Vacuum Potting Compounds

Description: Two-Component, Medium Viscosity, Addition Cure, Potting/Encapsulating Silicone Compound Properties Viscosity 44000 Hardness Sha 29 Description Bluesil V-217 is a clear, two component, medium viscosity, addition cure silicone compound. It is designed for potting and

• Viscosity: 44,000 cP
• Form / Function: Conformal / Encapsulating Coating
• Features: Electronics, Encapsulating / Potting, Grease / Paste
• Chemical System: Silicone

Description: Silicone-based compound, heavy consistency APPLICATIONS Lubrication for control and pressure plug valves, water softener and faucet valves. Sealant for vacuum and pressure systems. Sealant for outdoor equipment (also shipboard) subject to washing and harsh environmental exposure:

• Operating / Use Temperature: -40 to 399.2 F
• Dielectric Strength: 17,716,535.4330708 V/m
• Density / Specific Gravity (@15.6°C, 60°F): 1 specific gravity
• Industry Applications: Automotive / Transportation, Electrical / Electronic, Food Grade / Contact (FDA H1), Marine

Description: Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.

• Applied Thickness / Gap Fill: 0.003 to 0.005 inch
• Viscosity: 50 to 200 cP
• Use Temperature: -80 to 550 F
• Tensile Strength (Break): 11,000 to 12,000 psi

Description: well to a wide variety of substrates including metals, composites, ceramics and glass along with many plastic and rubber materials. EP41S-LO is a highly reliable electrical insulator and is particularly well suited for use in small sized potting applications. Most importantly, it has minimal

• Viscosity: 3,000 to 15,000 cP
• Use Temperature: -60 to 250 F
• Tensile Strength (Break): 300,000 to 350,000 psi
• Industry: Aerospace, OEM / Industrial, Semiconductors / IC Packaging

Description: LOCTITE STYCAST ES 0506, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 0506 is a two-component, filled epoxy system designed for vacuum impregnation applications as well as for general potting and encapsulating. Please refer to the TDS for alternate cure schedules. Two

• Coeff. of Thermal Expansion (CTE): 45 µin/in-F
• Tensile Strength (Break): 7,880 psi
• Viscosity: 30,000 cP
• Chemical System: Epoxy (EP)

Description: Momentive RTV566 is a two-part silicone rubber compound processed and tested for applications where low outgassing is required. Supplied as a kit with RTV566 A (base compound) and RTV566 B (curing agent). Product Benefits Room temperature cure Excellent release properties Provides low

• Use Temperature: -115 to 260 F
• Features: Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: is 5 %. <> 1.3 Many types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams, elastomers, films, tapes, insulations, shrink tubings, adhesives, coatings, fabrics, tie cords, and lubricants. The materials may be tested in the

Description: Dow DOWSIL™ 93-500 Space Grade Encapsulant Clear is a two-part silicone elastomer for aerospace applications. It is supplied in flowable and thixotropic grades, cures to flexible rubber elastomers, and meets NASA requirements for low thermal vacuum outgassing. 49 kg Kit.

• Viscosity: 80 cP
• Thermal Conductivity: 0.2 W/m-K
• Tensile Strength (Break): 975 psi
• Elongation: 170 %

Description: Room temperature cure resin for impregnation and potting of sand-filled transformers

• Use Temperature: 464 F
• Elongation: 9 %
• Dielectric Strength: 3,800 kV/in
• Viscosity: 150 to 200 cP

Description: 70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs,

• Viscosity: 85,000 cP
• Thermal Conductivity: 1.80284875 W/m-K
• Tensile Strength (Break): 14,500 psi
• Form / Function: Die Bonding Adhesive / Compound

Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use Temperature: 356 F
• Thermal Conductivity: 0.15 to 0.2 W/m-K
• Coeff. of Thermal Expansion (CTE): 83.33333333333333 to 172.22222222222223 µin/in-F
• Elongation: 70 %

Description: Sauereisen Electric Resistor Cement No. 78 is an ideal electrical refractory cement for coating resistors, coils, electric heating elements, furnaces, and embedding resistance wire. It replaces insulating varnish, enamel, mica, etc. The cement is also available in powder form known as Sauereisen

• Use Temperature: 2,600 F
• Tensile Strength (Break): 325 psi
• Dielectric Strength: 1.3 to 51.00000000000001 kV/in
• Dielectric Constant (Relative Permittivity): 3.4 to 4.5

Description: Dow DOWSIL™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,

• Thermal Conductivity: 0.2 W/m-K
• Tensile Strength (Break): 1,225 psi
• Elongation: 125 %
• Dielectric Strength: 460 kV/in

Description: Dow DOWSIL™ 93-500 Space Grade Encapsulant and 93-500 Thixotropic Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,

• Viscosity: 8,000 cP
• Thermal Conductivity: 0.2 W/m-K
• Tensile Strength (Break): 975 psi
• Elongation: 170 %

Description: The use of electricity in electrical machines and devices is not possible without a customized insulation system. In addition, sensitive electronic components must be protected against mechanical stress and environmental influences. We have developed the best solution to meet these requirements.

• Features: Conformal Coating, Encapsulating / Potting, Film / Sheet, Liquid
• Form / Function: Impregnating Varnish (Dip, Trickle, Vacuum)

Description: after production breaks Optional: Vacuum potting at up to 100 mbar possible even without intermediate preparation Key features Complete evacuation of a 200 liter barrel by way of a powerful vacuum pump Easy and safe operation thanks to lifting unit, fill-level monitor with two

• Media Viscosity: 70,000 cps
• Container Size: 200,000 cc
• Dispensing Equipment Type: Dispense Only
• Dispensing Type: Fill ("Potting")

Description: The A220 follower plate pump is used for feeding high viscosity, non-abrasive potting compounds. The reciprocating piston pump used in this system ensures a continuous supply of material, which is pumped during both the downward and upward stroke, making it a rugged, cost-effective

• Dispensing Equipment Type: Dispense Only
• Dispensing Type: Fill ("Potting")
• Application: High Viscosity
• Features: Other

Description: The Series GT27XX pressure transducers and pressure transmitters are designed to meet the requirements of demanding test and measurement environments. The GT27XX sensors provide improved 0.15% accuracy and high level outputs. Standard analog outputs, plus RS232, RS485, and CANbus digital outputs,

• Working Pressure Range: 0 to 3,000 psi
• Operating Temperature: -65 to 250 F
• Measurement Type: Absolute, Compound, Gauge, Vacuum
• Signal Output: Analog Voltage, RS232 / RS485

Description: Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation

• Use Temperature: 464 F
• Coeff. of Thermal Expansion (CTE): 51.11111111111111 to 103.33333333333333 µin/in-F
• Dielectric Strength: 1,600.0000000000002 kV/in
• Dielectric Constant (Relative Permittivity): 3.4

Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Viscosity: 3,000 to 6,000 cP
• Use Temperature: -100 to 400 F
• Tensile Strength (Break): 4,000 to 6,000 psi

Description: used in vacuum situations

• Viscosity: 200,000 to 250,000 cP
• Use Temperature: -80 to 600 F
• Tensile Strength (Break): 9,000 to 10,000 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: These liquid level switches are sealed with potting compound. The only path for liquid to the electrical switch would be through the wires. If the wires are terminated in an appropriate manner (eg. NEMA-6 connectors), the level switch will meet or exceed a NEMA-6 rating, making them

• Maximum Operating Pressure: 1,000 psi
• Features: Electromechanical Switch, Normally Closed (NC), Normally Open (NO), Single Pole, Single Throw (SPST)
• Media Type: Liquid
• Meter Technology Type: Mechanical / Magnetic Floats

Description: These liquid level switches are sealed with potting compound. The only path for liquid to the electrical switch would be through the wires. If the wires are terminated in an appropriate manner (e.g. NEMA-6 connectors), the level switch will meet or exceed a NEMA-6 rating, making them

• Maximum Operating Pressure: 225 psi
• Features: Electromechanical Switch, Normally Closed (NC), Normally Open (NO), Single Pole, Single Throw (SPST)
• Media Type: Liquid
• Meter Technology Type: Mechanical / Magnetic Floats

Description: These liquid level switches are sealed with potting compound. The only path for liquid to the electrical switch would be through the wires. If the wires are terminated in an appropriate manner (eg. NEMA-6 connectors), the level switch will meet or exceed a NEMA-6 rating, making them

• Maximum Operating Pressure: 100 psi
• Features: Electromechanical Switch, Normally Closed (NC), Normally Open (NO), Single Pole, Single Throw (SPST)
• Media Type: Liquid
• Meter Technology Type: Mechanical / Magnetic Floats

Description: assemblies. Our epoxy and the mechanical assemblies can be designed for both vacuum and positive pressure and a wide temperature range. Hermetically sealed circuit boards are useful for enclosure projects with complex computations as well as sensors, switches, diodes, and capacitors.

• Additional Services: Design Assistance
• Industry: Electrical / Electronics, Military / Law Enforcement
• Sealing Method Capabilities: Epoxies
• Features: North America, Northeast US Only, United States Only