Void Filling Compound

Description: 3M™ Scotch-Weld™ Structural Void Filling Compound 3439 HT is a temperature-resistant, one-part, high-temperature curing low density void filling compound.

• Industry: Aerospace, OEM / Industrial
• Chemical System: Epoxy (EP)
• Features: Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound
• Cure / Technology: Single Component System, Thermosetting / Crosslinking

Description: Structural one-part low weight void filler for aircraft interiors. One-part low weight filler combining extreme low density with high extrusion rate for manual and automatic applications. Pumpable. Full stand alone FST properties with patented non-halogen based FST system. Low flow for ease

• Industry: Aerospace, OEM / Industrial
• Chemical System: Epoxy (EP)
• Features: Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound, Other
• Cure / Technology: Single Component System

Description: 3M™ Scotch-Weld™ Void Filling and Edge Sealing Compound EC-3524 B/A Off-White is a two-part flame retardant epoxy. Scotch-Weld EC-3524 B/A Off-White can be used for void filling, edge sealing and as an abradable compound in aircraft engines.

• Use Temperature: 250 F
• Industry: Aerospace, OEM / Industrial
• Chemical System: Epoxy (EP)
• Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound, Other

Description: Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a).

• Use Temperature: -67 to 212 F
• Industry: Aerospace, OEM / Industrial
• Chemical System: Epoxy (EP)
• Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound, Other

Description: Sauereisen Urethane Filler Compound No. 309 is an urethane formulation specifically designed to fill voids, irregularities, and air pockets in concrete. The filler compound provides a uniform surface for the application of Sauereisen ConoFlex Urethane No. 381.

• Industry: Building / Construction
• Substrate Compatibility: Concrete / Masonry
• Features: Leveling / Filling Compound
• Chemical System: Polyurethane (PU, PUR)

Description: NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Typically installed between plate-type heating coils or with systems that require periodic disassembly, NH remains pliable indefinitely, allowing the

• Use Temperature: 32 to 410 F
• Thermal Conductivity: 34.614696 to 69.229392 W/m-K
• Features: Gap Filling Compound, Thermal Compound / Interface (Thermally Conductive)
• Cure / Technology: Single Component System

Description: Sauereisen Filler Compound No. 209 is an epoxy formulation specifically designed to fill voids, irregularities, and air pockets in concrete. The filler compound provides a smooth surface for the application of epoxy monolithics. No. 209 is not compatible with vinyl ester

• Use Temperature: 65 to 85 F
• Tensile Strength (Break): 2,200 psi
• Substrate Compatibility: Concrete / Masonry
• Chemical System: Epoxy (EP)

Description: Vibra-Tite anaerobic retaining compounds are designed to increase shear strength on non-threaded cylindrical metal assemblies. The liquid anaerobic material fills the voids between close-fitting metal parts and cures to a toughened thermoset-plastic which creates a solid one piece

• Use Temperature: -65 to 400 F
• Cure / Technology: Anaerobic, Single Component System
• Industry: Building / Construction
• Features: Gap Filling Sealant / FIP Gasket, Thread Locker / Retainer

Description: Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics,

• Viscosity: 25 cP
• Thermal Conductivity: 1.8 W/m-K
• Dielectric Strength: 400.00000000000006 kV/in
• Features: Gap Filling Compound, Leveling / Filling Compound, Thermal / Heat Conductive

Description: particularly steel, and aluminum. It has good void filling properties. Adhesion to ceramics glass, wood, vulcanized rubber and many plastics is excellent. The cured epoxy responds well to thermal cycling and has high chemical resistance when exposed to water, oil and most organic

• Use Temperature: -60 to 250 F
• Coeff. of Thermal Expansion (CTE): 45 µin/in-F
• Tensile Strength (Break): 8,000 psi
• Dielectric Strength: 110 kV/in

Description: BERGQUIST GAP FILLER TGF 1400SL, Thermally conductive, Silicone based, Two-part, Low Viscosity, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone based, liquid gap filling material. This material has an extremely low viscosity

• Use Temperature: 76 to 392 F
• Thermal Conductivity: 1.4 W/m-K
• Features: Gap Filling Compound, Silicone, Thermally Conductive

Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173

• Chemical System: Epoxy (EP)
• Features: Leveling / Filling Compound
• Industry: OEM / Industrial
• Cure / Technology: Thermosetting / Crosslinking

Description: (Known as Hysol XE1218 ) LOCTITE ECCOBOND XE 1218 is a reworkable, snap cure, void-free, fast flowing underfill that also provides excellent adhesion and reliability benefits.

• Coeff. of Thermal Expansion (CTE): 41.666666666666664 µin/in-F
• Viscosity: 1,100 cP
• Industry: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: DURA-PLATE 2300 is a three component, epoxy modified cementitious resurfacer containing Portland Cement, hydrophobic thixotropes, fiber reinforcement, graded silica sand and other abrasion resistant aggregates. It is used for resurfacing, patching and filling voids (bugholes) in

• Use Temperature: 40 to 95 F
• Tensile Strength (Break): 600 psi
• Features: Air Setting / Film Drying, Leveling / Filling Compound
• Substrate Compatibility: Concrete / Masonry

Description: (Known as Hysol E1216 ) An innovative, non-reworkable, capillary flow underfill for CSP, BGA or flip chip devices. Designed for high volume assembly operations that require an underfill that flows very fast, fully cures in the length of one reflow oven and provides a void-free underfill area.

• Coeff. of Thermal Expansion (CTE): 18.88888888888889 µin/in-F
• Viscosity: 6,000 cP
• Industry: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: KEM® Cati-Coat® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and

• Use Temperature: 45 to 100 F
• Substrate Compatibility: Concrete / Masonry
• Chemical System: Epoxy (EP)
• Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Leveling / Filling Compound, Other

Description: (Known as LOCTITE ECCOBOND UF 8840 ) LOCTITE ECCOBOND UF 8840 liquid epoxy underfill encapsulant is designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage. It is formulated to flow consistently without voids on die sizes over 20 x 20mm. It is

• Industry: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: Henkel Loctite STYCAST EFF 15 Light Yellow, formerly Emerson and Cuming, is a one component, heat curing, epoxy based, syntactic foam powder that is used filling voids and reaching small spaces in electronic components. It offers low shrinkage, low stress, and is self-extinguishing. 1

• Thermal Conductivity: 0.12 W/m-K
• Dielectric Strength: 200.66000000000042 kV/in
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: CM8005 is a single-component room temperature cure gel-like anaerobic gasketing compound formulated to provide instant sealing capabilities. Once cured between mating metal flanges and filling voids in the surface, CM8005 provides a thin, flexible, solvent and temperature

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Cure / Technology: Anaerobic, Room Temp. Cure / Vulcanizing, Single Component System

Description: ResinLab EP691F Clear is a two component, room temperature or heat curing, epoxy encapsulant that is used for medium to large castings and filling voids. It is electronic grade, rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids,

• Elongation: 4.5 %
• Tensile Strength (Break): 8,300 psi
• Dielectric Strength: 550 kV/in
• Viscosity: 10 to 700 cP

Description: ResinLab EP691F Clear is a two component, room temperature or heat curing, epoxy encapsulant that is used for medium to large castings and filling voids. It is electronic grade, rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids,

• Elongation: 4.5 %
• Tensile Strength (Break): 8,300 psi
• Dielectric Strength: 550 kV/in
• Viscosity: 700 to 14,000 cP

Description: LOCTITE ECCOBOND E 1172 A, Void-free, Epoxy, Underfill LOCTITE® ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25 micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform

• Viscosity: 17,000 cP

Description: Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers.

• Use Temperature: 20 to 400 F
• Features: Air Setting / Film Drying, Leveling / Filling Compound, Other, Solvent Based (Volatile Organic), Unfilled
• Substrate Compatibility: Concrete / Masonry
• Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric

Description: General Polymers 3513 EPOXY SCRATCH COAT MASTIC is a high solids epoxy bughole filler for filling voids and for use as a surface patching compound for concrete. It is formulated for ease of application with squeegee or trowel for non-sag applications. RECOMMENDED USAGE

• Industry: Automotive, Electronics, Food and Beverage
• Location / Orientation: Ceiling, Floor, Wall
• Features: Coating
• Substrate: Concrete / Masonry

Description: Gasket Replacer 906 is a single component room temperature cure gel-like anaerobic gasketing compound formulated to provide instant sealing capabilities. Once cured between mating metal flanges filling voids in the surface, Gasket Replacer 906 provides a thin, flexible, solvent

Description: surfaces. Where concrete deterioration is less than 1/2 inch depth and on vertical or overhead surfaces, Underlayment No. F-120 Trowelable is recommended for resurfacing to pre-existing planes, establishing elevations, or patching substrate voids or irregularities which can affect performance

• Use Temperature: 60 to 90 F
• Chemical System: Ceramic / Inorganic Cement
• Substrate Compatibility: Concrete / Masonry
• Industry: OEM / Industrial

Description: dispense equipment. 20-3001 NC has been formulated for ease in handling. Its low viscosity aids in filling voids and air pockets. In addition, there is no filler settling with this system. The engineering staff at Epoxies, Etc... is at your service to answer questions about your

• Use Temperature: -58 to 302 F
• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 5,700 psi
• Dielectric Strength: 557.9999999999993 kV/in

Description: aspect ratio vias commonly found in Micro Light-Emitting Diode (LED) manufacturing and fine-line interconnect trenches. Via fill applications require a conformal seed layer. Elimination of Voids NOVAFAB VIA FILL AU eliminates seam voids and achieves superior surface roughness. EH&S

• Industry: Electronics
• Features: Semiconductors / IC Packaging

Description: for the nest time. Setting time is usually less than 2 minutes. In regards to wood repair, the flow characteristics, its hard setting and low shrinkage make it ideal for filling cracks and voids often found around knots in many types of wood.

• Features: Encapsulanting / Potting
• Cure / Technology: Thermoplastic / Hot Melt

Description: Gasket Replacer® 910 is a single component room temperature cure gel-like anaerobic gasket compound formulated to provide instant sealing capabilities. Once cured between mating metal flanges and filling voids in the surface, Gasket Replacer 910 provides a thin, flexible,

• Gasket Type: Formed-in-Place (FIP)

Description: compounds (IMC), resulting in no void formation at the interface. With excellent via filling capability, the chemistry delivers a smooth surface at lower operating temperatures, enhancing cost of ownership. Product Features Sustainability and Regulatory Compliance Boric

• Industry: Electronics, Semiconductors / IC Packaging
• Form / Shape: Film / Sheet

Description: detailed injection spray characterization and on-line measurement of NO x as an indicator of combustion quality. The results illustrate the potential of the IQT as a research device, filling an experimental void for low-volatility fuels and enabling ignition studies of research fuels,

Description: subfloor must be flat to a tolerance of 3/16" in a 10' radius. Hollow spots, popping spots and squeaks are related to unevenness in the subfloor. Grinding concrete floors is preferred over the use of filling compounds. If filling/leveling compounds are used, they must be

• Features: Coating
• Substrate: Concrete / Masonry
• Location / Orientation: Floor

Description: Laminate), the subfloor must be flat to a tolerance of 3/16" in a 10' radius. Hollow spots, popping spots and squeaks are related to unevenness in the subfloor. Grinding concrete floors is preferred over the use of filling compounds. If filling/leveling compounds are

• Features: Coating
• Substrate: Concrete / Masonry
• Location / Orientation: Floor

Description: The subfloor must be flat to a tolerance of 3/16" in a 10' radius. Hollow spots, popping spots and squeaks are related to unevenness in the subfloor. Grinding concrete floors is preferred over the use of filling compounds. If flattening/leveling compounds are used, they must be

• Viscosity: 125,000 cP
• Features: Specialty / Other