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  • Post-Processing Techniques for Integrated MEMS
    Post-Processing Techniques for Integrated MEMS. Presenting cutting-edge post-processing techniques for the monolithic integration of MEMS, this groundbreaking resource explains how to select MEMS structural layers that can be processed on top of standard pre-fabricated electronics.
  • Using MEMS to Control Blending at AstraZeneca
    ) to name a few. MEMS is an expansion of the tools and manufacturing methods existing in the microelectronics industry and, unlike typical integrated circuits, these devices will have some non-electronic function as well such as sensing, communication or actuation. MEMS application to spectroscopy means
  • Testing of a MEMS-based IC Probe with NANO INDENTER G200 and NanoSuite EXPLORER (.pdf)
    This application note describes the development of a novel method for testing an element in a micro-electromechanical system (MEMS) device. The MEMS device that is the subject of this testing is itself used to test integrated circuits (IC).
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    to purse other interests Keith Jackson, general manager for the Integrated Circuits Group at Fairchild Semiconductor International, has left the company to "purse other interests, " according to the South Portland-based chip maker. CoorsTek hires firm to evaluate buyout offer CoorsTek Inc. today
  • Micro-Optical Sensors for Boundary Layer Flow Studies (.pdf)
    This manuscript describes optical MEMS (or MOEMS)-based microsensors for near wall boundary layer flow and particle field analysis. The sensors have been developed to measure a variety of parameters including flow velocity, surface speed, skin friction, and particle sizing. The surface mounted
  • Industrial Wireless Sensor Networks
    by MEMS sensors) and embedded computing technologies have led to the rise of viable wireless sensor networks for demanding Industrial environments. Other reasons for this growth are that WSNs are at acceptable reliability levels for most industrial uses, the advent of WSN standards specifically
  • Environmental Noise Control Trends in Instrumentation
    . They are much less expensive (usually only a few dollars) and consume a very small current at low voltage. But they have a frequency response that is less well controlled. In recent years a third family of microphones has appeared in the industry: * MEMS microphones: Micro-Electro-Mechanical Systems

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  • MEMS Materials and Processes Handbook
    Example 5: Junction Depth Determination for an Integrated MEMS Device . . . . . . . . . . . . . .
  • Microsystems and Nanotechnology
    The process integrates MEMS and electronics using a 10-ȝm-thick SOI layer for both electronics and MEMS structures.
  • MEMS/NEMS
    Under this framework, concurrent integrated MEMS design and simulation models can be built using both local and distributed resources, and the design collaboration can be realized by exchanging services between modules based upon CORBA standard communication protocol.
  • Springer Handbook of Nanotechnology
    Use of high-quality single- crystal wafers enables the fabrication of integrated MEMS devices, at least for materials and processes that are compatible with Si ICs.
  • Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
    Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents .
  • Springer Handbook of Nanotechnology
    Use of high-quality single-crystal wafers enables the fab- rication of integrated MEMS devices, at least for materials and processes that are compatible with Si ICs.
  • Springer Handbook of Nanotechnology
    Use of high-quality single crystal wafers enables the fabrication of integrated MEMS devices, at least for materials and processes that are compatible with Si ICs.
  • Encyclopedia of Nanotechnology
    In addition to the approaches of forming MEMS structures on top of the CMOS substrate by thin-film deposition, wafer bonding provides another method to directly integrate MEMS structures on CMOS substrate [11].
  • Laboratory directed research and development annual report 2003.
    novel concepts for critical technologies, such as fuzing, that apply microtechnology, which has resulted in an integrated MEMS –based Micro-CDU.