Products & Services
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Supplier: Prior Scientific, Inc.
Description: retrieval of wafers to begin analysis. The Prior Scientific motorized Shuttle Stage is designed to be used with the Nikon and Olympus wafer loader systems for 3, 4, 6, and 8 inch wafers. The system greatly reduces operator fatigue while increasing inspection accuracy and
- Features: Programmable
- Lighting: Reflected Light
- Maximum X-Distance: 154 to 256 mm
- Maximum Y-Distance: 154 to 215 mm
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Supplier: SemiProbe
Description: SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Wafer Probing System
- Measurement Capability: Defects / ADC, Electrical Test - Parametric / In-line, Particle Contamination
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Supplier: CoorsTek
Description: Precision ceramic components improve durability and handling of wafer stages and tables used during inspection and processing. CoorsTek components and tables provide precise dimensional stability, ultra-flatness and smoothness, and vacuum holding of wafers during inspection and
- Applications: Wear Parts / Tooling, Other
- Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
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Supplier: Palomar Technologies, Inc
Description: rings and illuminators are provided for wafer fiducial illumination. The camera lenses are mounted on fully adjustable (X-Y-Z-theta) stages for positioning over wafer fiducials. Features Wafer Level Packaging (WLP) provides for both interconnection and package sealing of
- Form Factor: Other
- Maximum Wafer / Part Size: 100 to 200 mm
- Measurement Capability: Other
- Mounting / Loading: Other
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Supplier: Rigaku Corporation
Description: XY? sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: Rigaku Corporation
Description: XY? sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Integrated VPD capability enables automatic VPD preparation of one
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: MicroSense, LLC
Description: Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution Thickness range from 50um to 1mm Automated
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 156 mm
- Measurement Capability: Thickness - Wafer / Disc (TTV)
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Supplier: Aerotech, Inc.
Description: Design Features Low profile for space-conscious applications Noncontact direct-drive High repeatability Integral pneumatic counterbalance Easily configured with WaferMax T for multi-axis applications
- Base Height: 1.97 inch
- Base Length: 9.54 inch
- Base Width: 8.13 inch
- Bearing Type: Crossed Roller Slide
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Supplier: Aerotech, Inc.
Description: Design Features Low profile for space-conscious applications Direct-drive, brushless, slotless servomotor Direct-coupled, high-accuracy rotary encoder 25 mm aperture Optional rotary union for vacuum
- Drive Mechanism: Direct Drive
- Drive Type: Brushless Servo
- Load Capacity: 44.1 to 88.2 lbs
- Overall Height: 1.97 inch
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Supplier: Newport MKS
Description: Newport’s new ZVR-PC is an integrated Z-vertical and DC Servo Theta-rotation positioning stage designed to precisely elevate and rotate 200 mm and/or 300 mm diameter wafer chucks. The ZVR-PC offers precise 10 mm vertical and continuous 360 degree angular travel in a very low profile
- Load Capacity: 22.48 lbs
- Maximum Torque: 8.85 In-lbs
- Rotary Velocity / Speed: 80 deg/sec
- Stage Type: Rotary Positioning
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Supplier: Newport MKS
Description: Newport’s new ZVR-PP is an integrated Z-vertical and Theta-rotation positioning stage designed to precisely elevate and rotate 200 mm and/or 300 mm diameter wafer chucks. The ZVR-PP offers precise 10 mm vertical and continuous 360 degree angular travel in a very low profile design. The
- Drive Type: Stepping Motor
- Load Capacity: 22.48 lbs
- Maximum Torque: 8.85E-6 In-lbs
- Rotary Velocity / Speed: 40 deg/sec
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Supplier: Zygo Corporation
Description: Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through
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Supplier: Prior Scientific, Inc.
Description: , microtitre trays, semiconductor wafers, or metallurgical specimens in any sort of pattern, including raster, snake and random patterns. The H101A ProScan? stage also incorporates the patented - Intelligent Scanning Technology (IST). In conjunction with extensive testing, Intelligent
- Features: Programmable, Slide Holder
- Lighting: Reflected Light
- Maximum X-Distance: 114 mm
- Maximum Y-Distance: 75 mm
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Supplier: Newport MKS
Description: The DynamYX® 300 Wafer Positioning Stage features a simple, 3-piece architecture in a two motor design that provides a cost effective solution for high accuracy and dynamic performance for step-and-settle and/or scanning applications. It has the smallest footprint in Newport’s line of
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Supplier: Piezosystem Jena, Inc.
Description: Series of XY scanning stages with large 100 by 100 mm2 aperture and variable travel range selection principal per axis with a motion range of 24 microns up to 700 microns VTRselect – Concept “Variable-Travel-Ran ge selection” per
- Features: Graduated / Measuring
- Maximum X-Distance: 0.0300 to 0.7000 mm
- Maximum Y-Distance: 0.0300 to 0.7000 mm
- Minimum Step Size (Resolution): 0.0600 µm
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Supplier: Plansee SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire
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Supplier: SemiProbe
Description: SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system
- Applications / Capabilities: Electronics or Semiconductor Inspection
- Image Source: Electron Microscope, Other Image Source
- Imaging & Analysis Software: Yes
- Stage / Positioner: X-Y-Z Stage
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Supplier: Primatics, Inc.
Description: Primatics PDR210 rotary tables are among the most advanced direct drive tables available. They feature a high performance direct drive motor that creates sub arc-second repeatability and fast settling times, making the PDR series ideal for semiconductor wafer inspection, high speed laser
- Drive Mechanism: Direct Drive
- Drive Type: Brushless Servo
- Features: Center Bore
- Load Capacity: 66.15 lbs
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Supplier: Primatics, Inc.
Description: Primatics PDR160B rotary tables are among the most advanced direct drive tables available. They feature a high performance direct drive motor that creates sub arc-second repeatability and fast settling times, making the PDR series ideal for semiconductor wafer inspection, high speed laser
- Drive Mechanism: Direct Drive
- Drive Type: Brushless Servo
- Features: Center Bore
- Load Capacity: 44.1 lbs
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Supplier: Primatics, Inc.
Description: Primatics PDR110B rotary tables are among the most advanced direct drive tables available. They feature a high performance direct drive motor that creates sub arc-second repeatability and fast settling times, making the PDR series ideal for semiconductor wafer inspection, high speed laser
- Drive Mechanism: Direct Drive
- Drive Type: Brushless Servo
- Features: Center Bore
- Load Capacity: 22.05 lbs
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Supplier: Primatics, Inc.
Description: Primatics PCL40 Series linear positioning stages are our most compact linear guide bearing stages. Ideal for applications such as automated microscope inspection, medical assembly and semiconductor wafer testing and fabrication, the PCL40 offers unparalleled flexibility,
- Actuation Type: Electrical
- Axis Configuration: X Axis Only
- Carriage Load: 22.05 lbs
- Drive Specifications: Ball Screw
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Supplier: ETEL S.A.
Description: TELICA, a cutting-edge multi-axes platform, is revolutionizing semiconductor back-end applications with its dual gantry architecture, offering unmatched accuracy and throughput for advanced die bonding applications and more. TELICA is a multi-axes platform designed for semiconductor back-end
- Actuation Type: Electrical
- Axis Configuration: X-Y-Z Axes
- Drive Specifications: Direct Drive, Other
- Features: Multi-position
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Supplier: PI (Physik Instrumente) L.P.
Description: Industrial design for high performance and high load The V-857 is a heavy-duty and highly dynamic linear stage for industrial applications. Its design is consistently geared to demanding industrial conditions and it is characterized by high stiffness and the use of high
- Actuation Type: Electrical
- Axis Configuration: X Axis Only
- Bearing Type: Ball/Roller Bearing
- Motor Specifications: Linear Motor
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Supplier: PI (Physik Instrumente) L.P.
Description: Industrial design for high performance and high load With the V-817, PI has a linear stage in its portfolio for industrial solutions that has a high load capacity and high dynamics. Its design is consistently geared to demanding industrial conditions and it is characterized by high
- Stroke or X-Axis Travel: 24.02 to 32.01 inch
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Supplier: Filmetrics, Inc.
Description: -board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling. The different F60-t instruments are distinguished primarily by thickness and wavelength range.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: Filmetrics, Inc.
Description: include automatic notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and cassette-to-cassette robotic wafer handling. The different F60-c instruments are distinguished primarily by
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: Nanotronics Imaging
Description: The Nanotronics Imaging nSpec® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec® offers fast quantification and qualification of defects
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Measurement Capability: Defects / ADC
- Mounting / Loading: Manual Loading
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Supplier: Filmetrics, Inc.
Description: Automated Film Thickness Mapping The Filmetrics F50 family of products can map film thickness as quickly as two points per second. A motorized R-Theta stage accepts standard and custom chucks for samples up to 450mm in diameter. Map patterns can be polar, rectangular, or linear, or you
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: SemiProbe
Description: 150 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 150 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: 300 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 300 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: Prior Scientific, Inc.
Description: Key features: Suitable for most major brand microscopes. 2µm or better repeatability Quiet and reliable Wide range of wafer holders. 254mm x 215 mm (10"x8.5") travel The H116 stage is suitable for most larger microscopes and can easily
- Features: Programmable, Slide Holder
- Lighting: Reflected Light
- Maximum X-Distance: 256 mm
- Maximum Y-Distance: 215 mm
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Supplier: PI (Physik Instrumente) L.P.
Description: Compact industrial design for applications with low power requirements The V-855 is a heavy-duty and highly dynamic linear stage for industrial applications. Its design is consistently geared to demanding industrial conditions and it is characterized by high stiffness and the use
- Actuation Type: Electrical
- Axis Configuration: X Axis Only
- Bearing Type: Ball/Roller Bearing
- Device Type: Ball Slide
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Supplier: Filmetrics, Inc.
Description: and OLED Displays What's Included Measurement Stage with motorized focus and standard 5x objective lens Integrated Light Source/Control Unit FILMeasure 7.0 software BK-7 reference material TS-Focus-SiO2-4-1000 0 Focus/Thickness standard FILMeasure standalone software for remote data analysis
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Measurement Capability: Optical Constants (n, k)
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Supplier: Rigaku Corporation
Description: XY? sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: Rigaku Corporation
Description: 's patent pending X-Y-? sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: PI (Physik Instrumente) L.P.
Description: systems, wafer metrology, wafer inspection, measuring technology, inspection systems, calibration, scanning. Thanks to the friction-free motion, no particles are formed, which makes PIglide stages ideal for cleanroom applications. 3-Phase torque motor Brushless
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Supplier: Prior Scientific, Inc.
Description: -suited for applications that typically involve large specimens. For example, for performing scanning of a wide range of semiconductor wafers, photo masks, and printed circuit boards. The H105 can easily accommodate 6" wafers.
- Features: Programmable, Slide Holder
- Lighting: Reflected Light
- Maximum X-Distance: 154 mm
- Maximum Y-Distance: 154 mm
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Supplier: Newport MKS
Description: The RGA150 low-profile and large aperture rotary stage addresses the need for quick angle adjustments of wafers and vacuum chucks. Although specifically tailored to semiconductor applications, the RGA150 can also be utilized in other industrial applications, such as through hole
- Load Capacity: 11.24 lbs
- Rotary Velocity / Speed: 1800 deg/sec
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Supplier: Aerotech, Inc.
Description: and linearity with direct-metrology capacitive sensor option Open-loop and vacuum versions Aerotech’s QNPHD piezo nanopositioning stages provide the benefits of both a stage and actuator in one compact, high-stiffness package. With a direct
- Maximum X-Distance: 0.0100 to 0.0400 mm
- Minimum Step Size (Resolution): 0.0200 µm
- Type: Other
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Supplier: KEYENCE
Description: to see even the smallest defects or changes in position. The fiber type sensor heads are as small as 2mm in diameter and generate no heat and are not influenced by electromagnetic noise for maximum flexibility. Common Applications: Wafer Thickness Glass Thickness Surface Mapping Stage
- Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone
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Supplier: KEYENCE
Description: to see even the smallest defects or changes in position. The fiber type sensor heads are as small as 2mm in diameter and generate no heat and are not influenced by electromagnetic noise for maximum flexibility. Common Applications: Wafer Thickness Glass Thickness Surface Mapping Stage
- Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone
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Supplier: Park Systems, Inc.
Description: In One image scan • Automatic tilting stage (optional) Inline Automation • Allowable sample type: rowbars and sliders • Automatic data acquisition and analysis of slider metrology • Automatic tip exchange (optional) • HGA sample fixture (optional)
- Applications: Semiconductor Wafers, Data Storage / Memory
- Form Factor: Monitor / Instrument
- Measurement Capability: Defects / ADC
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Aerotech, Inc.
Description: Design Features Direct-drive linear motor for smooth and precise motion 450 mm wafer compatible Long-life linear motion guide bearing system Twelve models with travels from 100 mm to 1.5 m Side-seal design provides superior debris protection Low-cost, high-performance stage
- Axis Configuration: X Axis Only
- Bearing Type: Linear Guide Bearing
- Carriage Load: 220 lbs
- Drive Specifications: None
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Supplier: ASTM International
Description: epitaxially deposited, forming defects in a silicon layer structure. 1.3 Wafer thickness and diameter for this test method is limited only by the range or microscope stage motions available. 1.4 This test method is applicable to silicon wafers with defect density between 0.01
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Featured Products Top
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Positioning Solutions Efficient wafer inspection and metrology are essential in semiconductor manufacturing to prevent yield loss. Achieving this requires precise wafer positioning, which enables fast and reliable analysis of defects and particles at every production stage. PI’s cutting (read more)
Browse Linear Slides and Linear Stages Datasheets for PI (Physik Instrumente) L.P. -
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integration technologies to customers around the world. We have the unique ability to support early stage development needs as well as low-to-mid volume production for more mature applications. Our ITAR Registered facility supports wafer sizes up to 200mm with established and proven WLP processes and the (read more)
Browse IC Interfaces Datasheets for Micross Components, Inc. -
Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through multiple custom orders (read more)
Browse Wafer and Thin Film Instrumentation Datasheets for Zygo Corporation -
Engine Platform for Scalable, Parallel E/O Wafer-Level Test PI (Physik (read more)
Browse Multi-axis Positioning Systems Datasheets for PI (Physik Instrumente) L.P. -
Wafer Manufacturing: Wafer stages for photolithography systems, etching chucks, electrostatic chucks for ion implantation equipment, and thin-film deposition systems (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
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are widely used in wafer inspection stages, lithography scanners, metrology tools, and dicing equipment. Technical Highlights Uniform Air Permeation— Controlled porosity of 35–45% with pore sizes from 10μm to 100μm ensures consistent gas flow distribution across the (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
X and Y, along with rotational motion around the Z axis of 2°. Applications The A-361 PIglide XY-theta stage is particularly well suited for wafer inspection, flat-panel display metrology, fiber and optics alignment, maskless lithography, and µLED (read more)
Browse Rotary Tables Datasheets for PI (Physik Instrumente) L.P. -
processing stages Fixation of fragile materials during inspection and metrology Handling of non-wafer workpieces in advanced (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd.
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3-DOF Precision Positioning Stages Supporting Laser Assisted Wafer Slicing
Granite-based XY-Theta positioning stages with direct-drive motors and air bearings for ultra-high precision 3-axis motion
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An Innovative Cabling Concept Improves Reliability for Multi-Axis Stage Systems
up to 4 separate cables (with diameters of 8 to 14 mm). And up to 27 electrical wires must be connected. Wafer inspection systems in the semiconductor industry typically consist of a stack of XYZ linear stages plus a theta rotary unit. So there can easily be perhaps 16 connectors at the final
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Amkor goes wafer-bumping with Unitive Amkor Technology Inc.'s move this week to acquire a wafer-bump company will enable the IC-packaging giant to expand its wings in the flip-chip, wafer-level and related markets, according to an executive with the company. DoD spending bill includes
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Success Story: Electromechanical Assembly
A major semiconductor company requested a custom motor coil winding assembly for use in their laser lithography machine. The motor assembly is used in conjunction with the magnet portion of the assembly to adjust the stage on which the wafer is mounted to position the wafer as desired. The assembly
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
GDDR2 getting ready for the big show Confined for now to a high-end niche market, GDDR2 SDRAM is expected to stage a significant ramp late this year following the anticipated adoption of an industry standard that will open up the graphics memory to a wider audience. Broadcom responds to tuner
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
layers on 300-mm wafers. Synopsys sues Magma for patent infringement Setting the stage for what could be a prolonged battle between two major EDA vendors, Synopsys filed a patent infringement lawsuit Friday (Sept. 17) against Magma Design Automation. The lawsuit, which seeks damages and injunctive
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Neah migrating fuel cell process to 200-mm Micro fuel-cell developer Neah Power Systems announced plans to expand the research and development of its patented porous silicon-based direct methanol fuel cell to include 200-mm wafers. The company's current process primarily uses 100-mm wafers. Renesas
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
and development of its patented porous silicon-based direct methanol fuel cell to include 200-mm wafers. The company's current process primarily uses 100-mm wafers. Renesas, Powerchip broaden relationship on flash memory Renesas Technology and Powerchip Semiconductor have signed a manufacturing
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Principles of Lithography
5.6 The Wafer Stage ...
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Performance results of a new generation of 300-mm lithography systems
The conflicting requirements associated with higher productivity on one side, and more extensive metrology on the other, have led to the development of a platform with two independent wafer stages operating in parallel.
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Optical Lithography: Here is Why
5.9 Wafer Stage ...
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EUV Lithography
Figure 1.2 shows the configuration of the first experimental setup for x-ray reduction lithography.1 Since the first imaging- system was designed to image a ring-shaped field, the mask and wafer stages were expected to move in sync to…
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The performance advantages of a dual-stage system
This will result in wafer stage set points Z(y), Rx(y), and Ry(y).
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Iterative learning control design for synchronization of wafer and reticle stages
For synchronization, a master-slave configuration is used, with the wafer stage acting as the master, and the reticle stage as the slave.
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Model-Based Control:
In Section 3, the selection of a parametric feedforward control structure for a wafer stage application is considered, where experimental results are shown to demonstrate the benefits of the iterative optimization procedure.
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Synchronous control strategy of wafer and reticle stage of step and scan lithography
For step and scan lithography systems, the synchronization of reticle stage and wafer stage during exposure is one of the most important factors that decides the image quality.