See All Suppliers In This Area
Fill out as many options as you want. Click "Run Search Filter" at any time.

Type:

Bus Type:

Density:

Number of Words:

Bits per Word:

bits

Access Time:

Data Rate:

Data Retention:

years

Endurance:

Write/Erase Cycles

Logic Family:

Supply Voltage:

Operating Current:

Standby Current:

IC Package Type:

Screening Level:

Pin Count:

Operating Temperature:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

Help with NVRAM specifications:

Type / Organization
   Type:       
   Your choices are...         
   FRAM       Ramtron’s ferroelectrics random access memory (FRAM) is a new generation of nonvolatile memory that combines high-performance and low-power operation with the ability to retain data without power. FRAM has the fast read/write speed and low power of battery-backed SRAM and eliminates the need for a battery. EEPROM and Flash require long write times, wear out after being written a small number of times, and use a large amount of power to write data. FRAM writes instantly, has virtually unlimited endurance, and requires very little write power. 
   NVSRAM       Non-volatile static random access memory (nvSRAM). 
   Other         
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Bus Type:       
   Your choices are...         
   Parallel       A general bus where the data bits are sent in groups. 
   Serial       A general bus where the data bits are sent one at a time. 
   Serial-1 Wire       A type of communication protocol that uses an I/O pin. 
   Serial-2 Wire       A type of communication protocol. 
   Serial-3 Wire       A type of communication protocol. 
   I2C       Inter-Integrated Circuit (I2C) bus is a two-wire, low to medium speed, communication bus developed by Philips Semiconductors in the early 1980's. 
   MICROWIRE™       MICROWIRE™ is a serial protocol created by National Instruments. 
   SPI       The serial peripheral interface (SPI) port was developed by Motorola. 
   Serial-uPort       A type of communication protocol. 
   Other         
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Density:         
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Number of Words:         
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Bits per Word:         
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
Back to Top
Performance
   Access Time:         
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Data Rate:         
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Data Retention:       The time (in years) that the memory chips can retain the data without reloading. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Endurance:       The maximum number of write / read cycles that the chip can support. 
   Search Logic:      All matching products will have a value greater than or equal to the specified value.
   Logic Family:       
   Your choices are...         
   LCX         
   LV         
   L         
   CMOS 4000         
   Emitter Coupled Logic (ECL)         
   Transistor-Transistor Logic (TTL)         
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Back to Top
Power Characteristics
   Supply Voltage:       
   Your choices are...         
   -5 V       The chip operates with -5 volts. 
   -4.5 V         
   -3.3 V       The chip operates with -3.3 volts. 
   -3 V       The chip operates with -3 volts. 
   1.2 V         
   1.5 V         
   1.8 V         
   2.5 V         
   2.7 V       The chip operates with 2.7 volts. 
   3 V         
   3.3 V         
   3.6 V         
   5 V         
   Other         
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Operating Current:         
   Search Logic:      All matching products will have a value less than or equal to the specified value.
   Standby Current:         
   Search Logic:      All matching products will have a value less than or equal to the specified value.
Back to Top
Packaging Information
   IC Package Type       
   Your choices are...         
   BGA       Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   FLGA       Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. 
   QFP       Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.  
   TQFP       Thin quad flat package (TQFP). 
   SOP       Small outline package (SOP). 
   SOIC       Small outline integrated circuit (SOIC). 
   TSOP       Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. 
   SSOP       Shrink small outline package (SSOP). 
   TSSOP       Thin shrink small outline L-leaded package (TSSOP). 
   SOJ       Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. 
   PLCC       Plastic leaded chip carrier (PLCC). 
   LCCC       Leadless ceramic chip carrier (LCCC). 
   DIP       Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. 
   SIP       Single in-line package (SIP). 
   Other       Other unlisted, specialized, or proprietary IC packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Screening Level:       
   Your choices are...         
   Commercial       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications. 
   Industrial       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications. 
   Military       Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications. 
   Other       Other unlisted screening levels. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count:         
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Temperature:         
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
Back to Top
Product Announcements
TT Semiconductor, Inc.
TT Semiconductor, Inc.
TT Semiconductor, Inc.