Handbook of Thin Film Deposition Processes and Techniques: Principles, Methods, Equipment and Applications, Second Edition

2.0: COMPETING DEPOSITION TECHNOLOGIES

2.0 COMPETING DEPOSITION TECHNOLOGIES

While MBE has afforded the fabrication of material and device structures not previously possible, many of the early milestones in compound semiconductor growth were attained using other epitaxial film growth techniques. Bench marks for purity and device performance remain valid today. These alternative deposition technologies can be loosely grouped into liquid phase epitaxial (LPE) and vapor phase epitaxial (VPE) processes. A special category of VPE known as OMVPE (organometallic VPE) or MOCVD (metal-organic chemical vapor deposition) has promise as a production worthy process. Each of these epitaxial processes has distinct advantages and disadvantages discussed below. A comparison of GaAs epitaxial processes is shown in Table 1.

Table 1: Comparison of Epitaxial Technologies

Liquid Phase Epitaxy

Vapor-phase epitaxy

Molecular Beam Epitaxy

Chemical Vapor Deposition

Metal Organic CVD

Growth rate ( m/min)

~ 1

~ 0.1

~ 0.1

~ 0.01

Growth temperature ( C)

850

750

750

550

Thickness control ( )

500

250

25

5

Interface width ( )

?50

~ 65

< 10

<5

Dopant range (cm -3)

10 13 10 19

10 13 10 19

10 14 10 19

10 14 10 19

Mobility, 77 K (cm 2/Vs) (n-type GaAs)

150,000 200,000

150,000 200,000

140,000 [a]

160,000 [b]

[a]Nakanisi, T., Udagawa, T., Tanaka, A., and Kamei, K., J. Cry, Growth, 55:255 (1981)

[b]Larkins, E. C., Hellman, E. S., Schlom, D. G., and Harris, J. S., Jr., Appl. Phys. Lett. (to be published)

2.1 Liquid Phase Epitaxy

Historically, the early compound semiconductor growth...

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