Products & Services
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Supplier: Bluestar Silicones USA Corp.
Description: Two-Component, Medium Viscosity, Addition Cure, Potting/Encapsulatin g Silicone Compound Properties Viscosity 44000 Hardness Sha 29 Description Bluesil V-217 is a clear, two component, medium viscosity, addition cure silicone compound. It is designed for potting and
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
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Supplier: Dupont Molykote
Description: Silicone-based compound, heavy consistency APPLICATIONS Lubrication for control and pressure plug valves, water softener and faucet valves. Sealant for vacuum and pressure systems. Sealant for outdoor equipment (also shipboard) subject to washing and
- Applications / Function: Automotive / Transportation, Electrical / Electronic, Food Grade / Contact (FDA H1), Marine, Sealing / Barrier
- Chemistry / Constituents: Synthetic / Semi-synthetic, Silicone
- Features: Dielectric (Transformer / EDM)
- Operating / Use Temperature: -40 to 399 F
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Supplier: Techsil Limited
Description: Momentive RTV566 is a two-part silicone rubber compound processed and tested for applications where low outgassing is required. Supplied as a kit with RTV566 A (base compound) and RTV566 B (curing agent). Product Benefits Room temperature cure Excellent release
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
- Use Temperature: -115 to 260 F
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: RS Components, Ltd.
Description: A flexible but tough potting compound which adheres to most surfaces.The materials low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.2500 W/m-K
- Use Temperature: -58 to 248 F
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Supplier: ELANTAS North America LLC
Description: The use of electricity in electrical machines and devices is not possible without a customized insulation system. In addition, sensitive electronic components must be protected against mechanical stress and environmental influences. We have developed the best solution to meet these requirements. Our
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound, Impregnating Varnish (Dip, Trickle, Vacuum)
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Supplier: ELANTAS North America LLC
Description: High performance, fast and easy charging, high safety, long range: these are key criteria to decide which electric or hybrid vehicle to buy. Manufacturers are therefore challenged to make their drives and batteries even more compact and efficient. Particularly effective hermetic management of the
- Form / Function: Encapsulant / Potting Compound, Impregnating Varnish (Dip, Trickle, Vacuum)
- Industry Applications: Automotive
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 93-500 Space Grade Encapsulant Clear is a two-part silicone elastomer for aerospace applications. It is supplied in flowable and thixotropic grades, cures to flexible rubber elastomers, and meets NASA requirements for low thermal vacuum outgassing. 49 kg Kit.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 480 kV/in
- Elongation: 170 %
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Supplier: Ellsworth Adhesives
Description: substrates, OSR mirrors to substrates, or cover glasses to solar cells. It offers a wide service temperature range, electrical stability, and meets NASA requirements for low thermal vacuum outgassing. 110 g Kit.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 480 kV/in
- Elongation: 170 %
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Supplier: Ellsworth Adhesives
Description: substrates, OSR mirrors to substrates, or cover glasses to solar cells. It offers a wide service temperature range, electrical stability, and meets NASA requirements for low thermal vacuum outgassing. 115 g Kit.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 460 kV/in
- Elongation: 125 %
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Supplier: ELANTAS North America LLC
Description: Room temperature cure resin for impregnation and potting of sand-filled transformers
- Chemical / Polymer System Type: Polyester / Vinyl Ester
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: ELANTAS North America LLC
Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Chemical / Polymer System Type: Polyester / Vinyl Ester
- Coeff. of Thermal Expansion (CTE): 83.33 to 172 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 0506, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 0506 is a two-component, filled epoxy system designed for vacuum impregnation applications as well as for general potting and encapsulating. Please refer to the TDS for alternate cure schedules. Two
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 45 µin/in-F
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 7880 psi
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Supplier: Master Bond, Inc.
Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Two Component System
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Supplier: Epoxies Etc...
Description: 70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs,
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 1264J, Epoxy, Slightly Flexible, Virtually Stress Free, Encapsulant, Potting LOCTITE® STYCAST 1264J Parts AB cures slightly flexible and virtually stress free. Some darkening of the cured material will occur after long exposure to temperatures above 65ºC or after
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 39.44 µin/in-F
- Cure Type / Technology: Two Component System
- Use Temperature: 248 F
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Supplier: Sauereisen, Inc.
Description: Sauereisen Electric Resistor Cement No. P-78. When mixed with water to the proper consistency, No. P-78 has the same characteristics as the No. 78 Paste. Working properties of the cement exhibit a virtually unlimited pot life prior to exposure to air. This feature makes Nos. 78
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Dielectric Constant (Relative Permittivity): 3.4 to 4.5
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Supplier: Master Bond, Inc.
Description: EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours, low
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 to 30.56 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
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Supplier: Stellar Technology
Description: CANbus digital outputs, are standard features. Azero adjustment pot is designed into each GT27XX transducer. For voltage output units, isolated voltage output comes standard. Pressure ranges extend to 40,000 psi in both gage and absolute references. Each of these pressure
- Additional Pressure Reading: Absolute, Gauge, Compound
- Device Category: Transducer
- Features: Temperature Compensation
- Operating Temperature: -65 to 250 F
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Supplier: ASTM International
Description: , the tolerance on 25 and 125°C is ±1°C and on 23°C is ±2°C. The tolerance on relative humidity is ±5 %. 1.3 Many types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams, elastomers, films, tapes
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Supplier: ASTM International
Description: tolerance on relative humidity is 5 %. <> 1.3 Many types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams, elastomers, films, tapes, insulations, shrink tubings, adhesives, coatings, fabrics, tie cords, and lubricants. The
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Supplier: ASTM International
Description: 125°C is ± 1°C and on 23°C is ± 2°C. The tolerance on relative humidity is ± 5%. 1.3 Many types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams, elastomers, films, tapes, insulations, shrink tubings
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Supplier: ASTM International
Description: °C is ±1 °C and on 23 °C is ±2 °C. The tolerance on relative humidity is ±5 %. 1.3 Many types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams, elastomers, films, tapes, insulations, shrink
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Supplier: Scheugenpflug, Inc.
Description: Consistently homogeneous potting material, even after production breaks Optional: Vacuum potting at up to 100 mbar possible even without intermediate preparation Key features Complete evacuation of a 200 liter barrel by way of a powerful vacuum pump Easy and safe
- Application: High Viscosity, Other
- Container Size: 200000 cc
- Dispensing Type: Fill ("Potting")
- Media Viscosity: 70000 cps
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Supplier: Scheugenpflug, Inc.
Description: The A220 follower plate pump is used for feeding high viscosity, non-abrasive potting compounds. The reciprocating piston pump used in this system ensures a continuous supply of material, which is pumped during both the downward and upward stroke, making it a rugged, cost-effective
- Application: High Viscosity, Other
- Dispensing Type: Fill ("Potting")
- Type: Dispense Only
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Supplier: OMEGA Engineering, Inc.
Description: These liquid level switches are sealed with potting compound. The only path for liquid to the electrical switch would be through the wires. If the wires are terminated in an appropriate manner (eg. NEMA-6 connectors), the level switch will meet or exceed a NEMA-6 rating, making them
- Device Classification: Sensor-Only
- Level Measurement Type: Point Level / Multi-Point Levels
- Maximum Operating Pressure: 100 psi
- Meter Technology: Mechanical / Magnetic Floats
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Supplier: OMEGA Engineering, Inc.
Description: These liquid level switches are sealed with potting compound. The only path for liquid to the electrical switch would be through the wires. If the wires are terminated in an appropriate manner (eg. NEMA-6 connectors), the level switch will meet or exceed a NEMA-6 rating, making them
- Device Classification: Sensor-Only
- Level Measurement Type: Point Level / Multi-Point Levels
- Maximum Operating Pressure: 500 psi
- Meter Technology: Mechanical / Magnetic Floats
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Supplier: OMEGA Engineering, Inc.
Description: These liquid level switches are sealed with potting compound. The only path for liquid to the electrical switch would be through the wires. If the wires are terminated in an appropriate manner (e.g. NEMA-6 connectors), the level switch will meet or exceed a NEMA-6 rating, making them
- Device Classification: Sensor-Only
- Level Measurement Type: Point Level / Multi-Point Levels
- Maximum Operating Pressure: 225 psi
- Meter Technology: Mechanical / Magnetic Floats
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Supplier: OMEGA Engineering, Inc.
Description: These liquid level switches are sealed with potting compound. The only path for liquid to the electrical switch would be through the wires. If the wires are terminated in an appropriate manner (eg. NEMA-6 connectors), the level switch will meet or exceed a NEMA-6 rating, making them
- Device Classification: Sensor-Only
- Level Measurement Type: Point Level / Multi-Point Levels
- Maximum Operating Pressure: 1000 psi
- Meter Technology: Mechanical / Magnetic Floats
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Supplier: Douglas Electrical Components
Description: glass-to-metal and epoxy seals, download our whitepaper. Types of Hermetic Seals How does potting encapsulate the electrical connection? Douglas Electrical Components uses a variety of proprietary steps to ensure the right potting compound, process, and materials are used to
- Additional Services: Design Assistance
- Industry: Electrical / Electronics, Military / Law Enforcement
- Location: North America, United States Only, Northeast US Only
- Sealing Method Capabilities: Epoxies
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Featured Products Top
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an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which allow it to be used in vacuum, aerospace and clean room applications. Supreme 3HTND-2CCM has a paste consistency that flows slightly while curing. It cures readily at elevated (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc.
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Polyurethane: "Customized Plastic"
PU Potting Compounds: Vacuum Processing Provides Optimum Results - Polyurethanes have an extremely wide and flexibly modifiable range of properties. This makes them a popular and frequently used group of materials in industrial production. PU potting compounds can be processed easily and feature
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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Characterization Of The Outgassing Of Spacecraft Materials
Guillin, J., "Evaluation of Kinetic Outgassing Under Vacuum for Potting Compounds and Paints Proceed of ESA Symposium of Spacecraft Materials," ESTEC, October 1979 - ESA SP -145.
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The Prototype GAPS (pGAPS) Experiment
The potting compound was vacuum degassed both prior to, and after, pouring into the housings.
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Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies > POWER AND HIGH-VOLTAGE C...
Insufficient outgassing of potting compounds during vacuum impregnation .
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Development and utilization of composite honeycomb and solid laminate reference standards for aircraft inspections.
Vacuum potfor core potting compound .
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Development of an efficient propulsion motor and driver for use in the deep ocean
The rotors consist of samarium cobalt magnets bonded to a soft iron shell, therotor assembly is sealed with a thin wall inner sleeve and vacuum filled with potting compound .
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Manufacturing aspects of toroidal field magnets for tokamak power reactors
Tor this approach, injection of the potting compound into the coil/case cavity will entail: deaeration of the potting compound In a vacuum deacratlon tank at a temperature of 40° - 50°C (104* - 122°F); preheating of the coil and case to a temperature of …
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NuMI proton kicker extraction magnet termination resistor system
The loads are leak-checked and vacuum potted with a silicone compound (Sylgard® 184).
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Electromagnetic considerations in power electronic converters
Interwire and bond pad spacing was 0.5 mm so that the com- ponent meets the relevant safety specifications when vacuum encapsulated with a potting compound such as Sylgard.
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The effect of out-gassing from commonly used spacecraft/space instrument materials on the UV-visible-IR reflectivity of optical surfaces
The 3 materials selected were Balzer’s vacuum pump oil, Conathane potting compound and G-10 printed circuit boards.
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Internally Cooled Cable Superconductor (ICCS) for TF and PF coils of FED
The assem- bled winding is vacuum impregnated with an epoxy potting compound which reinforces the electrical insulation, eliminates the possibility of intertum conductor slippage, and slippage of the conductor within the channel.