Filled / Reinforced Specialty Adhesives, Sealants, and Compounds

33 Results
ELAN-Cast® -- E 4260 Black resin / C 321 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
CONDUCTIVE SILVER-CARBON EPOXY -- G6E-NS10
from G6 Epoxy

DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
CONDUCTIVE SILVER-CARBON EPOXY -- G6E-NS11
from G6 Epoxy

DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
FLEXIBLE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY -- G6E-FRP
from G6 Epoxy

DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med
from Master Bond, Inc.

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component; LED Cure
FLEXIBLE SILVER-CARBON ELECTRICALLY CONDUCTIVE EPOXY -- G6E-FXNS
from G6 Epoxy

DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Filled
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
FLEXIBLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY -- G6E-FXSG
from G6 Epoxy

DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
GENERAL PURPOSE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY -- G6E-P
from G6 Epoxy

DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
HIGH TEMPERATURE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY -- G6E-HTC
from G6 Epoxy

DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC
from Master Bond, Inc.

For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
HIGH TEMPERATURE SILVER-CARBON CONDUCTIVE EPOXY -- G6E-HTNS
from G6 Epoxy

DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Filled
  • Chemical System: Polyurethane; Epoxy
  • Cure / Technology: Thermoset; Two Component  
HIGH TEMPERATURE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY -- G6E-HTSG
from G6 Epoxy

DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Graphite Filled, Electrically Conductive Epoxy -- EP75-1
from Master Bond, Inc.

Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
ROOM TEMPERATURE CURABLE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY -- G6E-RTC
from G6 Epoxy

DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
ROOM TEMPERATURE CURABLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY -- G6E-RTSG
from G6 Epoxy

DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
SILVER-GRAPHENE CONDUCTIVE EPOXY -- G6E-SG
from G6 Epoxy

DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC
from Master Bond, Inc.

Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO
from Master Bond, Inc.

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Two Component Silver Conductive Epoxy -- EP77M-1
from Master Bond, Inc.

Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79
from Master Bond, Inc.

Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO
from Master Bond, Inc.

Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Thermally Conductive PU Potting Compound -- 50-2366 FR
from Epoxies Etc...

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Chemical System: Elastomeric; Polyurethane
  • Composition: Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing