Products & Services
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Supplier: CoorsTek
Description: Precision ceramic components improve durability and handling of wafer stages and tables used during inspection and processing. CoorsTek components and tables provide precise dimensional stability, ultra-flatness and smoothness, and vacuum holding of wafers during inspection and
- Material Type: Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide
- Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
- Features: Other
- Applications: Wear Parts / Tooling
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Supplier: Prior Scientific, Inc.
Description: automatically moves to the correct load position and activates the loader switch, notifying the loader that the shuttle's wafer chuck is in position to receive the wafer. After the wafer is transferred to the shuttle, the system senses the vacuum change and retracts the shuttle,
- Maximum X-Distance: 154 to 256 mm
- Maximum Y-Distance: 154 to 215 mm
- Minimum Step Size (Resolution): 0.04 µm
- Stage Type: Motorized Stage
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Supplier: Newport MKS
Description: Newport’s new ZVR-PC is an integrated Z-vertical and DC Servo Theta-rotation positioning stage designed to precisely elevate and rotate 200 mm and/or 300 mm diameter wafer chucks. The ZVR-PC offers precise 10 mm vertical and continuous 360 degree angular travel in a very low profile
- Load Capacity: 22.48 lbs
- Maximum Torque: 8.849557522123893 In-lbs
- Rotary Velocity / Speed: 80 deg/sec
- Stage Type: Rotary Positioning
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Supplier: Newport MKS
Description: Newport’s new ZVR-PP is an integrated Z-vertical and Theta-rotation positioning stage designed to precisely elevate and rotate 200 mm and/or 300 mm diameter wafer chucks. The ZVR-PP offers precise 10 mm vertical and continuous 360 degree angular travel in a very low profile design. The
- Load Capacity: 22.48 lbs
- Maximum Torque: 0.00000884955752212389 In-lbs
- Rotary Velocity / Speed: 40 deg/sec
- Stage Type: Rotary Positioning
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Supplier: Newport MKS
Description: air bearing wafer positioning stages and is designed for 300 mm wafer test, measurement, and processing applications.
- Stroke or X-Axis Travel: 3.7795296 inch
- Y-Axis Travel: 13.385834 inch
- Rated Speed: 15.748031496063 in/sec
- Features: Electrical, Other
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Supplier: SemiProbe
Description: SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system
- Measurements: Area Mapping, Defects / ADC, Electrical Test - Parametric / In-line, Particle Contamination
- Mounting / Loading: Manual Loading
- Technology: Optical / Imaging System
- Applications: Semiconductor Wafers
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Supplier: Aerotech, Inc.
Description: Design Features Low profile for space-conscious applications Noncontact direct-drive High repeatability Integral pneumatic counterbalance Easily configured with WaferMax T for multi-axis applications
- Z-Axis Travel: 0.1968505 inch
- Rated Speed: 0.15748031496063 in/sec
- Carriage Load: 33.075 lbs
- Positioning Accuracy: 0.0014999999999999998 inch/inch
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Supplier: Aerotech, Inc.
Description: Design Features Low profile for space-conscious applications Direct-drive, brushless, slotless servomotor Direct-coupled, high-accuracy rotary encoder 25 mm aperture Optional rotary union for vacuum
- Load Capacity: 44.1 to 88.2 lbs
- Rotary Velocity / Speed: 2,400 deg/sec
- Positioning Accuracy: 0.00138888888888889 degrees
- Platter Diameter: 8.00000432 inch
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Supplier: Cosmic Equipment SpA
Description: wafer-level test requirements while maintaining a compact footprint. The architecture integrates cleanly with automated wafer probers and probe-card interfaces-without being tied to any specific mechanical platform-making it equally effective for early-stage device
- Form Factor: Monitor / Instrument
- Applications: Semiconductor Wafers
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Supplier: Cosmic Equipment SpA
Description: wafer-level test requirements while maintaining a compact footprint. The architecture integrates cleanly with automated wafer probers and probe-card interfaces-without being tied to any specific mechanical platform-making it equally effective for early-stage device
- Form Factor: Monitor / Instrument
- Applications: Semiconductor Wafers
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Supplier: Palomar Technologies, Inc
Description: include flip chip solder reflow, solder lid sealing, wafer to wafer bonding using solder, glass, adhesives and direct fusion. Wafer Aligner Capabilities Alignment of wafers of to 8 inch (200mm diameter) Fully adjustable stages for positions over wafer
- Maximum Wafer / Part Size: 100 to 200 mm
- Technology: Optical / Imaging System
- Features: Other
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Supplier: Daitron Co., Ltd.
Description: The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through numerical
- Maximum Wafer / Part Size: 50.799972568014816 to 203.19989027205926 mm
- Mounting / Loading: Floor Mounted / Stand-alone
- Form Factor: Monitor / Instrument
- Applications: Semiconductor Wafers
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Supplier: MicroSense, LLC
Description: Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution Thickness range from 50um to 1mm Automated calibration Hiscan
- Maximum Wafer / Part Size: 156 mm
- Mounting / Loading: Manual Loading
- Form Factor: Monitor / Instrument
- Technology: Optical / Imaging System
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Supplier: Zygo Corporation
Description: Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through
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Supplier: Rigaku Corporation
Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant distribution over the
- Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
- Measurements: Area Mapping, Particle Contamination
- Mounting / Loading: Floor Mounted / Stand-alone
- Form Factor: Monitor / Instrument
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Supplier: Rigaku Corporation
Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Integrated VPD capability enables automatic VPD preparation of one wafer while a TXRF
- Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
- Measurements: Area Mapping, Particle Contamination
- Mounting / Loading: Floor Mounted / Stand-alone
- Form Factor: Monitor / Instrument
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Supplier: Piezosystem Jena, Inc.
Description: stage inserts for microscopy application XY-motion up to 700 µm bi-directional actuating nanoX® design for high dynamic range central aperture 100x100 mm2 Application microscopy / lithography nanopositioning and scanning materials research wafer handling and mask alignment
- Maximum X-Distance: 0.030000000000000002 to 0.7000000000000001 mm
- Maximum Y-Distance: 0.030000000000000002 to 0.7000000000000001 mm
- Minimum Step Size (Resolution): 0.060000000000000005 µm
- Stage Type: Automated Stage
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Supplier: Prior Scientific, Inc.
Description: Key features: Suitable for most major brand microscopes. 1µm or better repeatability Quiet and reliable Wide range of sample holders Intelligent Scanning Technology (U.S. Patent 7,330,307) The H101A ProScan™ stage is adaptable to virtually any microscope or optical system. The H101A
- Maximum X-Distance: 114 mm
- Maximum Y-Distance: 75.00000000000001 mm
- Minimum Step Size (Resolution): 0.04 µm
- Stage Type: Motorized Stage
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Supplier: IntelLiDrives, Inc.
Description: Compact package and Superior design of the AccuRing rotary stages was optimized to minimize stage height. The low profile of the stage reduces total system working height. Angular contact bearings are used to maximize performance with respect to wobble, moment stiffness and
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Supplier: Plansee SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire
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Supplier: Primatics, Inc.
Description: Primatics PDR110B rotary tables are among the most advanced direct drive tables available. They feature a high performance direct drive motor that creates sub arc-second repeatability and fast settling times, making the PDR series ideal for semiconductor wafer inspection, high speed laser
- Load Capacity: 22.05 lbs
- Maximum Torque: 23.8938053097345 In-lbs
- Rotary Velocity / Speed: 180 to 2,100 deg/sec
- Positioning Accuracy: 0.0130555555555556 to 0.02 degrees
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Supplier: Primatics, Inc.
Description: Primatics PCL40 Series linear positioning stages are our most compact linear guide bearing stages. Ideal for applications such as automated microscope inspection, medical assembly and semiconductor wafer testing and fabrication, the PCL40 offers unparalleled flexibility,
- Stroke or X-Axis Travel: 15.74804 inch
- Rated Speed: 11.8110236220472 in/sec
- Carriage Load: 22.05 lbs
- Positioning Accuracy: 0.000012499999999999999 to 0.0000225 inch/inch
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Supplier: Primatics, Inc.
Description: integrated limit sensors. Stepper or Servo motor options are available. The PZB25 can be directly stacked with the Primatics PLG160 and PCL65 linear stages as well as the PDR160 rotary stage. The stage tabletop is protected with a clear anodize finish.
- Z-Axis Travel: 0.9842525 inch
- Rated Speed: 0.78740157480315 in/sec
- Carriage Load: 22.05 lbs
- Positioning Accuracy: 0.00012 inch/inch
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Supplier: Newport MKS
Description: The RGA150 low-profile and large aperture rotary stage addresses the need for quick angle adjustments of wafers and vacuum chucks. Although specifically tailored to semiconductor applications, the RGA150 can also be utilized in other industrial applications, such as through hole
- Load Capacity: 11.24 lbs
- Rotary Velocity / Speed: 1,800 deg/sec
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Supplier: Aerotech, Inc.
Description: Design Features Direct-drive linear motor for smooth and precise motion 450 mm wafer compatible Long-life linear motion guide bearing system Twelve models with travels from 100 mm to 1.5 m Side-seal design provides superior debris protection Low-cost, high-performance stage
- Stroke or X-Axis Travel: 3.93701 to 59.05515 inch
- Rated Speed: 78.740157480315 in/sec
- Carriage Load: 220.5 lbs
- Positioning Accuracy: 0.0014999999999999998 to 0.022000000000000002 inch/inch
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Supplier: Aerotech, Inc.
Description: Open-loop and vacuum versions Aerotech’s QNPHD piezo nanopositioning stages provide the benefits of both a stage and actuator in one compact, high-stiffness package. With a direct-metrology, capacitive sensor feedback option, high resonant frequencies and high load capacity, the QNPHD
- Maximum X-Distance: 0.01 to 0.04 mm
- Minimum Step Size (Resolution): 0.02 µm
- Features: Other
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Supplier: PI (Physik Instrumente) L.P.
Description: Industrial design for high performance and high load The V-857 is a heavy-duty and highly dynamic linear stage for industrial applications. Its design is consistently geared to demanding industrial conditions and it is characterized by high stiffness and the use of high-quality components:
- Stroke or X-Axis Travel: 15.74804 to 31.49608 inch
- Positioning Accuracy: 0.03 to 0.04 inch/inch
- Bearing Type: Ball/Roller Bearing
- Features: Electrical
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Supplier: PI (Physik Instrumente) L.P.
Description: Industrial design for high performance and high load With the V-817, PI has a linear stage in its portfolio for industrial solutions that has a high load capacity and high dynamics. Its design is consistently geared to demanding industrial conditions and it is characterized by high stiffness
- Stroke or X-Axis Travel: 24.015761 to 32.0078913 inch
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Supplier: Piezosystem Jena, Inc.
Description: free central space of 22x22 mm2 scanning systems wafer handling scanning probe microscopy handling systems automation Applications in the field of microscopy often require a positioning element with a free central hole. The PXY 400 model combines its compact size with a large motion of
- Maximum Operating Voltage: -10 to 150 volts
- Capacitance: 7,600 nF
- Length: 80 mm
- Diameter or Height: 24 mm
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Supplier: ETEL S.A.
Description: TELICA, a cutting-edge multi-axes platform, is revolutionizing semiconductor back-end applications with its dual gantry architecture, offering unmatched accuracy and throughput for advanced die bonding applications and more. TELICA is a multi-axes platform designed for semiconductor back-end
- Stroke or X-Axis Travel: 0 to 16.141741 inch
- Y-Axis Travel: 0 to 17.5196945 inch
- Z-Axis Travel: 1.181103 inch
- Rated Speed: 78.74015748031496 in/sec
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Supplier: PI (Physik Instrumente) L.P.
Description: accuracy: Our linear stage is engineered for best-in-class precision, guaranteeing accuracy for critical tasks in positioning applications, e.g., XY raster scan for wafer inspection. Every part meets the highest of standards, reducing error and improving overall product quality.
- Stroke or X-Axis Travel: 1.968505 to 11.81103 inch
- Rated Speed: 0.78740157480315 to 9.842519685039376 in/sec
- Motor Voltage: 24 volts
- Drive Type: Ball Screw
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Supplier: PI (Physik Instrumente) L.P.
Description: Compact industrial design for applications with low power requirements The V-855 is a heavy-duty and highly dynamic linear stage for industrial applications. Its design is consistently geared to demanding industrial conditions and it is characterized by high stiffness and the use of
- Stroke or X-Axis Travel: 0.01574804 to 0.03149608 inch
- Positioning Accuracy: 0.03 to 0.04 inch/inch
- Device Type: Ball Slide
- Bearing Type: Ball/Roller Bearing
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Supplier: Piezosystem Jena, Inc.
Description: universal stage inserts for microscopy application XY-motion up to 700 µm bi-directional actuating nanoX® design for high dynamic range central aperture 100x100 mm2 Application microscopy / lithography nanopositioning and scanning materials research wafer handling and mask alignment
- Maximum Operating Voltage: -20 to 130 volts
- Stiffness: 1.5 to 1.6 N/µm
- Capacitance: 3,000 nF
- Length: 185 mm
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Supplier: ASTM International
Description: deposited, forming defects in a silicon layer structure. 1.3 Wafer thickness and diameter for this test method is limited only by the range or microscope stage motions available. 1.4 This test method is applicable to silicon wafers with defect density between 0.01 and 10 000
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Supplier: ASTM International
Description: preferentially etched according to Guide F 1809 or epitaxially deposited, forming defects in a silicon layer structure. 1.3 Wafer thickness and diameter for this test method is limited only by the range of microscope stage motions available. 1.4 This test method is applicable to
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Featured Products Top
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Positioning Solutions Efficient wafer inspection and metrology are essential in semiconductor manufacturing to prevent yield loss. Achieving this requires precise wafer positioning, which enables fast and reliable analysis of defects and particles at every production stage. PI’s cutting (read more)
Browse Linear Slides and Linear Stages Datasheets for PI (Physik Instrumente) L.P. -
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integration technologies to customers around the world. We have the unique ability to support early stage development needs as well as low-to-mid volume production for more mature applications. Our ITAR Registered facility supports wafer sizes up to 200mm with established and proven WLP processes and the (read more)
Browse IC Interfaces Datasheets for Micross Components, Inc. -
Engine Platform for Scalable, Parallel E/O Wafer-Level Test PI (Physik (read more)
Browse Multi-axis Positioning Systems Datasheets for PI (Physik Instrumente) L.P. -
Wafer Manufacturing: Wafer stages for photolithography systems, etching chucks, electrostatic chucks for ion implantation equipment, and thin-film deposition systems (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
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are widely used in wafer inspection stages, lithography scanners, metrology tools, and dicing equipment. Technical Highlights Uniform Air Permeation— Controlled porosity of 35–45% with pore sizes from 10μm to 100μm ensures consistent gas flow (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
X and Y, along with rotational motion around the Z axis of 2°. Applications The A-361 PIglide XY-theta stage is particularly well suited for wafer inspection, flat-panel display metrology, fiber and optics alignment, maskless lithography, and µLED (read more)
Browse Rotary Tables Datasheets for PI (Physik Instrumente) L.P. -
contamination. In a typical application, a laser is introduced into a photolithography tool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high accuracy (read more)
Browse Datasheets for Conax Technologies -
In semiconductor photolithography systems, motion accuracy directly determines wafer exposure quality. Silicon carbide ceramic guide rails are critical structural components within ultra-precision motion platforms, enabling nanometer-level positioning under high (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for Fountyl Technologies Pte. Ltd.
Conduct Research Top
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3-DOF Precision Positioning Stages Supporting Laser Assisted Wafer Slicing
Granite-based XY-Theta positioning stages with direct-drive motors and air bearings for ultra-high precision 3-axis motion
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An Innovative Cabling Concept Improves Reliability for Multi-Axis Stage Systems
up to 4 separate cables (with diameters of 8 to 14 mm). And up to 27 electrical wires must be connected. Wafer inspection systems in the semiconductor industry typically consist of a stack of XYZ linear stages plus a theta rotary unit. So there can easily be perhaps 16 connectors at the final
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Amkor goes wafer-bumping with Unitive Amkor Technology Inc.'s move this week to acquire a wafer-bump company will enable the IC-packaging giant to expand its wings in the flip-chip, wafer-level and related markets, according to an executive with the company. DoD spending bill includes
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Success Story: Electromechanical Assembly
A major semiconductor company requested a custom motor coil winding assembly for use in their laser lithography machine. The motor assembly is used in conjunction with the magnet portion of the assembly to adjust the stage on which the wafer is mounted to position the wafer as desired. The assembly
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
GDDR2 getting ready for the big show Confined for now to a high-end niche market, GDDR2 SDRAM is expected to stage a significant ramp late this year following the anticipated adoption of an industry standard that will open up the graphics memory to a wider audience. Broadcom responds to tuner
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
layers on 300-mm wafers. Synopsys sues Magma for patent infringement Setting the stage for what could be a prolonged battle between two major EDA vendors, Synopsys filed a patent infringement lawsuit Friday (Sept. 17) against Magma Design Automation. The lawsuit, which seeks damages and injunctive
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Neah migrating fuel cell process to 200-mm Micro fuel-cell developer Neah Power Systems announced plans to expand the research and development of its patented porous silicon-based direct methanol fuel cell to include 200-mm wafers. The company's current process primarily uses 100-mm wafers. Renesas
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
and development of its patented porous silicon-based direct methanol fuel cell to include 200-mm wafers. The company's current process primarily uses 100-mm wafers. Renesas, Powerchip broaden relationship on flash memory Renesas Technology and Powerchip Semiconductor have signed a manufacturing
More Information Top
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Principles of Lithography
5.6 The Wafer Stage ...
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Performance results of a new generation of 300-mm lithography systems
The conflicting requirements associated with higher productivity on one side, and more extensive metrology on the other, have led to the development of a platform with two independent wafer stages operating in parallel.
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Optical Lithography: Here is Why
5.9 Wafer Stage ...
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EUV Lithography
Figure 1.2 shows the configuration of the first experimental setup for x-ray reduction lithography.1 Since the first imaging- system was designed to image a ring-shaped field, the mask and wafer stages were expected to move in sync to…
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The performance advantages of a dual-stage system
This will result in wafer stage set points Z(y), Rx(y), and Ry(y).
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Iterative learning control design for synchronization of wafer and reticle stages
For synchronization, a master-slave configuration is used, with the wafer stage acting as the master, and the reticle stage as the slave.
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Model-Based Control:
In Section 3, the selection of a parametric feedforward control structure for a wafer stage application is considered, where experimental results are shown to demonstrate the benefits of the iterative optimization procedure.
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Synchronous control strategy of wafer and reticle stage of step and scan lithography
For step and scan lithography systems, the synchronization of reticle stage and wafer stage during exposure is one of the most important factors that decides the image quality.