DIP IC Package Converters and Adapters
from Aries Electronics, Inc.
FEATURES. A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: MSOP
- Product Type: Package Adapters / Converters
from Advanced Interconnections Corp.
Our high quality, dependable DIP Sockets and Adapters accommodate applications from surface mount to thru-hole. Screw-machined terminals offer superior quality for long-term durability. [See More]
- Output (Bottom) Side Package: DIP
- RoHS Compliant: RoHS Compliant (optional feature)
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: DIP
from Aries Electronics, Inc.
FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: SOIC
- Product Type: Package Adapters / Converters
from Aries Electronics, Inc.
FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. RoHS Compliant Board FR406 or IS410 per IPC 4101A/46. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN... [See More]
- Output (Bottom) Side Package: DIP
- RoHS Compliant: RoHS Compliant (optional feature)
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: SOWIC
from Aries Electronics, Inc.
GENERAL SPECIFICATIONS. PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick. PADS: bare Cu protected with Entek ® by Enthone or Omikron ® white Sn to eliminate co-planarity concerns and solder bridges. MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. OPERATING TEMPERATURE: 221 °F... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: SSOP
- Product Type: Package Adapters / Converters
from Aries Electronics, Inc.
EATURES. Makes 48-pin QFP prototype circuits with a standard breadboard easy. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASASTM B579-73 over... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: QFP
- Product Type: Package Adapters / Converters
from Aries Electronics, Inc.
FEATURES. Allows easy replacement of a difficult-to-find part. GENERAL SPECIFICATIONS. PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick. MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. MALE PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 per ASTM B579-73 over 100 µ [2.54 µ]... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: PLCC
- Product Type: Package Adapters / Converters
from Aries Electronics, Inc.
FEATURES. Lead-free RoHS/WEEE-compliant. A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides. PADS: finished with ENIG (Immersion... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: PLCC
- Product Type: Package Adapters / Converters
- Military Standards: MIL-G-45204
from Aries Electronics, Inc.
FEATURES. A cost-effective means of upgrading to PLCC package without changing your PCB layout. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides. PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M. PIN PLATING: 200 µ [5.08 µ] Sn/Pb 93/7 ASTM... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: PLCC
- Product Type: Package Adapters / Converters
from Aries Electronics, Inc.
FEATURES. Converts PLCC packaged ICs-to-DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC Sockets or PLCC Pads on top side. For Panelized Form or for mounting of consigned ICs, consult factory. GENERAL SPECIFICATIONS. ADAPTER BODY: 0.062 [1.58] FR-4 or IS410 per IPC... [See More]
- Output (Bottom) Side Package: DIP
- RoHS Compliant: RoHS Compliant
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: PLCC
from Aries Electronics, Inc.
Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter – P/N 1109342. FEATURES. Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. Allows user to switch package styles and avoid shortage problems. Designed to plug directly... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: PLCC
- Product Type: Package Adapters / Converters
from Aries Electronics, Inc.
FEATURES. Adapter Socket allows the use of 0.300 [7.62] center devices when the PCB is drilled on 0.600 [15.24] centers and vice versa, giving the flexibility of using 0.600 [15.24] or 0.300 [7.62] center devices in the same application. GENERAL SPECIFICATIONS. SOCKET BODY: black UL 94V-0... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: DIP
- Product Type: Package Adapters / Converters
- Military Standards: MIL-G-45204
from Aries Electronics, Inc.
FEATURES. A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL94V-0, with 1-oz. Cu... [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: SOIC; SOJ
- Product Type: Package Adapters / Converters
from Aries Electronics, Inc.
FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with... [See More]
- Output (Bottom) Side Package: DIP
- RoHS Compliant: RoHS Compliant
- Product Type: Package Adapters / Converters
- Top (Input) Side Package: SOIC
from Aries Electronics, Inc.
FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick Polyimide, Tg 260 °C with 1-oz. [See More]
- Output (Bottom) Side Package: DIP
- Top (Input) Side Package: SOIC
- Product Type: Package Adapters / Converters