Products & Services
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products.
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Features: Electrical Insulation / Dielectric, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
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Supplier: RS Components, Ltd.
Description: Thermal conductive paste & film
- Use Temperature: -40 to 482 F
- Thermal Conductivity: 0.61 W/m-K
- Form / Shape: Grease / Paste
- Features: Thermally Conductive
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Supplier: Allied Electronics, Inc.
Description: Thermalcote™ is a superior thermal-joint compound of thermally-loaded silicone-based grease for use with all heat sinks. It improves the transfer of thermal energy across the metal-to-metal interfaces between the transistor or rectifier case and the heat sink. Thermalcote™ conducts
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Supplier: Shiu Li Technology Co., Ltd
Description: Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with overflow and
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 3.5 W/m-K
- Dielectric Strength: 300 kV/in
- Industry: Electronics
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Supplier: Allied Electronics, Inc.
Description: Thermalcote™ is a superior thermal-joint compound of thermally-loaded silicone-based grease for use with all heat sinks. It improves the transfer of thermal energy across the metal-to-metal interfaces between the transistor or rectifier case and the heat sink. Thermalcote™ conducts
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Supplier: Techsil Limited
Description: MG 8463 is a high end conductive silicone grease formulated for improving electrical connections between sliding surfaces and parts. It provides superior lubrication, inhibits corrosion, and repels humidity. Typical applications include lubrication of switches or circuit breakers, heat
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt
- Features: Thermal / Heat Conductive
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Supplier: Allied Electronics, Inc.
Description: Designed for use with heat sinks to effectively dissipate heat generated by electronic devices and circuitry. Ideally used to cool CPUs (over clocking), chipset and graphics cards. Formulated with Boron Nitride, this grease gives super high thermal conductivity without the capacitance issue
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Supplier: Newark, An Avnet Company
Description: THERMAL GREASE; Dispensing Method:Tube; Volume:-; Weight:143g; Product Range:- RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: THERMAL GREASE, PACK, 4G; Dispensing Method:Packet; Volume:-; Weight:4g; Product Range:-; Colour:White RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: THERMAL GREASE, 14CC, CONTAINER
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Supplier: Newark, An Avnet Company
Description: THERMAL GREASE, JAR, 2OZ; Dispensing Method:Jar; Volume:-; Weight:2oz; Product Range:120 Series; Colour:White RoHS Compliant: Yes
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Supplier: Epoxies Etc...
Description: 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.
- Use Temperature: 752 F
- Thermal Conductivity: 1.1538232 W/m-K
- Tensile Strength (Break): 7,500 psi
- Features: Die Bonding Adhesive / Compound, Filled, Grease / Paste, Thermal / Heat Conductive
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Supplier: Allied Electronics, Inc.
Description: Lubricates and improves electrical and thermal connections between sliding surfaces, while providing protection from moisture and corrosion. Type 846: Carbon conductive grease. Type 8463: Silver conductive grease. Resistivity of 0.01 ohm.cm. Great for use as a thermal
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Viscosity: 12,000 to 17,000 cP
- Use Temperature: 617 F
- Thermal Conductivity: 1.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 15 to 75.55555555555556 µin/in-F
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also can
- Viscosity: 15,000,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 5 W/m-K
- Dielectric Strength: 304.80000000000064 kV/in
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
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Supplier: Epoxies Etc...
Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.
- Thermal Conductivity: 1.1538232 W/m-K
- Electrical Resistivity: 2,000,000,000,000,000 ohm-cm
- Dielectric Strength: 209.99999999999991 kV/in
- Dielectric Constant: 5
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still flowable almost constant properties
- Viscosity: 25,000 to 120,000 cP
- Thermal Conductivity: 0.8 W/m-K
- Tensile Strength (Break): 580.147357428788 psi
- Elongation: 90 %
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum interface thickness can
- Use Temperature: 302 F
- Thermal Conductivity: 2 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: Xoxide
Description: PTI-G3606 is Silicon-base thermal grease with excellent heat-conductive filler and effective thermal grease for any heat sink device where efficient cooling is required, such as CPU power transistor, and SCRs to heat sink or chassis. It will not dry out, harden, or melt even
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and can be easily applied. 1 kg.
- Viscosity: 95,000 cP
- Thermal Conductivity: 4.3 W/m-K
- Cure / Technology: Single Component System
- Features: Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: has an exceptionally forgiving 1:1 mix ratio by weight or volume. Although room temperature curable, accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1800 psi.
- Use Temperature: -60 to 400 F
- Thermal Conductivity: 2.882 to 3.603 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Tensile Strength (Break): 5,000 psi
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties. 50-2185FR meets the
- Viscosity: 27,000 cP
- Use Temperature: -58 to 248 F
- Thermal Conductivity: 1.22593715 W/m-K
- Tensile Strength (Break): 800 psi
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5026 Thermally Conductive Compound Gray is a one component grease like silicone material. It offers high thermal conductivity, low bleed, and high temperature stability. 1 kg Bottle.
- Viscosity: 100,000 cP
- Thermal Conductivity: 2.9 W/m-K
- Dielectric Strength: 227 kV/in
- Features: Thermal / Heat Conductive
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Description: Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ◆ Self-adhesive for easy application and rework. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 4 W/m-K
- Dielectric Constant (Relative Permittivity): 4
- Industry: Electronics
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum interface thickness can
- Use Temperature: 302 F
- Thermal Conductivity: 3 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals,
- Use Temperature: -75 to 250 F
- Thermal Conductivity: 1.61535248 W/m-K
- Coeff. of Thermal Expansion (CTE): 18 µin/in-F
- Dielectric Strength: 450.00000000000006 kV/in
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Supplier: Techsil Limited
Description: MG Chemicals 8617 Super Thermal Grease III is a low thermal resistance, non-corrosive grease. It uses an extremely thermal stable synthetic oil that is electrically insulating. This product is used to improve the thermal interface contact conductivity between heat sinks, LED's, motors
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Supplier: Master Bond, Inc.
Description: properties including high thermal conductivity, excellent electrical insulation properties, good physical strength properties and a high degree of flexibility. EP37-3FLFAO has low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy.
- Viscosity: 18,000 to 22,000 cP
- Use Temperature: -452.47 to 275 F
- Thermal Conductivity: 1.2980511 to 1.442279 W/m-K
- Coeff. of Thermal Expansion (CTE): 33.333333333333336 to 36.11111111111111 µin/in-F
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed
- Viscosity: 150,000 cP
- Features: Die Bonding Adhesive / Compound, Grease / Paste
- Industry: Electronics
- Substrate Compatibility: Plastic
Find Suppliers by Category Top
Featured Products Top
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thermal silicone pads, phase change thermal material, thermal conductive insulating film, thermal grease, thermal gels, carbon fiber thermal pads, and non-silicone thermal pad. Each type has unique features tailored to specific product requirements. 5G smartphones, base stations, and servers are (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
also have some additional functionality which will be of benefit to the designer. Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc.
Conduct Research Top
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Thermal Grease vs Thermal Pad
Thermal grease is a thermally conductive compound designed to be used as an interface between heat sinks and heat sources. The main purpose of thermal grease is to eliminate air gaps or micro spaces between the heat sink and heat source. The top surface of a heat source is not perfectly flat.
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Thermal Putty vs Thermal Grease vs Two-Part Fast Curing Thermal Conductive Gel
There tend to be microscopic grooves or uneven surfaces which create air gaps between the microprocessor and heat sink, reducing the effectiveness of the heat transfer. Thermal grease keeps electronics at a lower temperature with low thermal resistance and increases processability. It also features
More Information Top
Indicates content that may require registration and/or purchase.
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Transformation strain based method for characterization of convective heat transfer from
shape memory alloy wires
… experiments were then extended for a range of commonly used smaller commercial wire diameters in a variety of ambient environments where most standard techniques do not apply: still air, flowing air (of varying flow rate), mineral oil, thermally conductive grease , and water.
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Mechanical and Thermal Management Characteristics of Ultrahigh Surface Area Single‐Walled Carbon Nanotube Aerogels
Inter- estingly, the temperature profile were not altered or enhanced with the addition of thermally conducting grease (between the stage and the aerogel), which suggested that the aerogels con- formed to the stage surface morphology.
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Federal Register > Wednesday, December 3, 2014 > [79 FR 71894] Energy Conservation Program: Test Procedures for Conventional Cooking Products
The small test block shall comprise a body and separate base, between which a 10-12 g layer of thermally conductive grease shall be applied.
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Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
Just like some of the pads, thermally conductive greases must be used with metal clips.
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http://dspace.mit.edu/bitstream/handle/1721.1/45414/317622876-MIT.pdf?sequence=2
The sample is attached to the white platform using a thermally conducting grease .
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A Novel Compact Pyroelectric X-Ray and Neutron Source
The crystals were attached to the bracket with ther- mally conductive grease , and were held apart from each other by a triangular piece of circuit board.
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:: New Materials Zone ::
Dow Corning Corporation today introduced DOW CORNING TC-5022, a new thermally conductive grease that offers a step-change in thermal performance and cost of ownership for high-end microprocessor packages.
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Heat-Away 641 Silver-Filled Thermally Conductive Grease Now Available
Heat-Away 641 Silver-Filled Thermally Conductive Grease Now Available .
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Handbook of Modern Sensors
For instance, to increase α, a thermistor should be well coupled to the object by increasing the contact area, applying thermally conductive grease , or using thermally conductive adhesives.
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Variation of the Seebeck coefficient with hydrogen content in carbon microfilaments
The metallic plates were thermally connected to two Peltier cells via a thin layer of 1,150–600, a thermally conductive grease from Holland Shielding System BVÒ .