIAL NON-INSULATED INSULATION TYPE 4 SCREW(S) NUMBER OF PORTS 2 TEMPERATURE RATING 90 DEG C APPLICATION WIRE SPICING SR
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Supplier: Richardson RFPD
Description: typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime.
- Diode Type: PIN Diodes, RF Diodes
- VR: 50 volts
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Supplier: Richardson RFPD
Description: typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime.
- Diode Type: PIN Diodes, RF Diodes
- VR: 50 volts
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to frequencies
- Diode Type: Varactor Diodes
- VR: 30 volts
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to frequencies
- Diode Type: Varactor Diodes
- VR: 30 volts
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to frequencies
- VR: 30 volts
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Supplier: Skyworks Solutions, Inc.
Description: The SMV1405–SMV1413 series of bare die, epoxy and hermetic packaged silicon abrupt junction varactor diodes is designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to frequencies
- VR: 30 volts
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Description: Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a
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Supplier: Infineon Technologies AG
Description: free lead plating, RoHs compliant Complete product spectrum and SPICE models Benefits Low switching loses on competitive price Improved controllability Humidity ruggedness improvement Easy to design in products – drop in SMD
- Package Type: SOT223, Other
- Packing Method: Tape Reel, Other
- Switching Speed: 1 to 20 kHz
- TJ: -40 to 150 C
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Supplier: Infineon Technologies AG
Description: ) 100% Avalanche tested Simulation/ SPICE-Model Applications Automotive secondary power distribution unit Automotive USB power delivery - Head unit Body electronics and power distribution Designers who used this product
- Package Type: Other
- Packing Method: Tape Reel, Other
- Polarity: N-Channel, Other
- TJ: -55 to 175 C
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Supplier: Infineon Technologies AG
Description: Infineon’s advanced trench technology, which is a benchmark for next generation automotive applications in regards to energy efficiency, CO2 reduction and e-drives. Simulation/ SPICE-Model Applications 48 V to 12 V DC-DC converter
- Package Type: TO-220, Other
- Packing Method: Shipping Tube / Stick Magazine, Other
- Polarity: N-Channel, Other
- TJ: -55 to 175 C
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Supplier: Infineon Technologies AG
Description: loads control switching (3-phase and H-bridge motors, electric pumps, etc. especially in combination with PWM control). Body applications Simulation/ SPICE-Model Applications Active suspension control Automotive body control module (BCM
- Package Type: TO-251 / TO-252, Other
- Packing Method: Tape Reel, Other
- Polarity: N-Channel, Other
- TJ: -55 to 175 C
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Supplier: Hyster Company
Description: enter the cab of these trucks and close the door, this is your space. The ComforCab II™ offered on our empty container handlers is the same proven cab fitted on the all other Hyster "HD" models. With the superior ergonomic design of the cab and controls, operator fatigue is greatly reduced
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Supplier: SAE International
Description: SPICE 2x compliant process. A timing study performed during dynamometer testing detailing the differences between the original hand-code and the model-based code will be presented.
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The OFS Type-2 seal model is ideal for blenders, mixers, cookers, conveyors and similar rotating equipment used in the food, pharmaceutical, chemical, plastics, metals, and other bulk process industries. The OFS Type-2 seal model is used on horizontal, inclined, and top entering shafts for split (read more)
Browse Mechanical Seals Datasheets for Woodex MECO Industries -
XF is full-wave 3D electromagnetic modeling software for analyzing EM field simulation in complex, high-fidelity devices. XF's unique collection of features simplifies the analysis of even the most complex and massive problems. (read more)
Browse Modeling and Simulation Software Datasheets for Remcom (USA)
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Improved Spice Models of Aluminum Electrolytic Capacitors for Inverter Applications
public-domain Spice models do not accurately account for this behavior. In this paper, a physics-based approach is used to develop an improved impedance model that is interpreted both in pure Spice circuit models and in math functions.
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About Thermal Dynamic Model
Foundations of Electronic Circuit Simulation. In this article, we give a brief explanation of a Thermal Dynamic Model, which is another SPICE model used in thermal simulations.
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Microchip's Op Amp SPICE Macro Models (.pdf)
The SPICE macro models for Microchip?s operational amplifiers (op amps) aid in the design and analysis of various circuits by allowing for detailed simulation of the circuit being designed. This application note covers the function and use of Microchip's op amp SPICE macro models. It does
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Spice models directly in the frequency domain, a discovery that could change the way RF engineers use simulation. ASIC vendors mull cost issues A panel chaired by EE Times editor in chief Brian Fuller explored the issue of ASIC cost at the Fabless Semiconductor Association Suppliers' Expo
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Spice models directly in the frequency domain, a discovery that could change the way RF engineers use simulation. ASIC vendors mull cost issues A panel chaired by EE Times editor in chief Brian Fuller explored the issue of ASIC cost at the Fabless Semiconductor Association Suppliers' Expo here
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
startup Xpedion Design Systems ntroduced a transistor-level phase-locked loop solution for verifying complete closed loop noise and jitter. Circuit simulator optimized for sub-circuit type Spice models Intellectual property characterization and circuit simulation software provider Legend Design
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
verification Claiming an industry first, EDA startup Xpedion Design Systems ntroduced a transistor-level phase-locked loop solution for verifying complete closed loop noise and jitter. Circuit simulator optimized for sub-circuit type Spice models Intellectual property characterization and circuit simulation
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Circuit simulation software vendor Silvaco International Inc. (Santa Clara, Calif.) has integrated the HiSIM-RF surface potential SPICE model developed at Hiroshima University into its SmartSpice circuit simulator, SmartSpice-RF harmonic balance-based simulator, and Harmony-AMS mixed-signal simulator
More Information Top
Indicates content that may require registration and/or purchase.
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Semiconductor Modeling
Examples of SPICE Models and Parameters .
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Analysis of Multiconductor Transmission Lines 2nd Edition Complete Document
13.1 Representation of Lossless Lines with the SPICE Model 696 .
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NAVAL POSTGRADUATE SCHOOL
CMOS PFET and NFET SPICE model definitions .
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On-chip High-Voltage Generator Design
V2 and VTH ¼ 0.2 V fits the SPICE model well at VGS of 0.2 V and above.
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Software Process Improvement and Capability Determination
Current and future work is considered including the timeframe for the release of a full version of the Medi SPICE model .
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Software Process Improvement and Capability Determination
A Case Study on Process Composition Using Enterprise SPICE Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Low-Voltage SOI CMOS VLSI Devices and Circuits
7 PD SOI-Technology SPICE Models 377 3 77 3 78 .
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Reliable SPICE Simulations of Memristors, Memcapacitors and Meminductors
Nonethe- less, more and more SPICE models are being considered with different levels of complexity [14], [15], [16], [17], [18], [19], [20], [21], [22].