Encapsulanting / Potting Specialty Adhesives, Sealants, and Compounds

ELAN-Cast® -- E 4260 Black resin / C 321 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; UL Rating
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive; Adhesive
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Filled
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Silicone
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Filled
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Adhesive; Anti-static, ESD
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces
  • Composition: Unfilled
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Adhesive
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM
from Master Bond, Inc.

Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Features: Flexible; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB
from Master Bond, Inc.

Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC
from Master Bond, Inc.

Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Laminaes; Sealant; Adhesive; Anti-static, ESD
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Unfilled
Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5
from Master Bond, Inc.

EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO
from Master Bond, Inc.

Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO
from Master Bond, Inc.

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures -- Supreme 121AO
from Master Bond, Inc.

Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Features: Encapsulant, Potting Compound; Adhesive
  • Type / Form: Gel
  • Chemical System: Epoxy
  • Composition: Unfilled
Epoxy Compound; for potting and encapsulating; 2 part; black; .8 gal liquid -- 70125817 [832B-3L from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Features: Encapsulant, Potting Compound; Adhesive
  • Type / Form: Liquid
  • Chemical System: Epoxy
High Thermal K Heat Transfer Epoxy -- 50-3100
from Epoxies Etc...

50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally... [See More]

  • Features: Encapsulant, Potting Compound; Thermally Conductive
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Epoxy Compound; for potting and encapsulating; 2 part; black; 12 oz liquid -- 70125812 [832B-375ML from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Features: Encapsulant, Potting Compound; Adhesive
  • Type / Form: Liquid
  • Chemical System: Epoxy
UV Curable Compound -- UV Cure 60-7105
from Epoxies Etc...

UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good choice for deep... [See More]

  • Features: Encapsulant, Potting Compound; Sealant; Adhesive
  • Chemical System: Elastomeric; Polyurethane
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
Epoxy Compound; for potting and encapsulating; 2 part; clear; .8 gal liquid -- 70125827 [832C-3L from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Features: Encapsulant, Potting Compound; Adhesive
  • Type / Form: Liquid
  • Chemical System: Epoxy
Epoxy Compound; for potting and encapsulating; 2 part; clear; 12 oz liquid -- 70125822 [832C-375ML from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Features: Encapsulant, Potting Compound; Adhesive
  • Type / Form: Liquid
  • Chemical System: Epoxy
POTTING EPOXY 8 OZ -- 70159833 [19-823 from GC Electronics]
from Allied Electronics, Inc.

3M Scotch-Weld ™ Epoxy Potting Compound-Adhesives. Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1 hour. Mix... [See More]

  • Features: Encapsulant, Potting Compound; Adhesive
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Use Temperature: -40 to 300
Silicone; high temp potting; red;1 pint; 2 part; requires SS4004P primer -- 70125537 [RTV31-1P from MG Chemicals]
from Allied Electronics, Inc.

MG Chemicals offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements, curing... [See More]

  • Features: Encapsulant, Potting Compound
  • Viscosity: 25000
  • Chemical System: Silicone
  • Use Temperature: -65 to 500
Silicone; Potting and Encapsulating; Aluminum; 300 ml Cartridge -- 70125755 [RTV109-300ML from MG Chemicals]
from Allied Electronics, Inc.

MG Chemicals offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements, curing... [See More]

  • Features: Encapsulant, Potting Compound
  • Use Temperature: -76 to 405
  • Chemical System: Silicone
Silicone; Potting and Encapsulating; White; 333 ml Cartridge -- 70125538 [TSE3941-333ML from MG Chemicals]
from Allied Electronics, Inc.

MG Chemicals offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements, curing... [See More]

  • Features: Encapsulant, Potting Compound; Flame Retardant
  • Use Temperature: -67 to 392
  • Chemical System: Silicone
  • Thermal Conductivity: 0.8300
Silicone; potting; optically clear;1 gal; requires SS4120 primer -- 70125506 [RTV615-1G from MG Chemicals]
from Allied Electronics, Inc.

Potting ⁄Encapsulating Compound, 120% Elongation, 1.05 Specific Gravity, Optical Clear Color. Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive... [See More]

  • Features: Encapsulant, Potting Compound
  • Viscosity: 4000
  • Chemical System: Silicone
  • Use Temperature: -76 to 401
Silicone; potting; optically clear;1 pint; requires SS4120 primer -- 70125885 [RTV615-1P from MG Chemicals]
from Allied Electronics, Inc.

Excellent for potting solar cells for maximum light transmission and electronic assemblies where component identification is desirable. This two part silicone is supplied with a curing agent. Primer required. Cures at room temperature. Has low viscosity allowing easy flow in and around complex... [See More]

  • Features: Encapsulant, Potting Compound
  • Viscosity: 4000
  • Chemical System: Silicone
  • Use Temperature: -76 to 401