Neural Networks for RF and Microwave Design

Chapter 5: Models for RF and Microwave Components

This chapter [1] includes several examples of the techniques described in earlier chapters for the development of CAD models for RF and microwave passive components. Examples of components include: one-port and two-port microstrip vias, vertical interconnects used in multiplayer circuits, CPW lines, CPW bends, other discontinuities occurring in CPW circuits, planar spiral inductors, multiconductor-multilayered transmission structures, microstrip patch antennas, and waveguide filter structures. Modeling of active RF and microwave devices is discussed separately in Chapter 7.

5.1 Modeling Procedure

This section discusses some general issues related to the development of ANN models for passive RF and microwave components. Examples of various models are given in the following sections of this chapter. Selection of model inputs and outputs as well as the generation of training data are discussed in this section. Error measures for model validation are also given. Once the ANN models are developed, they need to be linked to a commercial microwave simulator so that they can be used for circuit design and optimization.

5.1.1 Selection of Model Inputs and Outputs

Selection of input parameters for models of RF and microwave passive components is relatively straightforward. Inputs are generally important physical (geometrical) parameters of the component, which should vary in frequency. Ranges of input variables are determined by desired model usage requirements. In the design of RF and microwave circuits, it is often desirable to connect active and passive elements together. This can be accomplished by representing model outputs in terms of S-parameters (scattering parameters), which are related...

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