Products & Services
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Supplier: GAF
Description: Description Matrix™ 103 Cold Process Adhesive is a contractor grade, non-polymer modified asbestos-free formulation for use as a cold-applied bonding agent for organic, fiberglass or polyester fabric Built-Up Roofing (BUR) Systems. In addition, the formulation is non-destructive to
- Cure Type / Technology: Air Setting / Film Drying, Single Component System
- Features: Flexible / Dampening, UL Approved
- Industry: Building / Construction
- Substrate / Material Compatibility: Ceramic / Glass
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Supplier: Accuris
Description: ADHESIVE BONDING: ADHESIVES, APPLICATIONS AND PROCESSES
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Supplier: Gluefast Company, Inc. (The)
Description: Water-Based Glues and Adhesives Water-based glues are made from naturally occurring substances such as corn and are processed into materials including starch and dextrin. These are among the lower cost glues on a per-pound basis. Applications include: general labeling
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Supplier: Boyd
Description: with automated assembly equipment & easy pick-and-place Designed & cut to custom shapes or slit-to-width Innovative converting processes for island placement of adhesive, full or selective coverage & kiss-cut applications Materials:
- Adhesive: Acrylic, Epoxy, Rubber, Silicone
- Backing: Plastic / Polymer, Acrylic / Acrylate, Rubber, Silicone
- Type: Double-Sided, Transfer
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Supplier: Cambridge Polymer Group, Inc.
Description: Cambridge Polymer Group can aid in many areas of process development, from initial R&D and formulation, through regulatory testing, product support and marketing and failure analysis. If your product is not meeting requirements, we can help you reformulate to match specific properties and
- Chemicals / Chemical Products: Alcohols, Chemical Agents / Additives, Cleaners / Surface Active Agents, Cosmetics / Soaps, Filler / Extenders, Foods / Beverages, Inorganic Chemicals, Lubricants / Greases, Monomers & Intermediates, Oils & Fuels, Organic Chemicals, Pharmaceuticals / Drugs, Pigments / Dyes, Polymers, Reagents,
- Form: Liquids, Powders, Nanomaterials, Bulk Solids / Granules
- Materials / Material Products: Abrasives, Adhesives / Sealants, Coatings / Paint, Elastomers / Rubber, Plastics, Pulp & Paper, Semiconductor Materials, Textiles, Wood Products
- Regional Preference: North America, United States Only, Northeast US Only
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Supplier: Protavic America, Inc.
Description: ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Thermal Insulation / Heat Insulating, Electrically Conductive Compound (Adhesive, Grease)
- Industry: Automotive, Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® 3092 is a two-component, rapid curecyanoacrylate adhesive for bonding a variety of plastics (except PE, PP and PTFE), rubber and porous materials (wood, paper, leather). Under normal conditions, once dispensed in between close fitting parts, the atmosphere moisture initiates the
- Applied Thickness / Gap Fill: 0.2000 inch
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Supplier: Cambridge Polymer Group, Inc.
Description: Cambridge Polymer Group can aid in many areas of process development, from initial R&D and formulation, through regulatory testing, product support and marketing and failure analysis. If your product is not meeting requirements, we can help you reformulate to match specific properties and
- Chemicals / Chemical Products: Alcohols, Chemical Agents / Additives, Cleaners / Surface Active Agents, Cosmetics / Soaps, Filler / Extenders, Inorganic Chemicals, Lubricants / Greases, Monomers and Intermediates, Oils and Fuels, Organic Chemicals, Pharmaceuticals / Drugs, Pigments / Dyes, Polymers, Reagents, Solvents
- Form: Bulk Solids / Granules, Liquids, Nanomaterials / Nanoparticles, Powders
- Location: North America, United States Only, Northeast US Only
- Materials / Material Products: Abrasives, Adhesives / Sealants, Coatings / Paint, Elastomers / Rubber, Foods / Beverages, Plastics, Pulp and Paper, Wafers / Semiconductor Materials, Textiles, Wood Products
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Supplier: DuPont Electronics & Imaging
Description: medical industries. Pyralux® HP adhesive provides best-in-class insertion loss performance, increased functionality and ease of processing while maintaining high reliability. Benefits: Excellent electrical performance (low Dk/Df) Certified to IPC-4203
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Automotive, Electronics, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Boyd
Description: with automated assembly equipment & easy pick-and-place Designed & cut to custom shapes or slit-to-width Innovative converting processes for island placement of adhesive, full or selective coverage & kiss-cut applications Materials:
- Adhesive: Acrylic, Pressure Sensitive (PSA)
- Backing: Cloth - Woven Fabric, Foam, Metal Foil / Sheet, Plastic / Polymer, Acrylic / Acrylate, PVC / Vinyl, Rubber, Silicone
- Features: Anti-static / ESD Control, Electrically Conductive, EMI / RFI Shielding, Thermally Insulating / Insulative, Transparent, UV / Weather Resistant
- Type: Double-Sided, Transfer
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Supplier: Accuris
Description: German Language - ADHESIVES; ADHESIVE PROCESSING; TERMS
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Supplier: Henkel Corporation - Industrial
Description: then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes. Electrically
- Coeff. of Thermal Expansion (CTE): 23.33 µin/in-F
- Cure Type / Technology: Contact / Pressure Sensitive (PSA)
- Features: Thermal / Heat Conductive
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Supplier: NETZSCH Premier Technologies LLC
Description: Systems & Plants The Business Unit Grinding & Dispersing of the NETZSCH Group is a leader in wet and dry processing of products from many branches of industry. Based on our know-how in machine technology and plant engineering, we are able to offer you complete solutions (turnkey
- Chemicals / Chemical Products: Biochemicals / APIs, Cosmetics / Soaps, Foods / Beverages, Pharmaceuticals / Drugs, Pigments / Dyes
- Form: Liquids, Powders, Nanomaterials, Bulk Solids / Granules
- Materials / Material Products: Adhesives / Sealants, Carbon / Graphite, Ceramics, Coatings / Paint, Metals / Elements, Pulp & Paper, Wood Products
- Regional Preference: North America, United States Only, Northeast US Only, South / Central America Only, Europe Only, South Asia Only, Near East Only, East Asia / Pacific Only, Oceania Only, Africa Only
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Supplier: Brighton Science
Description: Finding the root cause of adhesion issues and gaining total surface quality control begins by defining your entire adhesion process and integrating it into your production process from start to finish. Here at BTG Labs, we have decades of industry production and process
- Location: North America, Midwest US Only
- Materials / Material Products: Adhesives / Sealants
- Services Offered: Analytical Testing / Inspection, Process Development, Process Optimization
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Supplier: Accuris
Description: GM - ENGINEERING MATERIALS AND PROCESSES - ADHESIVES
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Supplier: Maxi Adhesive Products, Inc.
Description: Heavy duty polyester film, single coated with an adhesive system, specifically designed for photographic processing.
- Backing: Plastic / Polymer, PET / Polyester
- Peel Strength / Adhesion: 1.56 lbs/in
- Thickness: 0.0035 inches
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability. Non-conductive Fast cure Thin bondline Excellent gap filling ability Excellent MSL 260°C performance
- Features: Electrically Insulating / Dielectric
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE DSP 3803, Acrylic, Display material, Optical lamination, Single Component, UV Curable Adhesive LOCTITE® DSP 3803 is a single component UV curable adhesive, specifically designed for PSA lamination process. LOCTITE DSP 3803 is a medium viscosity yet high performance
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: UV / Radiation Cured (EB, Light), Single Component System
- Industry: Optical Grade / Material
- Viscosity: 7500 cP
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Supplier: DuPont Electronics & Imaging
Description: Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With good processability and high thermal resistivity
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 58.33 µin/in-F
- Dielectric Constant (Relative Permittivity): 2.8
- Dielectric Strength: 3124 kV/in
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Supplier: Budnick Converting, Inc.
Description: Nitto Denko thermal conductive adhesive tape TR-5325F offers superior thermal conductive property by using the thermal conductive adhesive layer. TR-5325F acquires flammability UL94 V-0 certification. TR-5325F offers excellent workability and processability by adopting the
- Adhesive: Specialty / Other
- Backing: Plastic / Polymer, PET / Polyester
- Thickness: 0.0098 inches
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Supplier: ThreeBond International, Inc.
Description: and high heat resistance. Our structural adhesives are designed to complement other methods of adhesion including nails, rivets, screws bolts, or welding processes. With several options for structural adhesives at ThreeBond, you can find the right appearance, set time, and
- Cure Type / Technology: Two Component System
- Industry: Automotive
- Substrate / Material Compatibility: Rubber / Elastomer
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Description: It is a fast curing reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture curing system. The material can be heated and solidified immediately, allowing processing without the need for thermal curing. It has good adhesion to common
- Cure Type / Technology: Thermoplastic / Hot Melt, Reactive / Moisture Cured, Single Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Use Temperature: -40 to 176 F
- Viscosity: 7500 to 10500 cP
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Supplier: Maxi Adhesive Products, Inc.
Description: Polyester film, single coated with a modified silicone adhesive system.
- Backing: Plastic / Polymer, PET / Polyester
- Peel Strength / Adhesion: 1.88 lbs/in
- Thickness: 0.0034 inches
- Width: 1 inches
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Supplier: Maxi Adhesive Products, Inc.
Description: Polyester film, single coated with a high performance silicone adhesive.
- Backing: Plastic / Polymer, PET / Polyester
- Peel Strength / Adhesion: 2 lbs/in
- Thickness: 0.0030 inches
- Width: 1 inches
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Supplier: Epoxy Technology
Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.11 to 52.22 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
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Supplier: Epoxy Technology
Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 29.44 to 44.44 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
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Supplier: Epoxy Technology
Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.67 to 83.33 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material
- Filled / Reinforced: Yes
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Description: UV curing end face sealant suitable for LCD applications, convection process.
- Cure Type / Technology: UV / Radiation Cured (EB, Light)
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Supplier: Custom Processing Services, Inc.
Description: Custom Processing Services' staff are experts in the fields of micronizing and media milling. We utilize over 20 different processing stations in order to perfectly match the equipment selection to the raw material which is being transformed. Using the most technologically
- Chemicals / Chemical Products: Biochemicals / APIs, Chemical Agents / Additives, Inorganic Chemicals, Organic Chemicals, Pharmaceuticals / Drugs, Polymers
- Form: Bulk Solids / Granules, Liquids, Nanomaterials / Nanoparticles, Powders
- Materials / Material Products: Adhesives / Sealants, Carbon / Graphite, Ceramics, Coatings / Paint, Metals / Elements, Ferrous / Iron Based (Steel, Stainless), Non-ferrous, Noble / Precious Metal, Refractory / Reactive (Tungsten, Zirconium), Minerals, Specialty / Exotic Alloy
- Process Technology: Blending / Mixing, Coating, Crushing / Compacting, Drying / Freeze Drying, Milling / Size Reduction, Screening / Grading, Other
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Description: We offer a complete line of insulation Tapes for use in producing Flat Flexible Cables (FFC's) and a broad range of adhesive types that allow users to balance final product performance with lamination processes. Applications include clock spring cables, jumpers, and any application
- Adhesive: Specialty / Other
- Backing: Specialty / Other
- Features: Dielectric / Insulating
- Peel Strength / Adhesion: 8 lbs/in
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Supplier: Maxi Adhesive Products, Inc.
Description: Polyester film, single coated with a pressure sensitive silicone adhesive system.
- Backing: Plastic / Polymer, PET / Polyester
- Peel Strength / Adhesion: 2.56 lbs/in
- Thickness: 0.0035 inches
- Width: 1 inches
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Supplier: Titebond
Description: drying process. Planks which are not flat should be weighted for several hours. Before leaving for the day, walk the floor and look for any defects or other cosmetic blemishes. This will also ensure the wood flooring is properly seated into the adhesive. After the adhesive has
- Chemical / Polymer System Type: Specialty / Other
- Viscosity: 125000 cP
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Supplier: Titebond
Description: time period (45 minutes), place a weight on those areas until the adhesive has built enough strength to hold the flooring in place. After completing the floor, wedge the flooring so that it remains tight during the drying process. After the adhesive has cured, remove and discard
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Viscosity: 100000 cP
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Supplier: Fluorocarbon Limited
Description: standard stock items and a fast turnaround service on non-stock items. Using our in-house facilities, all PTFE sheet & tape products can be supplied chemically etched on one or both sides using the Fluoroetch® etching process. PTFE Properties: PTFE is a tough, flexible
- Backing: Fluoropolymer, Plastic / Polymer
- Features: Abrasion / Scratch Resistant, Dielectric / Insulating
- Thickness: 0.0051 to 0.0197 inches
- Type: Single-Sided
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Supplier: Accuris
Description: German Language - ADHESIVE BONDING TECHNOLOGY - QUALITY REQUIREMENTS FOR ADHESIVE BONDING PROCESSES - PART 1: ADHESIVE BONDING PROCESS CHAIN
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Supplier: Mitsui Chemicals America, Inc.
Description: adhesive resin in packaging structures restricts the passage of oxygen, flavor and odor permeation. Available in pellet form, this adhesive resin can be used in a wide variety of coextrusion processes for bottles, tubes, sheets and films. It is currently used in used in
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Supplier: InCon Process Systems
Description: Contract Manufacturing Production Toll Processing InCon Contract Manufacturing can help by: Manufacturing the molecule of your choice, under contract, with complete confidentiality. From kilogram to tanker-truck quantities, we can cover your needs every
- Capacity (Mass Basis): 10 to 5.00E6 lbs
- Capacity (Volume Basis): 0.1337 to 66840 cubic feet
- Chemicals / Chemical Products: Alcohols, Biochemicals / APIs, Chemical Agents / Additives, Cleaners / Surface Active Agents, Coolants / Refrigerants, Cosmetics / Soaps, Inorganic Chemicals, Lubricants / Greases, Monomers & Intermediates, Oils & Fuels, Organic Chemicals, Pharmaceuticals / Drugs, Pigments / Dyes, Polymers,
- Form: Liquids
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Supplier: Saint Clair Systems, Inc.
Description: The SCS Temperature Control Unit (TCU) monitors and maintains material temperature by heating or cooling during adhesive and sealant dispense operations. The TCU circulates closed-loop conditioning water through heat exchangers and ancillary components to ensure proper temperature of the
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Supplier: Budnick Converting, Inc.
Description: 3M L1+RT is an adhesive transfer tape reinforced with a high density scrim carrier to boost dimensional stability during lamination processes. An adhesive coat weight of 3.2mils allows the adhesive to flow and ensures good bond strength even around tight radiuses and
- Peel Strength / Adhesion: 3 lbs/in
- Thickness: 0.0041 inches
- Type: Transfer
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Supplier: Budnick Converting, Inc.
Description: NT-2012-2 is a 3.5 mil, polyester film used for splicing photographic film to leader card during film processing.
- Adhesive: Specialty / Other
- Backing: Plastic / Polymer, PET / Polyester
- Peel Strength / Adhesion: 2.19 lbs/in
- Thickness: 0.0035 inches
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Supplier: Budnick Converting, Inc.
Description: NT-5521-2 is a 3.5 mil, polyester film used for splicing photographic film to leader card during film processing.
- Adhesive: Specialty / Other
- Backing: Plastic / Polymer, PET / Polyester
- Peel Strength / Adhesion: 2.19 lbs/in
- Thickness: 0.0035 inches
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Supplier: Process Engineering Associates, LLC
Description: Process Engineering Associates, LLC (PROCESS) specializes in providing process design, applied chemical engineering, and process safety services to the petroleum refining, chemical production, alternative fuels, and all other process industries. PROCESS
- Chemicals / Chemical Products: Acetylenes, Alcohols, Biochemicals / APIs, Catalysts / Initiators, Chemical Agents / Additives, Cleaners / Surface Active Agents, Coolants / Refrigerants, Cosmetics / Soaps, Filler / Extenders, Foods / Beverages, Inorganic Chemicals, Lubricants / Greases, Monomers & Intermediates, Oils & Fuels,
- Form: Gas / Liquid Gas, Liquids, Powders, Nanomaterials, Bulk Solids / Granules, Waste / Scrap
- Materials / Material Products: Abrasives, Adhesives / Sealants, Carbon / Graphite, Ceramics, Coatings / Paint, Elastomers / Rubber, Glass, Metals / Elements, Non-ferrous, Minerals, Nuclear Materials, Plastics, Pulp & Paper, Semiconductor Materials, Textiles
- Regional Preference: North America, United States Only, Northeast US Only, Southern US Only, Northwest US Only
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Description: engineered for superior adhesion to copper, tin, standard FFC/FPC dielectric films, and busbar insulation materials. T4350 free films can be processed in rolls as well as sheets. Features Low flow, flame-retardant, ROHS compliant adhesive. Adhesive thickness: 1, 1
- Adhesive: Specialty / Other
- Backing: Specialty / Other
- Features: Abrasion / Scratch Resistant, Dielectric / Insulating, Thermally Insulating / Insulative, UV / Weather Resistant, Other
- Peel Strength / Adhesion: 8 lbs/in
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Supplier: Celanese Corporation
Description: for broadloom carpet. The new TufCOR® C-Series line of emulsions is designed specifically for the carpet manufacturing industry. We can help you meet the following critical quality requirements with your carpet backing adhesive:tuft-bind strengthdelamination strength and performancelow
- Applications: Adhesives / Sealants, Fibers / Textiles
- Form: Liquid / Solution
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Featured Products Top
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Discover the potential of electric vehicles with advanced adhesive technology in our latest white paper. Read to find out the key challenges in EV manufacturing and gain valuable insight into adhesive applications in power electronics, battery packs, ADAS, and E-motors. Learn about the (read more)
Browse Uncategorized Products Datasheets for Ellsworth Adhesives -
processing application. CHR Pressure Sensitive Adhesive Tapes: Adhesive tapes designed to meet the tough requirements demanded by the packaging industry -- high speed durability and long life at high (read more)
Browse Glass Fibers and Fiberglass Cloth Datasheets for Saint-Gobain Tape Solutions -
glue for underfill pcb electronic components,semiconductor adhesives for electronic assembly,low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material and so on (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
DeepMaterial functional protective film solutions Functional protective film solutions can simplify and enhance the efficiency of many manufacturing processes. In many engineering applications, protective film solutions are now doing jobs that previously required entire assembly (read more)
Browse Leveling and Filling Compounds Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Ellsworth Adhesives offers our customers a wide range of bulk industrial adhesive solutions. We are your total solutions provider for hot melt, industrial bonding, lamination adhesives, and converting services. Lower material costs and refine production processes with help from our Engineering Sales Reps (ESRs) - bond foams, metal, plastics, textiles, veneers, and wood in multiple industries. (read more)
Browse Industrial Adhesives Datasheets for Ellsworth Adhesives -
Advantages of One Component Epoxy Adhesive One component epoxy adhesive offers several advantages over other types of bonds. Some of the key benefits include: Time-saving: One component of epoxy adhesive can save a significant amount of time in the bonding process. Since it is a (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
DeepMaterial has developed industrial adhesives for chip packaging and testing, circuit board-level adhe- sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and (read more)
Browse Industrial Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
urethane structural adhesives. With help from an industry expert, Ellsworth Adhesives can assist you with product selection and implementing a new production process. (read more)
Browse Acrylic Adhesives and Acrylate Adhesives Datasheets for Ellsworth Adhesives -
Epoxy adhesives are known for their high strength and durability, making them suitable for a wide range of applications, including electronics. SMT epoxy adhesives are formulated to meet the specific requirements of SMT processes. They typically have the following characteristics (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Pressure sensitive adhesives form viscoelastic bonds that are aggressively and permanently tacky. They adhere with just finger or hand pressure and do not require activation by water, solvent or heat. Pressure sensitive adhesives are often based on non-crosslinked rubber adhesives in a latex (read more)
Browse Pressure Sensitive Adhesives (PSA) and Contact Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd
Conduct Research Top
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Bonding Elastomers: A Review of Adhesives and Processes
Bonding Elastomers: A Review of Adhesives and Processes. Based on the authors' years of experience working closely with end-use customers, this review offers a thorough overview of how to successfully bond rubber to a given substrate in the manufacture of quality rubber engineered components.
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Properties of Adhesives
Properties of Adhesives. This handbook contains information about the classification, types, form, properties, bonding process of adhesives.
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The Right Adhesive
In most instances, the use of pressure sensitive adhesives can eliminate mechanical fastening systems, (staples, nails or retaining clips) and the inherent problems associated with them. PSA's frequently improve productivity during the final assembly process.
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The Advantages of UV Curing Optical Adhesive in Manufacturing Processes
UV curing optical adhesive is a type of adhesive that is used in various manufacturing processes. It is a versatile and efficient adhesive that offers numerous benefits in terms of productivity, cost savings, quality control, and environmental impact. Adhesive plays a crucial role in manufacturing
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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. Containing over 80 tables and 120 figures which provide a wealth of data on properties, performance, and reliability, this comprehensive book covers all aspects of adhesive technology for microelectronic devices
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UV Curing Adhesives Compatible with Medical Sterilisation Processes
Adhesive technology can be a cost-effective solution to connect components for single use medical products. When bonding transparent or translucent substrates, using a UV curing acrylate adhesive has several advantages: They are easy to handle, can be quickly dispensed and if necessary, can also
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SMT Adhesive Selection: Factors to Consider for Different Assembly Processes
MT adhesives, also known as structural adhesives, are a type of adhesive that is commonly used in assembly processes. These adhesives are designed to provide strong and durable bonds between different substrates, such as metals, plastics, and composites. The selection of the right adhesive
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Converting Adhesive Tape:
The process of transforming a flexible material, adhesive or non-adhesive, into another form in order to solve a specific problem
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Indicates content that may require registration and/or purchase.
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Handbook of Adhesion Technology
The enthusiasm with which XPS has been adopted by the adhesion community springs, to a large extent, from the important role that surface and interfacial phenomena have to play in the adhesion process .
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Adhesive bonding
… and additions took place in the areas, nanotechnology for klebtechnische applications, adhesive developments, for crash stresses, elastic adhesive bonding, Hybrid-(Kombinations-)Klebungen, adhesive bands, and pressure-sensitive adhesives, sealing materials and glue sticks, automation in the adhesive processing , plasma process, applications, in …
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Adhesive bonding
… and additions took place in the areas, nanotechnology for klebtechnische applications, adhesive developments, for crash stresses, elastic adhesive bonding, Hybrid-(Kombinations-)Klebungen, adhesive bands, and pressure-sensitive adhesives, sealing materials and glue sticks, automation in the adhesive processing , plasma process, applications, in …
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Adhesive Bonding
It may be assumed, therefore, that dipole effects contribute to all of the adhesive processes of specific adhesion.
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Applied Adhesive Bonding
7.2 Adhesive Processing 71 .
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Handbook of Adhesion 2nd Edition Complete Document
It is now quite clear that mechanical interlocking has a significant role in the adhesive process , but all the features involved are on a very much smaller scale than was once imagined.
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Adhesive bonding - successfully and accurately
Prerequisites by the adhesive processing on the Arbeitsplatz...........................................................................
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Polymer Adhesion, Friction, and Lubrication
12.4.1 Intermolecular Forces or Molecular Adhesion Processes 521 .