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Supplier: Accuris
Description: Miscellaneous Solder Metals Tin - Lead - Antimony Solder Metal
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Supplier: Accuris
Description: Method for The determination of lead in ingot tin and tin-antimony solders (photometric method)
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc
- Features: Other
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc
- Features: Other
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc
- Features: Other
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire,
- Melting Range: 464 F
- Approvals / Conformance: ASTM / UNS
- Product Form: Paste, Powder, Preform
- Features: Solid Wire, Strip / Sheet / Foil
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Supplier: ASTM International
Description: This specification covers solder metal alloys used as solders for the purpose of joining together two or more metals at temperatures below their melting points. The solder alloy shall conform to the required chemical compositions of cadmium, zinc, tin, lead,
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Supplier: SAE International
Description: steel or zinc, only Class A solders should be used. Class B solders, containing antimony usually as a substitute for some of the tin or to increase strength and hardness of the filler metal, form intermetallic antimony-zinc compounds, causing the joint to become
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Supplier: SAE International
Description: steel or zinc, only Class A solders should be used. Class B solders, containing antimony usually as a substitute for some of the tin or to increase strength and hardness of the filler metal, form intermetallic antimony-zinc compounds, causing the joint to become
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Supplier: CSA Group
Description: ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
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Description: ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and
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Supplier: ASTM International
Description: This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel,
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Supplier: ASTM International
Description: This specification covers low-melting point metal alloys and soldiers, including bismuth-tin, bismuth-lead, bismuth-tin-lead, bismuth-tin-lead-cadmium, bismuth-tin-lead-indium-cadmium, bismuth-tin-lead-indium, indium-lead,
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Supplier: Washington Alloy Co.
Description: higher tensile strength than lead-tin solders. Deposits are corrosion resistant and can be chrome plated. Description Acid core, cadmium free-lead free general purpose silver bearing solder. Applications Columbia 14G is a low temperature silver bearing
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Supplier: RS Components, Ltd.
Description: SOLDER SN96.5 AG3 CU0.5 10/10 100G
- Diameter / Thickness: 0.0393701 inch
- Features: Other, Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
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Supplier: DigiKey
Description: Leaded Rosin Activated (RA) Wire Solder Sn60Pb40 (60/40) 16 AWG, 18 SWG Spool, 17.64 oz (500g)
- Melting Range: 361 to 374 F
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Indium Corporation
Description: Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are rectangular in shape (1.66 lbs./ each). 15 bars per box. 25 lbs. per box Minimum order quantity is 25 lbs.
- Features: Other
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Allied Electronics, Inc.
Description: Activated Rosin Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Wire Solder, Sn60Pb40, .025 inches, Flux Cored Solder Wire, 1 Lb. Kester 44 rosin flux has virtually dominated the field of activated rosin core solders for well over four decades. An outstanding performance
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C511 ) LOCTITE C 511 cored solder wire has been specially formulated to compliment no clean wave and reflow soldering processes. It is available in several tin/lead alloys as well as Lead Free. It is available with Sn63, Sn62, Sn60, 96SC (SAC387), 97SC
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: Indium Corporation
Description: SR-7 Solder Paste is a halogen-free, no-clean solder paste formulated for ultra low residue. It will also yield accurate, repeatable dispensing performance on both pneumatic and positive displacement dispensing equipment. It is a nitrogen refl ow product with exceptional wetting
- Features: Other
- Product Form: Paste
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: ESAB Welding and Cutting Products
Description: Features A 50/50 lead/tin solder for sealing, joining or tinning most common metals, except aluminum. Can be used with soldering iron or torch. Working temperature is 360°F to 375°F.
- Tensile Strength (UTS): 6,000 psi
- Product Form: Paste
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Allied Electronics, Inc.
Description: No-Clean Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Leaves a low amount of residue, which is both visually negligible and electrically safe. Does not require cleaning, is environmentally safe and needs no CFC solvents. Kester in.245in. low residue flux for cored solder wire was
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Supplier: Henkel Corporation - Electronics
Description: Tin/Lead: Sn63, Sn60, Sn62, Lead Free: 97sc, (SAC305), 96sc (SAC387), 99c, 95A, 96S
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: Indium Corporation
Description: BP-3106 is a nitrogen reflow, no-clean solder paste with type 3 powder specifically formulated for BGA bumping applications. The flux is specifically formulated for Sn/Pb alloy systems. This product provides consistent volume deposition, extremely low voiding and high yields. If cleaning is
- Product Form: Paste
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Allied Electronics, Inc.
Description: Activated Rosin Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Fast-acting and instant wetting design allows for faster soldering. The non-corrosive, non-conductive flux is ideal where a strong, long-lasting bond is needed. Available in any size ranging from 0.005" to 0.250". Also available
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Supplier: Henkel Corporation - Electronics
Description: Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb formulation
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Soldering Flux / Rosin
- Product Form: Paste
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Supplier: Allied Electronics, Inc.
Description: No-Clean Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight Leaves a low amount of residue, which is both visually negligible and electrically safe. Does not require cleaning, is environmentally safe and needs no CFC solvents. Kester in.245in. low residue flux for cored solder wire was
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Supplier: Indium Corporation
Description: Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic Pb-Free: No
- Diameter / Thickness: 0.002 inch
- Features: Strip / Sheet / Foil
- Solder Alloy: Tin-Lead (Sn-Pb)
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is produced to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn) Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
compatibility, improved coplanarity, and EH&S compliance. MICROFAB TS-650 NXG is designed for lead-free and capping applications, providing exceptional within-wafer (WIW), within-die (WID), and within-feature (WIF) uniformity. The tunable tin-silver alloy produced by MICROFAB TS-650 NXG removes the (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn). Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
-quality lead-free alloy that is capable of soldering at a temperature lower than standard tin silver copper alloys. ALPHA HRL3 solder alloy is able to demonstrate reliability performance comparable to standard tin silver copper alloys (SAC305). To ensure consistent sphere size, uniformity, and alloy content, ALPHA Solder Spheres are manufactured to the highest quality control standards. (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
/reel) Compatible with automated SMT assembly Compatible with lead-free IR reflow, wave soldering, and hand soldering (read more)
Browse Circuit Protection Components Datasheets for VICFUSE -
failures have been linked to tin whiskers. Tin remains essential in electronics (solder, connectors, plating), so the solution is SnPb plating, which inhibits whisker growth. DLA states: “Alloys of 3% lead, by mass, have shown to inhibit the (read more)
Browse Current Sensing Resistors Datasheets for Isabellenhutte USA -
manufacturers. Equipped with heat resistant Nylon housings, the entries are suited for traditional soldering and reflow processing. Surface Mount types feature Gold-plated Phosphor Bronze contacts assuring low contact resistance and superior solder joints where lead-free soldering or reflow (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
pre-tinned #22AWG red and black leads; and wire lengths of 7.00" (178mm) length, soldered-in for exceptional reliability. The company's full line of battery hardware engages SMT and thru-hole applications and includes clips, contacts, holders, retainers, plus straps in various materials for (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
iron powder or hydride powder, with binder, is applied to the welded parts of ceramics and metals. The solder (pure silver, silver-copper solder or low-temperature solder such as lead, tin and indium) is directly added to the metal parts without sintering, and then it is fired in vacuum at one time (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
Conduct Research Top
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Why Lead-Free Soldering is Better
. Some of the harmful alloys that are used in normal soldering are tin, copper, silver bismuth, indium, zinc, and antimony. So why are these dangerous to humans everywhere? Prior to 1930, all homes used lead pipes to transport water to and from houses. Now, most homes use copper piping. However
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How to Choose a Solder
hazardous materials) are banned from the European Union as part of the Restriction of Hazardous Substances (RoHS). Lead-free solder may contain many metals including silver, copper, tin, bismuth, indium, zinc and antimony. Hard solders have a high melting point and are usually made with a high
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Indicates content that may require registration and/or purchase.
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Wirtschaftlich‐gewerblicher part
Lead antimony tin solder ; Zus. z.
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China - Guidance Catalog for Industrial Structure Adjustment (2011 Version) Issued by the National Development and Reform Commission March 27, 2011 and Effecti...
1、 新建, extension tungsten, molybdenum, tin, antimony exploitation, smelting project, rare earth exploitation, mineral processing, smelting, separate project and antimonic oxide , lead tin solder production project 2, single series is 10 ten thousand 吨/年 as for blister copper smelting project 3, electrolytic …
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ZASMHBA0001459
The mechanical properties of the tin - lead - antimony solders are listed in Table 8.
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Audel Welding Pocket Reference
Table 7-4 Tin - Antimony - Lead Solders ASTM Alloy Grade Sn% Comments Pb% Sb% 172 20C 25C 30C 35C .
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ZCACA2001P303
ASTM grade C tin - lead - antimony solders 10 14.5 2.1 20 21.4 3.1 30 28.9 4.2 40 34.5 5.0 50 39.3 5.7 60 42.1 6.1 .
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Trade Science Inc. - Materials Science : An Indian Journal
In order to prevent pollution of the environment with lead the use of tin / antimony lead free solder alloy with some alloying elements is the best solder alloys for high temperature applications.