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Supplier: Epoxies Etc...
Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
- Thermal Conductivity: 0.37499254 W/m-K
- Dielectric Strength: 454.99999999999955 kV/in
- Dielectric Constant (Relative Permittivity): 4.3
- Viscosity: 30 to 20,000 cP
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Supplier: Epoxies Etc...
Description: 20-3046E FR is an epoxy potting and casting compound. This system is designed to be self extinguishing.
- Viscosity: 55,000 cP
- Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
- Chemical System: Epoxy (EP)
- Industry: OEM / Industrial
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Supplier: Allied Electronics, Inc.
Description: A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. Copper Electroplating Solution and
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Supplier: Epoxies Etc...
Description: 20-3047 FR is the low viscosity version of the 20-3046E FR. It is self extinguishing and designed for low viscosity potting requirements.
- Viscosity: 5,000 cP
- Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
- Chemical System: Epoxy (EP)
- Industry: OEM / Industrial
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed
- Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
- Chemical System: Epoxy (EP)
- Industry: Semiconductors / IC Packaging
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Supplier: Allied Electronics, Inc.
Description: A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis.
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Supplier: RS Components, Ltd.
Description: EPOXY RESIN 250 G
- Features: Encapsulating / Potting Compound, Flame Retardant (e.g. UL 94 Rated), Specialty / Other, Thermal Compound / Interface (Thermally Conductive)
- Chemical System: Epoxy (EP)
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1610 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on potted
- Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Flame Retardant Encapsulating and Potting Compound, UL 94V-0 (FILE # E334302).
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 807 An epoxy electrical encapsulant that meets V-0 flammability rating and has excellent electrical properties. Low shrinkage and low thermal expansion to maximize adhesion and reduce mechanical stress on potted parts.
- Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
- Chemical System: Epoxy (EP)
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Flexible Thermally Conductive Flame Retardant Encapsulating and Potting Compound, Meets UL 94V-0 Kit
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Flame Retardant Potting and Encapsulating Compound, UL 94V-0 (FILE # E334302)
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Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-curing epoxy potting compound designed to pass UL testing and maintain more than
- Viscosity: 24,000 cP
- Thermal Conductivity: 1.25 W/m-K
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Flexible Thermally Conductive Flame Retardant Encapsulating and Potting Compound, Meets UL 94V-0 (MTO = 4) Kit
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and
- Viscosity: 20,000 cP
- Use Temperature: -55 to 150 F
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Ceramic / Glass, Electrical Insulating / Dielectric, Electrical Power / HV, Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Liquid, Metal
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the
- Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
- Chemical System: Epoxy (EP)
- Industry: Semiconductors / IC Packaging
- Type: Thermal Compound / Thermally Conductive
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Supplier: Techsil Limited
Description: MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
- Chemical System: Epoxy (EP)
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Supplier: Techsil Limited
Description: MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
- Chemical System: Epoxy (EP)
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Supplier: Epoxies Etc...
Description: 20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
- Use Temperature: -58 to 275 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,000 psi
- Dielectric Strength: 459.9999999999999 kV/in
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Supplier: Master Bond, Inc.
Description: Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
- Viscosity: 30,000 to 50,000 cP
- Use Temperature: -76 to 194 F
- Coeff. of Thermal Expansion (CTE): 19,444,444.444444444 to 22,222,222.22222222 µin/in-F
- Tensile Strength (Break): 2,600 to 2,800 psi
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Supplier: MacDermid Alpha Electronics Solutions
Description: A very low viscosity epoxy resin with excellent thermal stability, designed for compatibility with reflow applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use within the electronics
- Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
- Chemical System: Epoxy (EP)
- Industry: Semiconductors / IC Packaging
- Type: Thermal Compound / Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite E-40EXP is a two component, room temperature curing epoxy adhesive designed for potting electrical motors. Its typical applications include the potting of wire conduits to isolate the electrical motor from the surrounding environment UL-674 Compliant. 200
- Viscosity: 24,000 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Description: KEM® Cati-Coat® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and
- Use Temperature: 45 to 100 F
- Substrate Compatibility: Concrete / Masonry
- Chemical System: Epoxy (EP)
- Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Leveling / Filling Compound, Other
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Supplier: Master Bond, Inc.
Description: Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of
- Use Temperature: -59.8 to 194 F
- Coeff. of Thermal Expansion (CTE): 27.779999999999998 to 30.560000000000002 µin/in-F
- Tensile Strength (Break): 3,000 psi
- Dielectric Strength: 400.00000000000006 to 450.00000000000006 kV/in
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified.
- Viscosity: 9,500 to 12,000 cP
- Thermal Conductivity: 1 W/m-K
- Tensile Strength (Break): 5,000 psi
- Elongation: 5 %
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low
- Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Liquid, Metal, Plastic, Thermal / Heat Conductive
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Electronics
Description: HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. It will meet UL 94 V-0 requirements in 1/8 inch thickness.
- Thermal Conductivity: 0.4 W/m-K
- Viscosity: 8,800 cP
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical
- Viscosity: 20,000 to 40,000 cP
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 22.220000000000002 to 25 µin/in-F
- Tensile Strength (Break): 4,000 to 5,000 psi
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Supplier: Master Bond, Inc.
Description: EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical
- Applied Thickness / Gap Fill: 0.000003 to 0.000007 inch
- Viscosity: 6,000 to 9,000 cP
- Use Temperature: -80 to 400 F
- Tensile Strength (Break): 4,000 to 5,000 psi
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Supplier: Henkel Corporation - Electronics
Description: HYSOL® ES2500™ is a resilient, low cost, fast gelling potting compound. Ideal for potting and encapsulating high volume parts. Meets UL 94 HB Flame Retardant to 1.5mm thickness.
- Use Temperature: -40 to 221 F
- Thermal Conductivity: 0.288 W/m-K
- Viscosity: 1,500 cP
- Industry: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
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Supplier: DigiKey
Description: POTTING COMPOUND FLM RETARD 94V0
- Features: Flame Retardant (e.g. UL 94 Rated)
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST 2651-40FR/Catalyst 9 ) LOCTITE CAT 9 is a two component epoxy encapsulant designed for general potting applications. It is a flame retardant version of STYCAST 2651-40. It meets UL 94 V-0 flammability at 6.4 mm thickness.
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST 2651-40FR/Catalyst 11 ) LOCTITE CAT 11 epoxy encapsulant is designed for general potting applications. It is the flame retardant version of STYCAST 2651-40. It meets UL94V0 and V1 flammability ratings at 6.4 mm and 3.0 respectively.
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: ELANTAS North America LLC
Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Use Temperature: 311 F
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 77.77777777777777 µin/in-F
- Elongation: 5 %
- Tensile Strength (Break): 8,600 psi
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Indicates content that may require registration and/or purchase.
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New Potting Material Withstands Exposure To Harsh Chemicals
Rocky Hill, CT â To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced Loctite E-40EXP, a two-component, room-temperature-curing epoxy potting compound designed to pass UL testing and maintain more than …
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Potting Compounds - Chemicals & Adhesives from Allied Electronics
EPOXY -BLACK FLAME RETARDANT ENCAPSULATING & POTTING COMPOUND , UL 94V-0(375ml; 12oz) .