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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Other
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Other
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Supplier: Belmont Metals, Inc.
Description: . Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt
- Applications: Chemical / Materials Processing, Other
- Metal / Alloy Types: Tin / Tin Alloy
- Shape / Form: Other
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Supplier: Accuris
Description: Miscellaneous Solder Metals Tin - Lead - Antimony Solder Metal
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into
- Alloy: Tin-Antimony (Sn-Sb)
- Approvals / Conformance: ASTM / UNS
- Form / Shape: Paste, Powder, Preform, Wire
- Melting Range: 464 F
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Supplier: Accuris
Description: Method for The determination of lead in ingot tin and tin-antimony solders (photometric method)
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Supplier: ASTM International
Description: This specification covers solder metal alloys used as solders for the purpose of joining together two or more metals at temperatures below their melting points. The solder alloy shall conform to the required chemical compositions of cadmium, zinc, tin, lead,
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Supplier: SAE International
Description: reasons, it is recommended that the grade of solder metal be selected that contains least amount of tin required to give suitable flowing and adhesive qualities for application. All the lead-tin solders, with or without antimony, are usually suitable for joining
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Supplier: SAE International
Description: reasons, it is recommended that the grade of solder metal be selected that contains least amount of tin required to give suitable flowing and adhesive qualities for application. All the lead-tin solders, with or without antimony, are usually suitable for joining
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Description: ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and without silver
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Supplier: CSA Group
Description: ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
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Supplier: ASTM International
Description: This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper- silver, tin-antimony-copper- silver-nickel, tin-silver,
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Supplier: ASTM International
Description: 1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper- silver, tin-antimony-copper- silver-nickel, tin-silver,
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Supplier: ASTM International
Description: 1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper- silver, tin-antimony-coppers ilver-nickel, tin-silver,
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Supplier: Washington Alloy Co.
Description: Specifications Torch, Propane, Soldering Iron, Furnace Sizes and Packaging (in.) 3/64 1/16 3/32 1/8 (mm) 1.2 1.6 2.4 3.2 1 lb., 5lb., 20 lb. spools. Features Columbia 14G contains no lead, cadmium, zinc or antimony. Deposits are bright
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Supplier: RS Components, Ltd.
Description: Sn60 Pb40 alloy for use at high temperatures. Bar dimensions: 380 x 15 x 8 mm. High resistance to oxidation. For use in baths and crucibles. Percent Lead = 40% Product Form = Wire Melting Point = +183 - +190°C Percent Tin = 60%
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 to 374 F
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Supplier: RS Components, Ltd.
Description: This resin-based solder wire is a 60/40 tin/lead solder wire, with the solder flux formulated for wetting all common Printed Circuit Boards (PCBs) and components. The residue left after soldering is clear and can be safely left on the PCB after soldering is
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 F
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Supplier: RS Components, Ltd.
Description: Contains a small amount of copper which reduces wear of soldering iron bits and enables fine copper wires to be soldered more efficiently. 5 cores of Ersin® flux. Reel weight 500 g Wire Diameter = 0.71mm Percent Lead = 48.5% Product Form = Wire Melting Point = +183 - +215°C
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 to 419 F
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Supplier: RS Components, Ltd.
Description: Resin based 60/40 tin/lead solder wire. Clear no clean flux residue. Wets well to all PCB and component finishes. Ideal for wide range of soldering jobs. Superior wetting. Utilising a synthetically refined resin. Effective activator package Wire Diameter = 0.7mm Percent
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 to 370 F
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Supplier: Indium Corporation
Description: Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes.
- Alloy: Indium (In), Tin-Lead (Sn-Pb), Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: ESAB Welding and Cutting Products
Description: Features A 50/50 lead/tin solder for sealing, joining or tinning most common metals, except aluminum. Can be used with soldering iron or torch. Working temperature is 360°F to 375°F.
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Paste
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C502 Cored Wire ) LOCTITE C 502 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. LOCTITE C 502 is also well suited for soldering applications requiring high melting temperature alloys. It is
- Alloy: Tin-Lead (Sn-Pb), Other
- Approvals / Conformance: Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: DigiKey
Description: Leaded Rosin Activated (RA) Wire Solder Sn63Pb37 (63/37) 24 AWG, 25 SWG Tube, 0.4 oz (11.34g)
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 F
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is produced to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn) Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
compatibility, improved coplanarity, and EH&S compliance. MICROFAB TS-650 NXG is designed for lead-free and capping applications, providing exceptional within-wafer (WIW), within-die (WID), and within-feature (WIF) uniformity. The tunable tin-silver alloy produced by MICROFAB TS-650 NXG removes the (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
to a 96.5% minimum purity lead level and may contain 1.5-3% Antimony (Sb) and .1-3.5% Tin (Sn). Mars Metal is able to provide you with very specific lead grades such as: Chemical Copper lead Low sulfur Low bismuth Low silver pure (read more)
Browse Ingots and Casting Stock Datasheets for MarsMetal -
-quality lead-free alloy that is capable of soldering at a temperature lower than standard tin silver copper alloys. ALPHA HRL3 solder alloy is able to demonstrate reliability performance comparable to standard tin silver copper alloys (SAC305). To ensure consistent sphere size, uniformity, and alloy content, ALPHA Solder Spheres are manufactured to the highest quality control standards. (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
failures have been linked to tin whiskers. Tin remains essential in electronics (solder, connectors, plating), so the solution is SnPb plating, which inhibits whisker growth. DLA states: “Alloys of 3% lead, by mass, have shown to inhibit the (read more)
Browse Current Sensing Resistors Datasheets for Isabellenhutte USA -
manufacturers. Equipped with heat resistant Nylon housings, the entries are suited for traditional soldering and reflow processing. Surface Mount types feature Gold-plated Phosphor Bronze contacts assuring low contact resistance and superior solder joints where lead-free soldering or reflow (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
pre-tinned #22AWG red and black leads; and wire lengths of 7.00" (178mm) length, soldered-in for exceptional reliability. The company's full line of battery hardware engages SMT and thru-hole applications and includes clips, contacts, holders, retainers, plus straps in various materials for (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
iron powder or hydride powder, with binder, is applied to the welded parts of ceramics and metals. The solder (pure silver, silver-copper solder or low-temperature solder such as lead, tin and indium) is directly added to the metal parts without sintering, and then it is fired in vacuum at one time (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
Conduct Research Top
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Why Lead-Free Soldering is Better
. Some of the harmful alloys that are used in normal soldering are tin, copper, silver bismuth, indium, zinc, and antimony. So why are these dangerous to humans everywhere? Prior to 1930, all homes used lead pipes to transport water to and from houses. Now, most homes use copper piping. However
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How to Choose a Solder
hazardous materials) are banned from the European Union as part of the Restriction of Hazardous Substances (RoHS). Lead-free solder may contain many metals including silver, copper, tin, bismuth, indium, zinc and antimony. Hard solders have a high melting point and are usually made with a high
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Wirtschaftlich‐gewerblicher part
Lead antimony tin solder ; Zus. z.
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China - Guidance Catalog for Industrial Structure Adjustment (2011 Version) Issued by the National Development and Reform Commission March 27, 2011 and Effecti...
1、 新建, extension tungsten, molybdenum, tin, antimony exploitation, smelting project, rare earth exploitation, mineral processing, smelting, separate project and antimonic oxide , lead tin solder production project 2, single series is 10 ten thousand 吨/年 as for blister copper smelting project 3, electrolytic …
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ZASMHBA0001459
The mechanical properties of the tin - lead - antimony solders are listed in Table 8.
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Audel Welding Pocket Reference
Table 7-4 Tin - Antimony - Lead Solders ASTM Alloy Grade Sn% Comments Pb% Sb% 172 20C 25C 30C 35C .
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ZCACA2001P303
ASTM grade C tin - lead - antimony solders 10 14.5 2.1 20 21.4 3.1 30 28.9 4.2 40 34.5 5.0 50 39.3 5.7 60 42.1 6.1 .
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Trade Science Inc. - Materials Science : An Indian Journal
In order to prevent pollution of the environment with lead the use of tin / antimony lead free solder alloy with some alloying elements is the best solder alloys for high temperature applications.