Single Component System Specialty Adhesives, Sealants, and Compounds

Hold Catalyst
from Owens Corning® FOAMGLAS® Insulation

A solution which is applied by a suitable small sprayer to accelerate the cure of PC ® 88 adhesive. Hold catalyst is a solution which is applied by a suitable small sprayer to accelerate the cure of PC ® 88 adhesive. It provides a quick set and helps reduce or eliminate the time needed for... [See More]

  • Cure / Technology: Single Component
  • Type / Form: Liquid
  • Substrate Compatibility: FOAMGLAS®
  • Features: Adhesive
Liquid Adhesive Primer -- Polybond™
from Polyguard Products, Inc.

Polybond ™ Liquid Adhesive is a rubber based adhesive in solvent formulation to improve adhesion of Polyguard and other construction flashing tapes. It is especially suited for use in cool weather when rubberized asphalt tapes can lose a portion of their adhesiveness. Polybond ™ Liquid... [See More]

  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Chemical System: Elastomeric
  • Substrate Compatibility: Concrete, Masonry; Rubber or Elastomer; Wood
  • Type / Form: Liquid
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
One Part Silicone Adhesive / Sealant -- PC® HI-TEMP RTV
from Owens Corning® FOAMGLAS® Insulation

A one part acetoxy cure silicone adhesive / sealant formulated for use at high temperatures. It is particularly suited for use in conjunction with insulations which require adhering or sealing to itself or hot surfaces. It cures to an elastomeric solid at room temperatures. VOC Compliant. Meets the... [See More]

  • Cure / Technology: Single Component; Acetoxy
  • Chemical System: Silicone
  • Substrate Compatibility: Metal; Asphalt
  • Features: Adhesive
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Unfilled
Silicone Adhesive / Sealant -- PC® RTV 450
from Owens Corning® FOAMGLAS® Insulation

A one part, neutral cure, silicone adhesive / sealant formulated for use at high temperatures. PC ® HI-TEMP / RTV Silicone Adhesive is a one part, neutral cure, silicone adhesive / sealant formulated for use at high temperatures. It is particularly suited for use in conjunction with insulations... [See More]

  • Cure / Technology: Air Setting / Film Drying; Single Component; Room Temperature Vulcanizing or Curing
  • Features: Adhesive
  • Substrate Compatibility: FOAMGLAS®
  • Industry: Insulation Systems
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Filled
Single Component Bituminous Adhesive -- PC® 500
from Owens Corning® FOAMGLAS® Insulation

A single component bituminous adhesive with low solvent content and a high content of extenders. It retains long-term flexibility, does not freeze, and is thixotropic. U.S. Special Order Item. Available in standard 25 kg pails. E.U. Stock item. Available in standard 25 kg bags. [See More]

  • Cure / Technology: Single Component
  • Features: Adhesive
  • Substrate Compatibility: FOAMGLAS®
  • Industry: Insulation Systems
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Unfilled
High Tensile Strength, One Component Epoxy -- EP15
from Master Bond, Inc.

Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med
from Master Bond, Inc.

Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
One Component Thermally Conductive Epoxy Film -- FL901AO
from Master Bond, Inc.

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Dissimilar Substrates
  • Composition: Unfilled
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion -- EP13LTE
from Master Bond, Inc.

Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
UV Curable Compound -- UV Cure 60-7105
from Epoxies Etc...

UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good choice for deep... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Elastomeric; Polyurethane
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
High Tack Spray Adhesive for HVAC -- FiberWeld
from Westech Aerosol Corporation

FiberWeld is formulated to be a multi-purpose industrial strength adhesive specifically designed for insulation and duct liners. Prior to use, a small test patch should be sprayed to evaluate substrate compatibility. This product may degrade some thin plastics and films. Materials that FiberWeld... [See More]

  • Cure / Technology: Air Setting / Film Drying; Contact or Pressure Sensitive Adhesives; Single Component
  • Chemical System: Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
SnapTrace® Heat Transfer Compound -- ST-1
from Thermon, Inc

SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation on straight piping runs 1-1/2 inches (38 mm) and larger. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating... [See More]

  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Features: Electrically Conductive; Sealant
  • Substrate Compatibility: Metal
  • Industry: Electric Power
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Chemical System: Ceramic
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates; Cork, Felt
  • Composition: Unfilled
CoroBond™ Conductive Vinyl Ester Primer
from Sherwin-Williams Protective & Marine Coatings

CoroBond ™ CONDUCTIVE VINYL ESTER PRIMER is a conductive, elastomer modified epoxy vinyl ester. It is designed to provide superior adhesion to concrete and metal substrates, and resist mechanical stresses such as impact, abrasion, tensile and flexural stress. Excellent chemical resistance. [See More]

  • Cure / Technology: Air Setting / Film Drying; Thermoset; Single Component
  • Chemical System: Alkyd; Vinyl; Epoxy
  • Substrate Compatibility: Concrete, Masonry; Metal
  • Type / Form: Liquid