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  • TO-3P/220/247/254/257/258/264 Aluminum Nitride Ceramic Thermal Pads For MOSFET Transistor IGBT Transistor Heat Sink
    contact. The pads are made of ceramic materials such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Power Devices, Integrated Circuit (IC) chip packaging heat conduction, MOSFET Transistor
  • Turning up the Heat on Reliability and Reduce the Chances of a Thermal Failure with Diodes, Bipolar Transistors and MOSFETs that are Specified Up to 175°C
    Reducing the chances of a thermal failure. Nexperia offers a wide and growing range of diodes, bipolar transistors and MOSFETs that have a junction temperature specified up to 175 °C. Some things never change in the electronics industry. Designers are always being asked to squeeze more
  • How Copper Clip Makes Perfect Packages for the Future of Power
    We shipped more than 1.7 billion LFPAK devices in 2021, including MOSFETs and bipolar power transistors in LFPAK56 and its later derivatives from small size of 3 mm x 3 mm LFPAK33 to 8 mm x 8 mm LFPAK88. With the new CCPAK1212 now adding to the copper clip success story, we expect this technology
  • RF Test Sockets: The Key to the Effective Testing of High-Frequency Devices
    With rapid and constant advances in silicon technology, today's IC packages are continually changing both inside and out. The inside of the package is holding more transistors per square millimeter. The outside of the package is constantly being trimmed and reconfigured to approach the size
  • Smart Computing Article - Laplink to latency
    for their separate inventions in 1959. ICs are used in a variety of devices and are categorized by the number of transistors or active circuits they hold. LSI refers to a package of 100 to 5,000 transistors on one single chip. With this advancement from SSI (small-scale integration), which held 30 or fewer
  • Introduction to Analog Electronics
    techniques, better packaging to improve interconnections, increased speed, and use in new applications. Today, a transistor behaves according to the same principles as when, on the afternoon of December 23, 1947, Shockley, Bardeen and Brattain invented the first such device at the Bell Telephone
  • RC Model Aircraft Motor Control
    As modern MOSFET transistors are developed with lower ON resistance and smaller packages, Electronic Speed Controls (ESC) follow. By using a microcontroller and a few small MOSFETs, high performance speed controls can be built with advanced features in small packages. This application note
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Higher memory prices lift Micron to $341 million net income Kyocera to buy majority of CDMA chips from Qualcomm as part of acquisition Semtech rolls out 11 new ECL devices Philips puts two high-voltage transistors in 'mini' package Summit offers Visual IP on Windows PCs C-Cube powers Cisco video

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