UL Epoxy Potting Compounds

Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: CONAPOXY® FR-1820 is a two component, flame retardant, short pot life epoxy potting and casting system with excellent handling properties. CONAPOXY® FR-1820 is filled with a non abrasive filler to reduce wear on machine metering/dispensing. CONAPOXY® FR-1820 has been tested by

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Flame Retardant / UL 94V-0 Rated: Yes
• Form / Function: Encapsulant / Potting Compound

Description: CONAPOXY® FR-1810 is a flexible two-component, low exotherm, flame retardant, long pot life epoxy potting and casting system with excellent handling properties. CONAPOXY FR-1810 is filled with a non-abrasive filler to reduce wear on machine metering/dispensing equipment. FR-1810

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Flame Retardant / UL 94V-0 Rated: Yes
• Form / Function: Encapsulant / Potting Compound

Description: CONAPOXY® FR-1830 is an ambient cure two component, low viscosity, flame retardant epoxy potting, casting and coating system with excellent handling properties. CONAPOXY® FR-1830 is filled with a non abrasive filler to reduce wear on machine metering/dispensing equipment. CONAPOXY®

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Flame Retardant / UL 94V-0 Rated: Yes
• Form / Function: Encapsulant / Potting Compound

Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
• Cure Type / Technology: Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging

Description: MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require

• Chemical / Polymer System Type: Epoxy (EP)
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Flame Retardant / UL 94V-0 Rated: Yes
• Form / Function: Encapsulant / Potting Compound

Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System, Unfilled
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4.3

Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing and maintain more than

• Cure Type / Technology: Two Component System
• Features: Leveling / Filling Compound
• Thermal Conductivity: 1.25 W/m-K
• Viscosity: 24000 cP

Description: INSTAbond® 812FR A low viscosity, two part, UL94 V0 epoxy system that is for all types of room temperature curing adhesive applications including Casting, Encapsulating and 100% solids coatings that require cure at room temperature. INSTAbond® N812FR produces a durable, resilient bond

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound

Description: MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this

• Chemical / Polymer System Type: Epoxy (EP)
• Features: Flame Retardant (e.g. UL 94 Rated)
• Industry: Electronics
• Use: Encapsulant / Potting Compound

Description: Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Thermal Compound / Thermally Conductive
• Cure Type / Technology: Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging

Description: 50-3107 is a two component potting and encapsulating compound. This system is designed to be self- extinguishing and meets the stringent requirements of UL 94-VO. 50-3107 is thermally conductive and is RoHS compliant.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled
• Compound Type: Thermal Compound / Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System

Description: Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 1.94E7 to 2.22E7 µin/in-F
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric

Description: 20-3242FR Epoxy is a two component potting and encapsulating compound. This product has excellent electrical insulation properties and moisture resistance. 20-3242R FR Black and Yellow meet the stringent requirements of UL 94 V-O.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System

Description: Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Dielectric Strength: 475 kV/in
• Electrical / Electronics Applications: Semiconductors / IC Packaging

Description: 20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System, Filled
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4.51

Description: Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 27.78 to 30.56 µin/in-F
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating

Description: Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Thermal Compound / Thermally Conductive

Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low

• Cure Type / Technology: Two Component System
• Features: Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal / Heat Conductive
• Industry: Electronics
• Substrate / Material Compatibility: Metal, Plastic

Description: KEM® Cati-Coat® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Features: Flame Retardant (e.g. UL 94 Rated)
• Industry: OEM / Industrial, Other

Description: LOCTITE® 3165 Hysol Epoxy Hardener, Low Shrinkage is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol resins. LOCTITE 3145/3165 and 3145/3162 Hysol Epoxy Systems meet UL 94V-O Flammability Rating.

• Chemical / Polymer System Type: Epoxy (EP)

Description: High bond strength High thermal resistance Enable high yield in processing Halogen free Construction HXI0910: 9um black polyimide film and 10um epoxy adhesive Certification UL-94 VTM-0 flammability rating

• Chemical / Polymer System Type: Specialty / Other
• Compound Type: Electrical Insulation / Dielectric
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It is coated on one side with a proprietary B-staged modified epoxy adhesive. The Pyralux® HXC coverlay is used to

• Chemical / Polymer System Type: Specialty / Other
• Compound Type: Electrical Insulation / Dielectric
• Dielectric Constant (Relative Permittivity): 3.6 to 3.7
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. It will meet UL 94 V-0 requirements in 1/8 inch thickness.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical

• Coeff. of Thermal Expansion (CTE): 22.22 to 25 µin/in-F
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4.5
• Dielectric Strength: 400 to 450 kV/in

Description: EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical

• Applied Thickness / Gap Fill: 3.00E-6 to 7.00E-6 inch
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Dielectric Constant (Relative Permittivity): 4.5
• Dissimilar Substrates: Yes

Description: HYSOL® ES2500™ is a resilient, low cost, fast gelling potting compound. Ideal for potting and encapsulating high volume parts. Meets UL 94 HB Flame Retardant to 1.5mm thickness.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: Potting and encapsulating adhesive for use in electronics. It can replace traditional potting compounds, such as epoxy or polyurethane, which require mixing and contain hazardous chemicals.Providing it is stored and sealed in its foil pouch its shelf life can be 12 months

• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Use Temperature: 14 to 275 F

Description: A black, flame-retardant, room temperature curing epoxy for potting electrical and electronic components and sub assemblies. The hard, high gloss, jet black finish gives permanent (non repairable) environmental protection. Slight flexibility permits thermal expansion without stress.

• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Thermal Conductivity: 0.4500 W/m-K
• Use Temperature: -40 to 248 F

Description: A black, flame-retardant, room temperature curing epoxy for potting electrical and electronic components and sub assemblies. The hard, high gloss, jet black finish gives permanent (non repairable) environmental protection. Slight flexibility permits thermal expansion without stress.

• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Thermal Conductivity: 0.4500 W/m-K
• Use Temperature: -40 to 248 F

Description: A black, flame-retardant, room temperature curing epoxy for potting electrical and electronic components and sub assemblies. The hard, high gloss, jet black finish gives permanent (non repairable) environmental protection. Slight flexibility permits thermal expansion without stress.

• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Thermal Conductivity: 0.4500 W/m-K
• Use Temperature: -40 to 248 F

Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it acts as an adhesive and provides excellent thermal contact between dissimilar

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements of UL

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: (Known as Hysol ES1002 ) Black, low cost, flexible, capable of UL94V-0, non-abrasive filled, long pot life.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: A very low viscosity epoxy resin with excellent thermal stability, designed for compatibility with reflow applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use within the electronics

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Thermally Conductive
• Cure Type / Technology: Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging

Description: (Known as HYSOL STYCAST 2651-40FR/Catalyst 11 ) LOCTITE CAT 11 epoxy encapsulant is designed for general potting applications. It is the flame retardant version of STYCAST 2651-40. It meets UL94V0 and V1 flammability ratings at 6.4 mm and 3.0 respectively.

• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: LOCTITE® 3145 Hysol Epoxy Resin, Flame Retardant is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol hardeners. LOCTITE 3145/3162 and 3145/3165 Hysol Epoxy Systems meet UL 94V-O Flammability Rating.

• Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
• Thermal Conductivity: 3.9 W/m-K

Description: almost instantly to a depth of 7 mils and exhibits adhesion to a variety of metal, ceramic, and glass-filled epoxy surfaces. The product is optimized for coating thicknesses between 51 mic [0.002 in] and 150 mic [0.006 in]. The low viscosity of this formulation makes it suitable for use in

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Form / Function: Conformal / Encapsulating Coating
• Industry Applications: Other
• Viscosity: 160 cP

Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Chemical / Polymer System Type: Epoxy
• Coeff. of Thermal Expansion (CTE): 22.22 to 77.78 µin/in-F
• Compound Type: Liquid
• Elongation: 5 %

Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Coeff. of Thermal Expansion (CTE): 30.56 to 88.89 µin/in-F
• Composition: Two Component System, Filled
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking

Description: Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 51.11 to 103 µin/in-F
• Composition: Single Component System, Filled
• Cure Type / Technology: Thermosetting / Crosslinking

Description: Hernon? 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond? 397 will change from amber-yellow to a reddish brown upon cure. Product

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
• Form / Function: Encapsulant / Potting Compound

Description: Tuffbond® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 302

• Chemical / Polymer System Type: Ceramic / Inorganic Cement, Epoxy (EP)
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial

Description: Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Thermal Compound / Thermally Conductive
• Cure Type / Technology: Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)

Description: Tuffbond® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond®

• Chemical / Polymer System Type: Ceramic / Inorganic Cement, Epoxy (EP)
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial

Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 16.67 to 42.22 µin/in-F
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: EPO-TEK® UV Epoxies are your alternative to traditional oven cured optical products. They are fast curing and photo curable. These UV cure adhesives simplify the handling process by using a single component system. Our adhesives require no mixing, cure in seconds or minutes, and have an

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 22.78 to 94.44 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Optoelectronics / Photonics, Semiconductors / IC Packaging

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 11.67 to 71.11 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 3.18

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 30 to 97.22 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Dielectric Constant (Relative Permittivity): 4.26