TABLE OF CONTENTS Keywords Machine vision, Electronics industry, Inspection
Robotic Vision Systems, Inc. (RVSI) has received an order for a WS-series bumped wafer inspection system from one of the world s largest suppliers of materials for ball-grid-array semiconductors. The system will be used for 3-D defect inspection of semiconductor wafers at the company s Japan technical and customer demonstration center.
This order represents one of the highest-profile competitive wins in the history of the product line, said Michael Gray, the Semiconductor Equipment Group s Vice President of Sales. The system has been purchased by a Japanese company that has a dominant position in the supply of BGA balls to semiconductor packaging companies. That company now seeks to extend its leadership to the relatively new market for wafer bumps. Our WS-series will be used both to monitor technical process development, and to visually show customers how ball placement is accomplished on wafers.
The application is tailor-made for our MicroMap (TM) technology which provides the kinds of 2-D and 3-D output that can be appreciated by a broad cross-section of technical staff, Mr. Gray said. We expect our system and its capabilities will be seen by the decision makers at virtually every organization that is or will be involved in bumped wafer production. In placing the order, the customer told us that our WS-series system was the only product that could deliver 3-D bump height metrology at production speed. We believe this message about the superiority of our...
