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Supplier: Budnick Converting, Inc.
Description: A 1.0 mil. tape with a polyester film backing and thermosetting rubber adhesive primarily used for layer insulation and a coil cover.
- Adhesive: Specialty / Other
- Backing: Plastic / Polymer, PET / Polyester
- Peel Strength / Adhesion: 3.12 lbs/in
- Thickness: 0.0023 inches
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Supplier: Maxi Adhesive Products, Inc.
Description: Glass cloth, single coated with thermosetting, rubber adhesive.
- Backing: Cloth - Woven Fabric
- Peel Strength / Adhesion: 2.19 lbs/in
- Thickness: 0.0076 inches
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Supplier: Accuris
Description: Adhesive, Optical, Thermosetting
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Supplier: Accuris
Description: ADHESIVES: OPTICAL THERMOSETTING
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Supplier: Accuris
Description: ADHESIVE, OPTICAL, THERMOSETTING
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Supplier: Accuris
Description: Adhesives: Optical Thermosetting
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Description: Contains the requirements for pressure-sensitive adhesive tapes made with cellulosic paper, creped, with rubber thermosetting adhesive.
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Cure Type / Technology: Thermosetting / Crosslinking
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Description: Contains requirements for pressure-sensitive adhesive tapes made with cellulosic paper, non-creped, with rubber thermosetting adhesive. Gives also the test method for measuring bond separation during thermal treatment (Flagging test).
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Acoustical Solutions, Inc.
Description: AlphaPanel? Adhesive is a non-toxic water based adhesive that makes installation quick and easy by providing a strong permanent bond when apply foam panels to walls or ceilings. It offers easy clean up and is compatible with all polyurethane and melamine foam products. The tubes are
- Chemical / Polymer System Type: Rubber Based / Elastomeric, Specialty / Other
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dissimilar Substrates: Yes
- Features: Flexible / Dampening
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Supplier: SAE International
Description: This Aerospace Recommended Practice (ARP) describes methods of vacuum bagging, a process used to apply pressure in adhesive bonding and heat curing of thermosetting epoxy and polyester matrix fabrications for commercial aircraft composite parts. If this document is used for the vacuum
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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Features: Electrically Insulating / Dielectric
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Supplier: Techsil Limited
Description: Techsil® EP20860 is a two part, rapid curing epoxy adhesive that cures at room temperature with low shrinkage and forms an ultra-clear bond line. Techsil® EP20860 offers a flexible and impact resistant bond that is resistant to a wide range of chemicals with excellent electrical
- Cure Type / Technology: Thermosetting / Crosslinking
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Description: Contains requirements for straight cut pressure-sensitive adhesive tapes made of glass fabric with thermosetting adhesive.
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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Filled
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4 to 5
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Budnick Converting, Inc.
Description: A 2.5 mil. tape featuring a polyester film backing with a rubber thermosetting adhesive used for wrapping fine wires where magnet wire is used for color coding.
- Adhesive: Specialty / Other
- Backing: Plastic / Polymer, PET / Polyester
- Peel Strength / Adhesion: 2.81 lbs/in
- Thickness: 0.0025 inches
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Description: Contains requirements for pressure-sensitve adhesive tapes made of cellulosic paper, with thermosetting adhesive. Gives also the test method for measuring bond separation during thermal treatment (Flagging test).
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Supplier: Koford Engineering, LLC
Description: E-108 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength at elevated temperatures as well as good long term strength at high temperature. Due to thealuminum filler the minimum bondline gap is approximately .002" to .003".
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Use Temperature: 257 to 572 F
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Description: LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 1.6 W/m-K
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Supplier: Koford Engineering, LLC
Description: E-114 is a low cure temperature, non sag high performance filled single component epoxy adhesive whichcan be cured at 100°C or 120°C to provide good shear strength in combination with good temperatureresistanc e. Especially suitable for assembley applications such as building
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Electronics
- Substrate / Material Compatibility: Metal
- Use Temperature: 284 to 392 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK S3869, Silicone Epoxy Resin, Die Attach, Thermosetting, Dielectric Adhesive LOCTITE® ABLESTIK S3869 is a thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 149 µin/in-F
- Cure Type / Technology: Single Component System
- Features: Electrically Insulating / Dielectric
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Supplier: Koford Engineering, LLC
Description: E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Metal
- Use Temperature: 257 to 392 F
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Supplier: Koford Engineering, LLC
Description: E-110 is a high performance unfilled single component modified epoxy adhesive which can be cured at125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Metal
- Use Temperature: 257 to 392 F
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Supplier: SAE International
Description: This Aerospace Recommended Practice (ARP) describes methods of vacuum bagging, a process used to apply pressure in adhesive bonding and heat curing of thermosetting composite materials and metalbond for commercial aircraft parts. If this document is used for the vacuum bagging of other
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Supplier: GS Polymers, Inc.
Description: One part, thixotropic adhesive, chemical resistance, heat cure
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Filled
- Industry: OEM / Industrial
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Supplier: Epoxies Etc...
Description: 10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.8
- Dielectric Strength: 450 kV/in
- Features: Electrical Insulating / Dielectric
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Supplier: GS Polymers, Inc.
Description: Two part, general purpose potting compound and adhesive
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dissimilar Substrates: Yes
- Features: Encapsulating / Potting
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Coeff. of Thermal Expansion (CTE): 26.11 to 110 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Photonics / Optoelectronics
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance
- Cure Type / Technology: Thermosetting / Crosslinking
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Description: LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic
- Coeff. of Thermal Expansion (CTE): 34.44 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics, OEM / Industrial
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.67 to 97.22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.74
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Supplier: GS Polymers, Inc.
Description: Two Part, 1:2, gels quickly, water resistant, excellent adhesive
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Features: Filled
Find Suppliers by Category Top
Featured Products Top
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Magna-Tac® TR-8899 is a one part formulated thermosetting epoxy designed to adhere metals and alloys in transformer cores, as well as electric motor rotors and stators. Particularly suited for (read more)
Browse Industrial Adhesives Datasheets for Beacon Adhesives, Inc. -
Magna-Tac® TR-8899 (Cross reference to 3M™ Scotch-Weld™ Epoxy Adhesive 2290) is a one part formulated thermosetting epoxy designed to adhere metals and alloys in transformer cores, as well as electric motor rotors and (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Beacon Adhesives, Inc. -
These monomers are the raw materials of thermosetting resin. The thermosetting resin made from these monomers has excellent heat resistance, adhesive property, and flexibility. The fine chemicals can be used as heat resistant resin, varnish and adhesive. (read more)
Browse Monomers, Intermediates, and Base Polymers Datasheets for Mitsui Chemicals America, Inc. -
them to withstand deformation due to high temperatures, abrasion, weather, and even natural deterioration. Heat resistant and semi-heat resistant plastics, including both thermo and thermosetting materials, include: Amorphous plastics (read more)
Browse Plastic Molding Services Datasheets for Osborne Industries, Inc. -
, new fluoropolymer adhesive products show stronger adhesion to Cu/PI when used in dispersion/powder processing. They also provide better electrical insulation. As noted above, PI alone is not reliable and is prone to pinholes (read more)
Browse Datasheets for AGC Chemicals Americas, Inc. -
, new fluoropolymer adhesive products show stronger adhesion to Cu/PI when used in dispersion/powder processing. They also provide better electrical insulation. As noted above, PI alone is not reliable and is prone to pinholes (read more)
Browse Datasheets for AGC Chemicals Americas, Inc.
Conduct Research Top
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Industrial Adhesive Solution for Heat-Cured
Thermosetting adhesives are adhesives that use thermosetting resins containing reactive groups as binders. When adding a curing agent or heating, the liquid adhesive molecules can be further polymerized and cross-linked into a body-shaped network structure, forming an insoluble and infusible solid
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Best Top 10 Epoxy Adhesives Glue Manufacturers In the USA
Epoxy is one of the adhesive options available in the market today. It is a thermosetting adhesive made of an epoxy polymer, hardener, or resin. This adhesive glue is used to bond different surfaces together, resulting in a robust and permanent bond that can withstand extreme weather and stress
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Is Epoxy Stronger than Adhesive?
Epoxy is a term that covers a wide range of thermosetting polymer materials used in a wide range of industries today. They are adhesives, coatings, primers, sealants, and encapsulants with superior mechanical, electrical, and thermal properties. Epoxy products are typically two-part systems
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Who Makes the Strongest Epoxy Glue?
Epoxy is a synthetic thermosetting polymer formed from a reaction between a compound containing an epoxide group and another agent. It is a solid and resilient material used in many applications, including adhesives, coatings, and composites. Epoxy has many advantages over other materials
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Why use Epoxy Instead of Glue?
Epoxy is a term used to describe a wide range of thermosetting polymers. They are characterized by their excellent electrical and mechanical properties and their resistance to heat, chemicals, and wear. Epoxies are used in a variety of applications, including adhesives, coatings, electrical
More Information Top
Indicates content that may require registration and/or purchase.
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Coating asphaltic pavement; foundry sand cores; corrosion-resist. construction materials; grinding wheels; laminating resins (chem. plant components/handling equip.); thermosetting adhesive .
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Handbook of Adhesives and Sealants, Second Edition > EPOXY, POLYURETHANE, ACRYLIC, AND CYAIMOACRYLATE ADHESIVES
This concentration is generally not sufficient to provide adequate storage life to formulated thermosetting adhesives , especially those containing a peroxide catalyst.
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Handbook of Adhesion Technology
Thermosetting adhesives are typically available in liquid, paste, and solid forms.
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Handbook of Adhesives and Sealants, Second Edition > SELECTION OF ADHESIVES
Tough thermosetting adhesives , such as epoxies, polyurethanes, or acrylics, are commonly used for structural applications.
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Handbook of Adhesives and Sealants, Second Edition > BONDING AND SEALING SPECIFIC SUBSTRATES
The most common of the structural adhesives for bonding steel consist of thermosetting adhesives such as epoxies, urethanes, and phenolics.
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Handbook of Adhesives and Sealants, Second Edition > CLASSIFICATION METHODS
Thermosetting Adhesives .
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Handbook of Plastics Technologies: The Complete Guide to Properties and Performance > PLASTICS JOINING
They are generally represented by thermosetting adhesives with shear strengths greater than 1000 psi.