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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink.
- Compound Type: Thermally Conductive
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 300 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 3 W/m-K
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 2 W/m-K
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 32.78 to 120 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Description: , ensuring efficient heat transfer. ? Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ? Self-adhesive for easy application and rework. ? Complies with RoHS, Halogen
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 4
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Thermal Conductivity: 4 W/m-K
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Supplier: Fujipoly® America Corp.
Description: Sarcon® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 386 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Richardson RFPD
Description: SILICON GREASE 5 LB CAN
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: NONSILICONE GREASE 5LB CAN
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: SILICON GREASE 5 OZ TUBE
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: SILICON GREASE 2 OZ JAR
- Compound Type: Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System, Specialty / Other
- Dielectric Strength: 635 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY S-putty5-s is a one-part dispensable material with thermal conductivity 10.0 W/m*K. It also can overcome overflow and drying problems to increase the thermal conductivity. S-putty5-s is a great alternative to thermal grease and ideally suited for dispensing using
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 305 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. BERGQUIST SIL PAD TSP K900 combines the
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 0.0050
- Thermal Conductivity: 0.9000 W/m-K
- Use Temperature: 140 to 356 F
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Supplier: Master Bond, Inc.
Description: temperatures may reach 400°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Although room temperature curable, accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Techsil Limited
Description: MG 8463 is a high end conductive silicone grease formulated for improving electrical connections between sliding surfaces and parts. It provides superior lubrication, inhibits corrosion, and repels humidity. Typical applications include lubrication of switches or circuit breakers, heat
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 4 W/m-K
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Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Fujipoly® America Corp.
Description: Sarcon® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation.
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 314 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and can be easily applied. 1 kg.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 4.3 W/m-K
- Viscosity: 95000 cP
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 305 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
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Supplier: Epoxies Etc...
Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Conductive Compounds - High Thermal Conductivity Non-Silicone Greases -- SARCON® SG-50NS and SG-60NSSupplier: Fujipoly® America Corp.
Description: Fujipoly® USA introduces new 5 and 6W/m-K SARCON® thermally conductive greases to the North American market. SARCON® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 5 to 6 W/m-K
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Supplier: Master Bond, Inc.
Description: EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties. 50-2185FR meets the
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5026 Thermally Conductive Compound Gray is a one component grease like silicone material. It offers high thermal conductivity, low bleed, and high temperature stability. 1 kg Bottle.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 227 kV/in
- Thermal Conductivity: 2.9 W/m-K
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Supplier: Master Bond, Inc.
Description: cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1700 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Master Bond, Inc.
Description: EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of 7-9 hours at room temperature for a 100 gram mass and ambient/low temperature curing
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 to 13.33 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP FILLER TGF 2000, Thermally Conductive, High Performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 2000 is a high performance, thermally conductive liquid gap filling material supplied as a two-component, room or elevated temperature curing
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 0.0070
- Material Form: Gap Filling Compound
- Thermal Conductivity: 2 W/m-K
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Supplier: Techsil Limited
Description: Elecolit® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system for tantalum & ceramic termination coating. This product is commonly used for flexible termination of capacitors and offers high strength and flexibility. This product is the "gold" standard for flexible termination. Solvent adjusted. Please contact us for product
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Epoxies Etc...
Description: The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane potting system.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Bluestar Silicones USA Corp.
Description: methyl phenyl silicone fluid, lubricating applications requiring extreme low temperature Properties Viscosity 50000 Hardness Sha 25 Description Bluesil Grease 33P is a methyl phenyl silicone fluid, thickened with lithium soap. It is specifically designed for lubricating applications requiring
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
Find Suppliers by Category Top
Featured Products Top
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thermal silicone pads, phase change thermal material, thermal conductive insulating film, thermal grease, thermal gels, carbon fiber thermal pads, and non-silicone thermal pad. Each type has unique features tailored to specific product requirements. 5G smartphones, base stations, and servers are (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
also have some additional functionality which will be of benefit to the designer. Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc.
Conduct Research Top
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Thermal Grease vs Thermal Pad
Thermal grease is a thermally conductive compound designed to be used as an interface between heat sinks and heat sources. The main purpose of thermal grease is to eliminate air gaps or micro spaces between the heat sink and heat source. The top surface of a heat source is not perfectly flat.
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Thermal Putty vs Thermal Grease vs Two-Part Fast Curing Thermal Conductive Gel
There tend to be microscopic grooves or uneven surfaces which create air gaps between the microprocessor and heat sink, reducing the effectiveness of the heat transfer. Thermal grease keeps electronics at a lower temperature with low thermal resistance and increases processability. It also features
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Indicates content that may require registration and/or purchase.
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Transformation strain based method for characterization of convective heat transfer from
shape memory alloy wires
… experiments were then extended for a range of commonly used smaller commercial wire diameters in a variety of ambient environments where most standard techniques do not apply: still air, flowing air (of varying flow rate), mineral oil, thermally conductive grease , and water.
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Mechanical and Thermal Management Characteristics of Ultrahigh Surface Area Single‐Walled Carbon Nanotube Aerogels
Inter- estingly, the temperature profile were not altered or enhanced with the addition of thermally conducting grease (between the stage and the aerogel), which suggested that the aerogels con- formed to the stage surface morphology.
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Federal Register > Wednesday, December 3, 2014 > [79 FR 71894] Energy Conservation Program: Test Procedures for Conventional Cooking Products
The small test block shall comprise a body and separate base, between which a 10-12 g layer of thermally conductive grease shall be applied.
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Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
Just like some of the pads, thermally conductive greases must be used with metal clips.
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http://dspace.mit.edu/bitstream/handle/1721.1/45414/317622876-MIT.pdf?sequence=2
The sample is attached to the white platform using a thermally conducting grease .
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A Novel Compact Pyroelectric X-Ray and Neutron Source
The crystals were attached to the bracket with ther- mally conductive grease , and were held apart from each other by a triangular piece of circuit board.
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:: New Materials Zone ::
Dow Corning Corporation today introduced DOW CORNING TC-5022, a new thermally conductive grease that offers a step-change in thermal performance and cost of ownership for high-end microprocessor packages.
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Heat-Away 641 Silver-Filled Thermally Conductive Grease Now Available
Heat-Away 641 Silver-Filled Thermally Conductive Grease Now Available .
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Handbook of Modern Sensors
For instance, to increase α, a thermistor should be well coupled to the object by increasing the contact area, applying thermally conductive grease , or using thermally conductive adhesives.
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Variation of the Seebeck coefficient with hydrogen content in carbon microfilaments
The metallic plates were thermally connected to two Peltier cells via a thin layer of 1,150–600, a thermally conductive grease from Holland Shielding System BVÒ .