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Supplier: Pfaltz & Bauer, Inc.
Description: Tantalum Nitride 97%
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Supplier: Materion Corporation
Description: Aluminum Nitride, AlN Boron Nitride, BN Niobium Nitride, NbN Silicon Nitride, Si3N4 Tantalum Nitride, TaN Titanium Nitride, TiN Vanadium Nitride, VN Zirconium Nitride, ZrN Si3N4/TiN
- Materials Processed: Nitrides / TiN
- Type: CVD / Chemical Precursor
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Supplier: GFS Chemicals, Inc.
Description: ITEM#:A7785 TaN CAS#:12033-62-4 F.W.:194.95 NFPA#: Specific Gravity: 0.000 DOT:NR Descriptions: Specification TEST Properties No properties.
- Material Type: Other
- Type: Powder / Aggregate (Grain / Grog)
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Supplier: Aremco Products, Inc.
Description: Aremco offers a wide range of high purity metals and ceramics that are applicable to scientists and engineers involved in basic research and applied product development.
- Inorganic Compounds: Other
- Ionic Component: Transition Metals (Ti, Fe, Ni, etc)
- Non-Metal Compounds: All Non-Metals, Nitrides
- State of Matter: Powder
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Non-Metal Compounds: All Non-Metals, Nitrides
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Non-Metal Compounds: All Non-Metals, Nitrides
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Supplier: Accuris
Description: RESISTOR, CHIP, FIXED, FILM, TANTALUM NITRIDE, STYLE 0505
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Supplier: Accuris
Description: RESISTOR, CHIP, FIXED, FILM, TANTALUM NITRIDE, STYLE 1050
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Supplier: American Welding Society (AWS)
Description: , Tantalum, and Tungsten BHCM8 M-9 Magnesium and Magnesium Alloys BHCM9 M-10 Precious Metals: Gold, Silver, Platinum, and Palladium BHCM10 M-11 Alumina BHCM11 M-12 Ceramics BHCM12 M-13 Cemented Carbides and Cermets BHCM13
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Supplier: American Welding Society (AWS)
Description: , Tantalum, and Tungsten BHCM8 M-9 Magnesium and Magnesium Alloys BHCM9 M-10 Precious Metals: Gold, Silver, Platinum, and Palladium BHCM10 M-11 Alumina BHCM11 M-12 Ceramics BHCM12 M-13 Cemented Carbides and Cermets BHCM13
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Supplier: Henkel Corporation - Electronics
Description: (Known as Eccobond DP1005 ) LOCTITE ECCOBOND DP 1005 jet dispensable die attach adhesive is designed for bonding low energy plastic on metal substrates. It is chemical resistant and has good adhesion to Tantalum Oxide and Silicon Nitride passivation layers.
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND DP 1005, Die Attach Epoxy LOCTITE® ECCOBOND DP 1005 jet dispensable die attach adhesive is designed for bonding low energy plastic on metal substrates. Chemical resistant Jet dispensable Good adhesion to Tantalum Oxide and Silicon Nitride passivation layers
- Viscosity: 500 cP
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Supplier: MACOM
Description: The Thin Film Resistors offer proven stability, low noise and excellent TCR of Tantalum Nitride in a large selection of resistance values and tolerances. Low Noise Excellent TCR Small Size Tight Tolerance to + .1% Resistor Device Type
- Configuration: Single Resistor
- Technology / Construction: Thin Film
- Tolerance: 0.1000 +/- %
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Supplier: Top Seiko Co., Ltd.
Description: We perform thread cutting on brittle materials such as alumina, zirconia, and boron nitride, and on metals with a high melting point such as molybdenum and tungsten. If you have an order for socket head screws, unified thread screws, or other special-shaped screws, feel free to contact us. We
- Location: East Asia / Pacific Only
- Materials: Other
- Services: CAD / CAM Support, Just-in-Time Delivery, Prototype Services, Low Volume Production, High Volume Production
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Supplier: Molex Signal Tech Industrial Ltd.
Description: , tantalum nitride or nichrome thin film resist materials. The TS04, TS05, TS07, TS09, TT9, KFA and HPCA series use thick film resistor elements. The devices are available for shipping in tray or tape and reel packaging. Surface mount chip attenuators are designed for direct
- Attenuation: 0.0 to 30 dB
- Attenuator Type: Fixed
- Frequency Range: 50 GHz
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Supplier: ASTM International
Description: 1.1 This practice covers the de-agglomeration of refractory metal powders and their compounds in preparation for particle size analysis. 1.2 Experience has shown that this practice is satisfactory for the de-agglomeration of elemental tungsten, molybdenum, rhenium, and tantalum metal
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Supplier: Top Seiko Co., Ltd.
Description: extremely hard materials. Materials we machine include: Alumina, Sapphire, Aluminum Nitride, Silicon Nitride, Silicon Carbide, MMC(Metal Matrix Composites)*2, CMC(Ceramic Matrix Composites), Zirconia, Steatite, Silicon, Glasses (TEMPAX Float®, Corning Glass ULE®, Fused Quartz / Fused
- Location: East Asia / Pacific Only
- Machining Capabilities: Drilling, Milling, Turning, Screw Machining, Broaching, Deep Hole Drilling, Surface Grinding, Wire EDM
- Materials: Ceramics, Composites, Glass, Glass Ceramics, Ultra-hard Materials, Quartz, Other
- Services: Just-in-Time Delivery, Prototype Services, Low Volume Production, High Volume Production, CAD / CAM Support
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Supplier: Top Seiko Co., Ltd.
Description: Top Seiko Co., Ltd. offers the most advanced CNC machining services for all these ultra-hard but brittle materials such as Ceramics, Glasses and Refractory Metals such as Tungsten, Molybdenum and Tantalum. We machine not only Machinable Ceramics, but also other Technical Ceramics
- Additional Services: Assembly Services, CAD / CAM Support, Design Assistance, Just-in-Time Delivery, Prototype Services, Low Volume Production, High Volume Production
- Capabilities: Deep Hole Drilling, Drilling, Milling, Screw Machining, Turning, Wire EDM
- Diameter Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48"
- Length Capacity: Less than 1", 1" - 3", 3" - 6", 6" - 48"
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Supplier: ASTM International
Description: 1.1 This test method covers the determination of particle size distributions of refractory metal powders. Experience has shown that this test method is satisfactory for the analysis of elemental tungsten, tungsten carbide, molybdenum, and tantalum powders, all with an as-supplied Fisher
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Supplier: Top Seiko Co., Ltd.
Description: cost small volume production machining service to encourage our customers to try out new materials for their existing parts and/or new parts. Materials we machine include: Alumina, Sapphire, Aluminum Nitride, Silicon Nitride, Silicon Carbide, MMC(Metal MatrixComposites)*1, CMC
- CNC Machining: Yes
- Capabilities: Drilling, Milling, Turning, Screw Machining, Deep Hole Drilling, Wire EDM
- Location: East Asia / Pacific Only
- Materials: Glass, Glass Ceramics, Hardened Metals, Ultra-hard Materials, Other
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Supplier: ASTM International
Description: 1.1 This practice covers the de-agglomeration of refractory metal powders and their compounds in preparation for particle size analysis. 1.2 Experience has shown that this practice is satisfactory for the de-agglomeration of elemental tungsten, molybdenum, rhenium, and tantalum metal
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Supplier: ASTM International
Description: 1.1 This practice covers the de-agglomeration of refractory metal powders and their compounds in preparation for particle size analysis. 1.2 Experience has shown that this practice is satisfactory for the de-agglomeration of elemental tungsten, molybdenum, rhenium, and tantalum metal
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Supplier: Plansee SE
Description: We supply evaporation boats manufactured from tungsten, molybdenum, molybdenum-lanthanum (ML), molybdenum-yttrium oxide (MY) or tantalum. Our evaporation boats offer a good level of electrical conductivity and possess low vapor pressures combined with a very high
- Materials Processed: Molybdenum, Tungsten, Specialty / Other
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Supplier: Materion Corporation
Description: substrates. Capabilities include solderable and/or wire-bondable metal stacks, Tantalum Nitride and Nickel Chrome resistors, spiral inductors, ceramic plated via-thru connections.
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Supplier: ValueTronics International, Inc.
Description: section) and an attenuation range of 0 to 70 dB in 10-dB steps. This latest design evolution sets new standards for size and performance. High attenuation accuracy and low SWR are achieved through the use of miniature thin-film attenuation cards composed of high-stability tantalum
- Attenuator Type: Other
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Supplier: ValueTronics International, Inc.
Description: composed of high-stability tantalum nitride film of saphire substrate. Insertion loss is outstanding, with less than 2 dB of loss at 26.5 GHz. The compact size of the unit, 35 percent smaller than the Agilent 8495/7 (26.5 GHz) family, allows for easy integration into instruments and
- Attenuator Type: Other
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Supplier: ValueTronics International, Inc.
Description: attenuation range of 0 to 90 dB in 10-dB steps. This latest design evolution sets new standards for size and performance. High attenuation accuracy and low SWR are achieved through the use of miniature thin-film attenuation cards composed of high-stability tantalum nitride film of
- Attenuator Type: Other
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Supplier: ValueTronics International, Inc.
Description: ) and attenuator range of 0 to 11 dB in 1-dB steps. This latest design evolution sets new standards for size and performance. High attenuation accuracy and low SWR are achieved through the use of miniature thin-film attenuation cards composed of high-stability tantalum nitride film of
- Attenuator Type: Other
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Supplier: American Welding Society (AWS)
Description: , Tantalum, and Tungsten BHCM8 M-9 Magnesium and Magnesium Alloys BHCM9 M-10 Precious Metals: Gold, Silver, Platinum, and Palladium BHCM10 M-11 Alumina BHCM11 M-12 Ceramics BHCM12 M-13 Cemented Carbides and Cermets BHCM13
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Supplier: American Welding Society (AWS)
Description: , Tantalum, and Tungsten BHCM8 M-9 Magnesium and Magnesium Alloys BHCM9 M-10 Precious Metals: Gold, Silver, Platinum, and Palladium BHCM10 M-11 Alumina BHCM11 M-12 Ceramics BHCM12 M-13 Cemented Carbides and Cermets BHCM13
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Supplier: Plansee SE
Description: Our targets and cathodes made from titanium-aluminum (TiAl) ensure that drills, milling machines, indexable cutting inserts and other tools are protected by a hard, oxidation-resistant nitride coating (TiAlN). High feed speeds, excellent cutting performance and impressive metal removal
- Type: Sputtering Target
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Supplier: Deposition Sciences, Inc.
Description: durability in our coatings. MicroDyn® Reactive Sputtering The MicroDyn process is a short-throw reactive sputtering process. The process is highly flexible, with the capability to deposit metals, metal oxides, nitrides, mixed materials with fixed or graded compositions, ITO, and
- Coating: Antireflection, Beamsplitter, Dielectric, Filter, Mirror, Other
- Regional Preference: North America, United States Only
- Substrate Materials: Glass, Other
- Substrate Fabrication: Yes
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Coordinate Measuring Machines, CNC High PrecisionImage Measuring Machine, Laser Microscope, and Digital Microscopes. Upon request, washing, drying and vacuum packing inside of Clean Room are available. Materials we machine include: Alumina, Sapphire, Aluminum Nitride, Silicon Nitride, Silicon (read more)
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using acryl, steel, stainless steel, or aluminum. Those materials should be replaced with ceramics or refractory metals such as tungsten, molybdenum, and tantalum, and that will lead you to the solution. We are the expert in machining those materials which are difficult to machine, especially (read more)
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Features of the electronic strucutre of different modifications of tantalum mononitrides
In a study of the tantalum nitrides , the authors of [3, 5] analyzed the dependence of mean atomic volume on the nickel content of phases TaNx whose composition corresponds approximately to tantalum mononitride.
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The oxidation and resistance of tantalum-nitride thin films
KEY WORDS: sheet resistance; resistivity; oxidation; tantalum nitride ; thin films.
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Synthesis, Structure, and Electrochemical Characterization of Nanocrystalline Tantalum and Tungsten Nitrides
In contrast, tantalum nitrides and tungsten nitrides (WNs) have been rarely studied and there is a paucity of reports on these nitrides even though tantalum nitrides (TaN and Ta2N) and WNs have been successfully applied as stable thin-film resistors and as …
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Nitriding of tantalum
Radiographs obtained on the surface of tantalum nitrided at temperatures of 600-850°C were calculated with the condition that the modification of the TaN nitride is isostructural to the y'-MoC phase.
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Ammonium fluoride-activated synthesis of cubic δ -TaN nanoparticles at low temperatures
Cubic delta- tantalum nitride (δ-TaN) nanoparticles were selectively prepared using a K2TaF7 + (5 + k) NaN3 + kNH4F reactive mixture (k being the number of moles of NH4F) via a combustion process under a nitrogen pressure of 2.0 MPa.
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Copper Interconnect Technology
At room temperature, the grain growth of the electroplated copper (EP-Cu) deposited over tantalum (Ta) or tantalum nitride (TaN/Ta2N) (barrier layer) is mostly along the <111> direction and has been detected both by atomic force microscopy (AFM) and focused ion beam …
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Plasma‐Enhanced CVD Synthesis and Structural Characterization of Ta 2 N 3
Abstract Microcrystalline tantalum nitride films were prepared on various substrates from TaCl5 precursor and nitrogen gas using the plasma‐enhanced chemical vapor deposition (PECVD) method.
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Corrosion resistant alloys for oil and gas production (EFC 17) 2nd Edition
Hydrogen Effects on the Fracture of Thin Tantalum Nitride Films 227 .
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Nitriding of niobium and tantalum with a plasma jet under reduced pressure
The crystal structure of niobium nitride and tantalum nitride were examined in detail by Terao, <1'2)and the following phases were identified: hexagonal fl-Nb2N, tetragonal y-NbN, cubic 6-NbN, and hexagonal e- NbN for niobium nitride, and cubic TaNo.05 …