Void Filling Compound

Description: 3M™ Scotch-Weld™ Structural Void Filling Compound 3439 HT is a temperature-resistan t, one-part, high-temperature curing low density void filling compound.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Industry: Aerospace, OEM / Industrial

Description: Structural one-part low weight void filler for aircraft interiors. One-part low weight filler combining extreme low density with high extrusion rate for manual and automatic applications. Pumpable. Full stand alone FST properties with patented non-halogen based FST system. Low flow for ease

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Single Component System
• Industry: Aerospace, OEM / Industrial
• Substrate / Material Compatibility: Other

Description: A two-part, high temperature curing, void filling compound. It is designed for honeycomb sandwich constructions, honeycomb splicing and reinforcement, mismatch areas filling, and inserts bonding. Offers the following advantages: High performance from -55°C to + 175°C,

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Industry: Aerospace, OEM / Industrial
• Substrate / Material Compatibility: Other

Description: Structural Two Part Extrudable Low Density Void Filler. Two part RT cure low density void filler designed for honeycomb construction of aircraft interiors - available in cartridges.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
• Features: Flame Retardant (e.g. UL 94 Rated)
• Industry: Aerospace, OEM / Industrial

Description: efficient thermal connection between the tracer and the process equipment. By eliminating the air voids that would ordinarily exist, heat is directed into the pipe wall primarily through conduction rather than convection and radiation. A single tracer utilizing Thermon's heat transfer

• Compound Type: Thermally Conductive
• Material Form: Gap Filling Compound, Specialty / Other
• Thermal Conductivity: 34.61 to 69.23 W/m-K
• Use Temperature: 14 to 450 F

Description: NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Typically installed between plate-type heating coils or with systems that require periodic disassembly, NH remains pliable indefinitely, allowing the

• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System
• Material Form: Gap Filling Compound
• Thermal Conductivity: 34.61 to 69.23 W/m-K

Description: Sauereisen Urethane Filler Compound No. 309 is an urethane formulation specifically designed to fill voids, irregularities, and air pockets in concrete. The filler compound provides a uniform surface for the application of Sauereisen ConoFlex Urethane No. 381.

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Cure Type / Technology: Two Component System
• Industry: Building / Construction
• Substrate / Material Compatibility: Concrete / Masonry

Description: Sauereisen Filler Compound No. 209 is an epoxy formulation specifically designed to fill voids, irregularities, and air pockets in concrete. The filler compound provides a smooth surface for the application of epoxy monolithics. No. 209 is not compatible with vinyl ester

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Industry: Other
• Substrate / Material Compatibility: Concrete / Masonry

Description: enable self-leveling and filling of voids resulting in excellent thermal transfer. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to the sensitive components during assembly. As cured, BERGQUIST GAP FILLER TGF 1400SL

• Chemical / Polymer System Type: Silicone
• Material Type: Gap Filling Compound
• Thermal Conductivity: 1.4 W/m-K
• Use Temperature: 76 to 392 F

Description: TGF 3500LVO provides a soft, form-in-place elastomer that is ideal for fragile assemblies or for filling intricate air voids. Thermal conductivity: 3.5 W/m-K Low volatility for outgassing sensitive applications Ultra-conforming with excellent wet-out for low stress interfaces on

• Chemical / Polymer System Type: Silicone
• Material Type: Gap Filling Compound
• Thermal Conductivity: 3.5 W/m-K
• Use Temperature: 76 to 392 F

Description: BERGQUIST GAP PAD TGP 2000, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material BERGQUIST® GAP PAD® TGP 2000 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly

• Compound Type: Thermally Conductive
• Dielectric Constant (Relative Permittivity): 0.0060
• Material Form: Gap Filling Compound
• Thermal Conductivity: 2 W/m-K

Description: conductive, form-in-place elastomer that is ideal for fragile assemblies and filling unique and intricate air voids and gaps. Thermal conductivity: 1.8 W/mK Optimized shear thinning characteristics for ease of dispensing Excellent slump resistance (stays in place

• Chemical / Polymer System Type: Silicone
• Material Type: Gap Filling Compound
• Thermal Conductivity: 1.8 W/m-K
• Use Temperature: 140 to 392 F

Description: Vibra-Tite anaerobic retaining compounds are designed to increase shear strength on non-threaded cylindrical metal assemblies. The liquid anaerobic material fills the voids between close-fitting metal parts and cures to a toughened thermoset-plastic which creates a solid one piece

• Cure Type / Technology: Anaerobic, Single Component System
• Features: Gap Filling Sealant / FIP Gasket, Thread Locker / Retainer
• Industry: Building / Construction
• Substrate / Material Compatibility: Metal

Description: particularly steel, and aluminum. It has good void filling properties. Adhesion to ceramics glass, wood, vulcanized rubber and many plastics is excellent. The cured epoxy responds well to thermal cycling and has high chemical resistance when exposed to water, oil and most organic

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 45 µin/in-F
• Composition: Filled
• Compound Type: Electrically Conductive

Description: Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics,

• Cure Type / Technology: Two Component System
• Thermal Conductivity: 1.8 W/m-K
• Viscosity: 25 cP

Description: KEM® Cati-Coat® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Features: Flame Retardant (e.g. UL 94 Rated)
• Industry: OEM / Industrial, Other

Description: DURA-PLATE 2300 is a three component, epoxy modified cementitious resurfacer containing Portland Cement, hydrophobic thixotropes, fiber reinforcement, graded silica sand and other abrasion resistant aggregates. It is used for resurfacing, patching and filling voids (bugholes) in

• Chemical / Polymer System Type: Epoxy (EP)
• Industry: OEM / Industrial
• Substrate / Material Compatibility: Concrete / Masonry
• Tensile Strength (Break): 600 psi

Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: OEM / Industrial

Description: (Known as Hysol XE1218 ) LOCTITE ECCOBOND XE 1218 is a reworkable, snap cure, void-free, fast flowing underfill that also provides excellent adhesion and reliability benefits.

• Coeff. of Thermal Expansion (CTE): 41.67 µin/in-F
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound
• Viscosity: 1100 cP

Description: Industry-leading cyanide-, arsenic-, thallium- and lead-free gold process capable of via filling with low surface roughness. Product Overview NOVAFAB VIA FILL AU is a mild alkaline, non-cyanide gold electroplating process that produces deposits of 99.9% purity. NOVAFAB VIA FILL AU

• Industry: Electronics

Description: Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers.

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Cure Type / Technology: Two Component System
• Features: Solvent Based (Volatile Organic)
• Industry: Other

Description: (Known as Hysol E1216 ) An innovative, non-reworkable, capillary flow underfill for CSP, BGA or flip chip devices. Designed for high volume assembly operations that require an underfill that flows very fast, fully cures in the length of one reflow oven and provides a void-free underfill area.

• Coeff. of Thermal Expansion (CTE): 18.89 µin/in-F
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound
• Viscosity: 6000 cP

Description: (Known as LOCTITE ECCOBOND UF 8840 ) LOCTITE ECCOBOND UF 8840 liquid epoxy underfill encapsulant is designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage. It is formulated to flow consistently without voids on die sizes over 20 x 20mm. It is

• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Gap Filling Compound

Description: overhead surfaces. Where concrete deterioration is less than 1/2 inch depth and on vertical or overhead surfaces, Underlayment No. F-120 Trowelable is recommended for resurfacing to pre-existing planes, establishing elevations, or patching substrate voids or irregularities which can

• Chemical / Polymer System Type: Specialty / Other, Ceramic / Inorganic Cement
• Cure Type / Technology: Single Component System
• Industry: OEM / Industrial
• Substrate / Material Compatibility: Concrete / Masonry

Description: glue gun ready for the nest time. Setting time is usually less than 2 minutes. In regards to wood repair, the flow characteristics, its hard setting and low shrinkage make it ideal for filling cracks and voids often found around knots in many types of wood.

• Cure Type / Technology: Thermoplastic / Hot Melt
• Form / Function: Encapsulant / Potting Compound

Description: ResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Dielectric Strength: 410 kV/in
• Elongation: 4 to 9 %

Description: ResinLab EP1340 Black is a two component, room temperature or heat curing, flame resistant epoxy casting system that is used for bonding to most materials and filling voids. It is semi-rigid, free flowing, has good wetting and air release. It is resistant to salt solutions, water,

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Dielectric Strength: 513 kV/in
• Elongation: 9 %

Description: ResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Dielectric Strength: 410 kV/in
• Elongation: 4 to 9 %

Description: for meter mix and dispense equipment. 20-3001 NC has been formulated for ease in handling. Its low viscosity aids in filling voids and air pockets. In addition, there is no filler settling with this system. The engineering staff at Epoxies, Etc... is at your service to answer questions

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System

Description: CM8005 is a single-component room temperature cure gel-like anaerobic gasketing compound formulated to provide instant sealing capabilities. Once cured between mating metal flanges and filling voids in the surface, CM8005 provides a thin, flexible, solvent and temperature

• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial

Description: Gasket Replacer 906 is a single component room temperature cure gel-like anaerobic gasketing compound formulated to provide instant sealing capabilities. Once cured between mating metal flanges filling voids in the surface, Gasket Replacer 906 provides a thin, flexible, solvent

• Gasket Type: Cured-in-Place (CIP)
• Material: Other
• Maximum Operating Pressure: 5000 psi
• Operating Temperature: -65 to 300 F

Description: General Polymers 3513 EPOXY SCRATCH COAT MASTIC is a high solids epoxy bughole filler for filling voids and for use as a surface patching compound for concrete. It is formulated for ease of application with squeegee or trowel for non-sag applications. RECOMMENDED USAGE

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Form: Liquid
• Industry: Automotive, Electronics, Food and Beverage
• Substrate / Surface: Concrete / Masonry

Description: detailed injection spray characterization and on-line measurement of NO x as an indicator of combustion quality. The results illustrate the potential of the IQT as a research device, filling an experimental void for low-volatility fuels and enabling ignition studies of research fuels,

Description: . Hollow spots, popping spots and squeaks are related to unevenness in the subfloor. Grinding concrete floors is preferred over the use of filling compounds. If filling/leveling compounds are used, they must be portland based cementious materials and have a compressive

• Substrate / Surface: Concrete / Masonry
• Surface Location / Orientation: Floor

Description: ' radius. Hollow spots, popping spots and squeaks are related to unevenness in the subfloor. Grinding concrete floors is preferred over the use of filling compounds. If flattening/leveling compounds are used, they must be portland based cementious materials and have a

• Chemical / Polymer System Type: Specialty / Other
• Viscosity: 125000 cP