LiPOLY DTT series is a soft thermally conductive gel pad specifically designed for networking communication applications, including 5G infrastructure/station, communication satellite…etc. It is designed to focus on Dk and Df to reduce interference in RF modules. Thermal conductivity 3~4W/m*K.

DTT44-s datasheet: https://lipolytim.com/wp-content/uploads/2022/09/DTT44.pdf

DTT65-s datasheet: https://lipolytim.com/wp-content/uploads/2022/09/DTT65.pdf

Over the past decade, Shiu Li Technoloby (LiPOLY) has developed Thermal Pads, Thermal Pastes, Thermal Greases, Gap Fillers, Thermal Tapes, Liquid Gap Filler and Insulator materials for companies working in Computer, Storage, Gaming, Datacom Infrastructure, Automotive Electronics, Lighting Equipment, Power and Industrial Automation. LiPOLY TIM’s have been designed into thousands of applications for some of the largest electronic companies in the world. We listen to our customers’ needs and develop thermal solutions that meet our customers’ specific design requirements. Our customers come to us because we deliver innovative and reliable thermal interface solutions.