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Encapsulants and Potting Compounds - Thermally conductive polyurethane potting compound -- 50-2368FRSupplier: Epoxies Etc...
Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good
- Viscosity: 150 to 17,000 cP
- Use Temperature: -85 to 275 F
- Thermal Conductivity: 1.1538232 W/m-K
- Tensile Strength (Break): 2,200 psi
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Supplier: Epoxies Etc...
Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and
- Viscosity: 150 to 17,000 cP
- Use Temperature: -85 to 275 F
- Thermal Conductivity: 1.1538232 W/m-K
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Viscosity: 500 to 3,000 cP
- Thermal Conductivity: 0.297109474 W/m-K
- Dielectric Strength: 400.000000000001 to 609.9999999999997 kV/in
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Henkel Corporation - Industrial
Description: more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. High thermal conductivity Low thermal expansion Low CTE Electrically Insulating Excellent chemical and solvent
- Thermal Conductivity: 1.38 W/m-K
- Viscosity: 250,000 cP
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting
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Supplier: Epoxies Etc...
Description: is ideal for meter mix and dispense equipment. This system is a good choice for potting applications containing surface mount components. It can be cured at room temperature or with mild heat. The flame retardant & thermally conductive version of this product is 20-2366 FR.
- Viscosity: 150 to 6,000 cP
- Use Temperature: -85 to 275 F
- Thermal Conductivity: 0.50479765 W/m-K
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 40,000 to 80,000 cP
- Use Temperature: -100 to 400 F
- Coeff. of Thermal Expansion (CTE): 7,222,222.222222222 to 8,888,888.888888888 µin/in-F
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal
- Use Temperature: 2,200 F
- Thermal Conductivity: 0.70671671 W/m-K
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Tensile Strength (Break): 100 psi
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1046 is a low cost, epoxy potting and casting system. Major characteristics include: low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, and very good electrical insulation properties. When cured with any of the hardeners presented
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Encapsulants and Potting Compounds - Thermally Conductive Silicone Compound -- SEMICOSIL® 970 TC A/BSupplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still flowable almost constant properties between
- Viscosity: 25,000 to 120,000 cP
- Thermal Conductivity: 0.8 W/m-K
- Tensile Strength (Break): 580.147357428788 psi
- Elongation: 90 %
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Supplier: Henkel Corporation - Industrial
Description: viscosity material flows at room temperature with no additional preheating required High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing Cures quickly at moderate temperatures to minimize stress to other components Reworkable Good
- Coeff. of Thermal Expansion (CTE): 33.888888888888886 µin/in-F
- Viscosity: 354 cP
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Supplier: Master Bond, Inc.
Description: Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
- Applied Thickness / Gap Fill: 0.005 to 0.015 inch
- Use Temperature: -60 to 350 F
- Thermal Conductivity: 1.3 to 1.44 W/m-K
- Coeff. of Thermal Expansion (CTE): 12,222,222.222222222 to 13,333,333.333333332 µin/in-F
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Supplier: Sauereisen, Inc.
Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an
- Use Temperature: 2,600 F
- Thermal Conductivity: 1.1538232 to 1.5865069 W/m-K
- Coeff. of Thermal Expansion (CTE): 2.5999999999999996 µin/in-F
- Tensile Strength (Break): 740 psi
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are
- Use Temperature: 266 F
- Thermal Conductivity: 0.41826091 W/m-K
- Elongation: 120 %
- Tensile Strength (Break): 1,200 psi
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Features: Air Setting / Film Drying, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
- Type: Electrical Insulation / Dielectric
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP PPK1300, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PPK1300 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal
- Use Temperature: 68 to 302 F
- Thermal Conductivity: 1.3 W/m-K
- Dielectric Constant (Relative Permittivity): 0.0037
- Features: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to
- Use Temperature: 248 F
- Thermal Conductivity: 0.38941533 W/m-K
- Elongation: 0.14 %
- Tensile Strength (Break): 5,300 psi
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Supplier: Protavic America, Inc.
Description: combination of excellent wetting, flow, good thermal expansion properties, thermal shock resistance, and outstanding electrical properties. Adhesion is excellent to metals, most engineered plastics, and glass.
- Viscosity: 625 cP
- Use Temperature: -85 to 347 F
- Dielectric Constant (Relative Permittivity): 4.3
- Water Absorption: 1.5 %
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
- Viscosity: 10,000 to 20,000 cP
- Use Temperature: 617 F
- Thermal Conductivity: 0.4 W/m-K
- Coeff. of Thermal Expansion (CTE): 37.22222222222222 to 105 µin/in-F
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Thermal Conductivity: 1.2 W/m-K
- Features: Encapsulating / Potting, Thermal / Heat Conductive
- Cure / Technology: Single Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Thermal Conductivity: 1.2 W/m-K
- Features: Encapsulating / Potting, Thermal / Heat Conductive
- Cure / Technology: Single Component System
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Features: Air Setting / Film Drying, Ceramic / Glass, Encapsulating / Potting, Grease / Paste, Metal, Paper / Paperboard, Plastic, Thermal / Heat Conductive
- Type: Electrical Insulation / Dielectric
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity,
- Viscosity: 35,000 to 55,000 cP
- Thermal Conductivity: 1.15 W/m-K
- Tensile Strength (Break): 400 psi
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity,
- Viscosity: 15,000 to 35,000 cP
- Thermal Conductivity: 1.15 W/m-K
- Tensile Strength (Break): 400 psi
- Elongation: 17 %
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity
- Viscosity: 35,000 to 50,000 cP
- Use Temperature: -65 to 221 F
- Thermal Conductivity: 1.1538 to 1.2981 W/m-K
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.77999999999999 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.
- Applied Thickness / Gap Fill: 0.003 to 0.005 inch
- Viscosity: 50 to 200 cP
- Use Temperature: -80 to 550 F
- Tensile Strength (Break): 11,000 to 12,000 psi
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
- Viscosity: 4,000 to 7,000 cP
- Use Temperature: 572 F
- Thermal Conductivity: 0.9 W/m-K
- Coeff. of Thermal Expansion (CTE): 8.333333333333334 to 35.55555555555556 µin/in-F
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Encapsulants and Potting Compounds - Momentive RTV31 High Temp Potting Silicone+DBT 1lb -- MOSI02075Supplier: Techsil Limited
Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber
- Use Temperature: -54 to 260 F
- Features: Electronics, Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Encapsulants and Potting Compounds - Momentive RTV31 High Temp Potting Silicone+DBT 2lb -- MOSI02076Supplier: Techsil Limited
Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber
- Use Temperature: -54 to 260 F
- Features: Electronics, Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Henkel Corporation - Electronics
Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for encapsulating heat generating
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Bluestar Silicones USA Corp.
Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protection of electronical systems and production of moulding parts Good heat stability in confined environments
- Use Temperature: -94 to 572 F
- Thermal Conductivity: 0.31 W/m-K
- Coeff. of Thermal Expansion (CTE): 5 µin/in-F
- Tensile Strength (Break): 507.628937750189 to 870.221036143182 psi
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Supplier: Sauereisen, Inc.
Description: Sauereisen Electrotemp Cement No. 8 is primarily used where high electrical insulation and thermal conductivity are desired. No. 8 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated with a zircon
- Use Temperature: 2,600 F
- Thermal Conductivity: 1.1538232 to 1.5865069 W/m-K
- Coeff. of Thermal Expansion (CTE): 2.5999999999999996 µin/in-F
- Tensile Strength (Break): 400 psi
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Supplier: Sauereisen, Inc.
Description: Sauereisen Insultemp Cement No. 10 is primarily used where high electrical insulation and thermal conductivity are desired. No. 10 is a phosphate-bonded material that cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal
- Use Temperature: 2,400 F
- Thermal Conductivity: 1.442279 to 2.3076464 W/m-K
- Coeff. of Thermal Expansion (CTE): 5 µin/in-F
- Tensile Strength (Break): 300 psi
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Supplier: Fujipoly® America Corp.
Description: can be substituted anywhere other forms of insulating materials are used; such as, in place of custom diecut pads, potting compounds and even over-moldings. Resiliency and long-term aging properties are excellent; applicable in a very wide temperature range from -45˚C to +250˚C (-49˚F
- Temperature Resistance: -45 to 250 C
- Electrical Resistivity: 10,000,000,000 to 1,000,000,000,000,000 ohm-cm
- Features: Cable Tape, Dielectric / Insulating, Electrical Tape, Electronics (PCB, Semiconductor) Tape, Industrial Tape, Permanent, Protective Tape, Specialty / Other, Specialty Tape, Thermally Insulating / Insulative, UV / Weather Resistant
- Adhesive: Rubber, Silicone
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insulation of coated wire developments and the potting of electrical components are the focus of the business line “Electrical”. For the embedding, encapsulating or coating of electronic components, products of the “Electronic” business line are used. (read more)
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pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically. EP29LPAO delivers a thermal conductivity of 9 (read more)
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Conduct Research Top
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Dielectric Materials for Use in Radomes
efficient manner with which to build self-supporting radome panels that are hydrophobic, antimicrobial, and can be formed into 2- and 3-layer sandwich panels for desired thermal insulation without the need for positive pressure. These panels are also designed for easy optimization of antenna performance
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An Overview of Explosion-Proof Enclosure Research
The potted enclosure is very sensitive to variations in the power dissipa- tion due to the natural thermal insulation of the potting compound .
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Electrical issues associated with sea-water immersed windings in electrical generators for wave- and tidal current-driven power generation
Of the combinations investigated, the best choice of insulation for thermal dissipation is either using PVC- insulation or a silicon thermal potting compound .
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Potting Compounds And Thermally Conductive Adhesives - An Interview With Rohit Ramnath
In addition, thermal adhesives and potting compounds remove the thermally insulating air gaps that are present between heat transfer surfaces.
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Design of a High-Force-Density Tubular Motor
thermal resistance network in Fig. 4(b), where Rpot, Rins, and Rliner represent the thermal resistance of the potting compound , the copper insulation , and the slot liner, respectively; the total effective thermal resistance to the conductors’ Pcu can be quite significant.
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Journal of Spacecraft and Rockets > Effects of nuclear radiation and cryogenic temperatures on nonmetallic engineering materials
To date, approximately 80 materials from the following functional categories have been evaluated in one or more of these combinations of environments: 1) structural adhesives, 2) structural laminates, 3) thermal insulations , 4) electrical insulations, 5) potting compounds , 6) seals, 7) sealants, 8 …
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Thermally Conductive Adhesives Keep Things Cool
And remember that thermal adhesives or potting compounds do eliminate another troublesome insulator— the thermally insulating air gaps that would otherwise exist between heat transfer surfaces.
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Determination of the emissivity of materials. Interim final report, July 1, 1959--December 31, 1962
The electrodes are insulated from the flange by a commercial glass potting compound (Pyroceram) and provision is made for thermal expansion of the specimen.
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http://www-pub.iaea.org/MTCD/publications/PDF/TRS443_web.pdf
Examples are reduction in diameter from the wear of a rotating shaft, loss in material strength from fatigue or thermal ageing, swelling of potting compounds and loss of dielectric strength or cracking of insulation .