Single Component System Specialty Adhesives, Sealants, and Compounds
from Polyguard Products, Inc.
Poly Wall ® Home Stretch ™ Water Based Liquid Adhesive is specifically formulated to provide excellent adhesion with all the Poly Wall ® waterproofing and flashing membranes under many kinds of surface conditions. Home Stretch ™ Water Based Liquid Adhesive is an integral part of... [See More]
- Cure / Technology: Air Setting / Film Drying; Single Component
- Chemical System: Elastomeric
- Substrate Compatibility: Concrete, Masonry; Rubber or Elastomer; Wood
- Type / Form: Liquid
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Type / Form: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Filled
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Dissimilar Substrates
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Cure / Technology: Air Setting / Film Drying; Single Component
- Chemical System: Ceramic
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates; Cork, Felt
- Composition: Unfilled
from Epoxies Etc...
UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good choice for deep... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Elastomeric; Polyurethane
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Liquid
from Westech Aerosol Corporation
FiberWeld is formulated to be a multi-purpose industrial strength adhesive specifically designed for insulation and duct liners. Prior to use, a small test patch should be sprayed to evaluate substrate compatibility. This product may degrade some thin plastics and films. Materials that FiberWeld... [See More]
- Cure / Technology: Air Setting / Film Drying; Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates
- Type / Form: Liquid
from Sherwin-Williams Protective & Marine Coatings
CoroBond ™ CONDUCTIVE VINYL ESTER PRIMER is a conductive, elastomer modified epoxy vinyl ester. It is designed to provide superior adhesion to concrete and metal substrates, and resist mechanical stresses such as impact, abrasion, tensile and flexural stress. Excellent chemical resistance. [See More]
- Cure / Technology: Air Setting / Film Drying; Thermoset; Single Component
- Chemical System: Alkyd; Vinyl; Epoxy
- Substrate Compatibility: Concrete, Masonry; Metal
- Type / Form: Liquid
from Owens Corning® FOAMGLAS® Insulation
A solution which is applied by a suitable small sprayer to accelerate the cure of PC ® 88 adhesive. Hold catalyst is a solution which is applied by a suitable small sprayer to accelerate the cure of PC ® 88 adhesive. It provides a quick set and helps reduce or eliminate the time needed for... [See More]
- Cure / Technology: Single Component
- Type / Form: Liquid
- Substrate Compatibility: FOAMGLAS®
- Features: Adhesive
from Owens Corning® FOAMGLAS® Insulation
A one part acetoxy cure silicone adhesive / sealant formulated for use at high temperatures. It is particularly suited for use in conjunction with insulations which require adhering or sealing to itself or hot surfaces. It cures to an elastomeric solid at room temperatures. VOC Compliant. Meets the... [See More]
- Cure / Technology: Single Component; Acetoxy
- Chemical System: Silicone
- Substrate Compatibility: Metal; Asphalt
- Features: Adhesive
from Owens Corning® FOAMGLAS® Insulation
A one part, neutral cure, silicone adhesive / sealant formulated for use at high temperatures. PC ® HI-TEMP / RTV Silicone Adhesive is a one part, neutral cure, silicone adhesive / sealant formulated for use at high temperatures. It is particularly suited for use in conjunction with insulations... [See More]
- Cure / Technology: Air Setting / Film Drying; Single Component; Room Temperature Vulcanizing or Curing
- Features: Adhesive
- Substrate Compatibility: FOAMGLAS®
- Industry: Insulation Systems
from Owens Corning® FOAMGLAS® Insulation
A single component bituminous adhesive with low solvent content and a high content of extenders. It retains long-term flexibility, does not freeze, and is thixotropic. U.S. Special Order Item. Available in standard 25 kg pails. E.U. Stock item. Available in standard 25 kg bags. [See More]
- Cure / Technology: Single Component
- Features: Adhesive
- Substrate Compatibility: FOAMGLAS®
- Industry: Insulation Systems