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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant LOCTITE® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.38 W/m-K
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Epoxies Etc...
Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Encapsulants and Potting Compounds - Thermally conductive polyurethane potting compound -- 50-2368FRSupplier: Epoxies Etc...
Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Epoxies Etc...
Description: and is ideal for meter mix and dispense equipment. This system is a good choice for potting applications containing surface mount components. It can be cured at room temperature or with mild heat. The flame retardant & thermally conductive version of this product is 20-2366 FR.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Henkel Corporation - Industrial
Description: other components Reworkable Good thermal cycling reliability Stable electrical performance under standard Surface Insulation Resistance (SIR)
- Coeff. of Thermal Expansion (CTE): 33.89 µin/in-F
- Viscosity: 354 cP
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Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 7.22E6 to 8.89E6 µin/in-F
- Composition: Unfilled
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.1 to 4.4
- Dielectric Strength: 400 kV/in
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1046 is a low cost, epoxy potting and casting system. Major characteristics include: low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, and very good electrical insulation properties. When cured with any of the hardeners presented
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: OMEGA Engineering, Inc.
Description: products. OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.4 to 4.6
- Dielectric Strength: 654 kV/in
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Encapsulants and Potting Compounds - Momentive RTV31 High Temp Potting Silicone+DBT 1lb -- MOSI02075Supplier: Techsil Limited
Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Momentive RTV31 High Temp Potting Silicone+DBT 2lb -- MOSI02076Supplier: Techsil Limited
Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP PP1200, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PP1200 is a fiberglass-based insulator coated with a filled polyester resin. The material offers superior thermal resistance for high performance applications.
- Dielectric Constant (Relative Permittivity): 0.0045
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.2 W/m-K
- Use Temperature: 68 to 302 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP PPK1300, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST® SIL PAD® TSP PPK1300 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a
- Dielectric Constant (Relative Permittivity): 0.0037
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.3 W/m-K
- Use Temperature: 68 to 302 F
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Sauereisen, Inc.
Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Encapsulants and Potting Compounds - Thermally Conductive Silicone Compound -- SEMICOSIL® 970 TC A/BSupplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.33 to 35.56 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Encapsulants and Potting Compounds - Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T7110Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires their
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.78 to 62.22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
- Applied Thickness / Gap Fill: 0.0050 to 0.0150 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.22E7 to 1.33E7 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: a unique combination of excellent wetting, flow, good thermal expansion properties, thermal shock resistance, and outstanding electrical properties. Adhesion is excellent to metals, most engineered plastics, and glass.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Thermal Insulation / Heat Insulating, Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
- Use Temperature: -54 to 260 F
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Supplier: Techsil Limited
Description: Momentive RTV88 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
- Use Temperature: -54 to 260 F
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Supplier: Master Bond, Inc.
Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.89E7 to 4.44E7 µin/in-F
- Composition: Unfilled
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Supplier: OMEGA Engineering, Inc.
Description: Application Potting, sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement should be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 6.2 to 13 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS 1. Type of Application Potting
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 to 12.4 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: DuPont Electronics & Imaging
Description: side with a proprietary B-staged modified epoxy adhesive. The Pyralux® HXI coverlay is used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental and electrical insulation. Features Uniform matte black appearance
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: DuPont Electronics & Imaging
Description: encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental and electrical insulation. Features Uniform matte black appearance High bond strength High thermal resistance Enable high yield in processing
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Dielectric Constant (Relative Permittivity): 3.6 to 3.7
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.2 W/m-K
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insulation of coated wire developments and the potting of electrical components are the focus of the business line “Electrical”. For the embedding, encapsulating or coating of electronic components, products of the “Electronic” business line are used. (read more)
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insulation materials are exposed to sustained high temperatures, rapid thermal cycling, abrasive contact, and corrosive atmospheres, often simultaneously. These conditions place extraordinary demands on thermal (read more)
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pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically. EP29LPAO delivers a thermal conductivity of 9 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
regulate temperature and preserve electrical isolation within lithium battery systems. The combination of engineered fabrics with advanced coatings delivers stable operating temperatures, prevents short circuits, and reduces the effects of thermal runaway. Coated Fabric Insulation and Its (read more)
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temperatures through limiting heat gain or loss Prevent condensation and corrosion under insulation (CUI) Improve energy efficiency and operational reliability. 1. Assess Thermal Requirements Before (read more)
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resistant fabrics and thermal insulation that provide environmental protection, emissions control, and energy conservation. We use a wide range of different materials for our heat-resistant fabrics to ensure we can provide a cost-effective solution for many different applications, including aerospace (read more)
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Conduct Research Top
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Dielectric Materials for Use in Radomes
efficient manner with which to build self-supporting radome panels that are hydrophobic, antimicrobial, and can be formed into 2- and 3-layer sandwich panels for desired thermal insulation without the need for positive pressure. These panels are also designed for easy optimization of antenna performance
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An Overview of Explosion-Proof Enclosure Research
The potted enclosure is very sensitive to variations in the power dissipa- tion due to the natural thermal insulation of the potting compound .
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Electrical issues associated with sea-water immersed windings in electrical generators for wave- and tidal current-driven power generation
Of the combinations investigated, the best choice of insulation for thermal dissipation is either using PVC- insulation or a silicon thermal potting compound .
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Potting Compounds And Thermally Conductive Adhesives - An Interview With Rohit Ramnath
In addition, thermal adhesives and potting compounds remove the thermally insulating air gaps that are present between heat transfer surfaces.
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Design of a High-Force-Density Tubular Motor
thermal resistance network in Fig. 4(b), where Rpot, Rins, and Rliner represent the thermal resistance of the potting compound , the copper insulation , and the slot liner, respectively; the total effective thermal resistance to the conductors’ Pcu can be quite significant.
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Journal of Spacecraft and Rockets > Effects of nuclear radiation and cryogenic temperatures on nonmetallic engineering materials
To date, approximately 80 materials from the following functional categories have been evaluated in one or more of these combinations of environments: 1) structural adhesives, 2) structural laminates, 3) thermal insulations , 4) electrical insulations, 5) potting compounds , 6) seals, 7) sealants, 8 …
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Thermally Conductive Adhesives Keep Things Cool
And remember that thermal adhesives or potting compounds do eliminate another troublesome insulator— the thermally insulating air gaps that would otherwise exist between heat transfer surfaces.
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Determination of the emissivity of materials. Interim final report, July 1, 1959--December 31, 1962
The electrodes are insulated from the flange by a commercial glass potting compound (Pyroceram) and provision is made for thermal expansion of the specimen.
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http://www-pub.iaea.org/MTCD/publications/PDF/TRS443_web.pdf
Examples are reduction in diameter from the wear of a rotating shaft, loss in material strength from fatigue or thermal ageing, swelling of potting compounds and loss of dielectric strength or cracking of insulation .