Grease / Paste Specialty Adhesives, Sealants, and Compounds
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Adhesive; Anti-static, ESD
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
- Type / Form: Powder
- Chemical System: Epoxy
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from R. S. Hughes Company, Inc.
Dap 3.0 gray asphalt & concrete sealant with a 24 hr cure time. This asphalt & concrete sealant is waterproof. Minimum to maximum operating temperatures are -65 F to +200 F. Perfect for filling and sealing applications. [See More]
- Features: Leveling Filling; Sealant
- Use Temperature: -65 to 200
from Allied Electronics, Inc.
3M Scotch-Weld ™ Epoxy Adhesives. Super grip, slow set. Package Contains: One 2 Ozs. (57 grams) tube of resin and one 2 Ozs. (57 grams) tube of hardener. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]
- Chemical System: Gum; Epoxy
- Features: Adhesive
from Epoxies Etc...
20-3005 is a two component chemical resistance epoxy system. It was developed for potting, coating, and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates and will cure at low temperatures. 20-3005 has a convenient 2:1 volumetric... [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound; Adhesive
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: OEM or Industrial
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®CRACK FILLER is a two-component, fast set epoxy paste developed specifically for sealing, smoothing, and fairing applications on concrete, metals, plastics (FRP), wood, or masonry. The smooth consistency and excellent non-sagging properties allow the product to be used on vertical and... [See More]
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Thermon, Inc
SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation on straight piping runs 1-1/2 inches (38 mm) and larger. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating... [See More]
- Substrate Compatibility: Metal
- Features: Electrically Conductive; Sealant
- Cure / Technology: Air Setting / Film Drying; Single Component
- Industry: Electric Power
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates; Cork, Felt
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Single Component
from R. S. Hughes Company, Inc.
Dap black asphalt & concrete sealant. This asphalt & concrete sealant is waterproof. Minimum to maximum operating temperatures are -40 F to +180 F. Perfect for filling and sealing applications. [See More]
- Features: Leveling Filling; Sealant
- Use Temperature: -40 to 180
from Allied Electronics, Inc.
Excellent for potting solar cells for maximum light transmission and electronic assemblies where component identification is desirable. This two part silicone is supplied with a curing agent. Primer required. Cures at room temperature. Has low viscosity allowing easy flow in and around complex... [See More]
- Chemical System: Silicone
- Viscosity: 4000
- Features: Encapsulant, Potting Compound
- Use Temperature: -76 to 401
from R. S. Hughes Company, Inc.
Dap black asphalt & concrete sealant. This asphalt & concrete sealant is waterproof. Minimum to maximum operating temperatures are -40 F to +180 F. Perfect for sealing applications. [See More]
- Features: Leveling Filling; Sealant
- Use Temperature: -40 to 180
from R. S. Hughes Company, Inc.
Dap black asphalt & concrete sealant with a 72 hr cure time. This asphalt & concrete sealant is waterproof. Minimum to maximum operating temperatures are -30 F to +180 F. Perfect for filling applications. [See More]
- Features: Leveling Filling; Sealant
- Use Temperature: -30 to 180
from R. S. Hughes Company, Inc.
Dap gray asphalt & concrete sealant. This asphalt & concrete sealant is waterproof. Minimum to maximum operating temperatures are -30 F to +150 F. Perfect for patching applications. [See More]
- Features: Leveling Filling; Sealant
- Use Temperature: -30 to 150
from R. S. Hughes Company, Inc.
Dap gray asphalt & concrete sealant with a 14 day cure time. This asphalt & concrete sealant is waterproof. Minimum to maximum operating temperatures are -30 F to +150 F. Perfect for patching applications. [See More]
- Features: Leveling Filling; Sealant
- Use Temperature: -30 to 150
from R. S. Hughes Company, Inc.
Dap Bondex gray asphalt & concrete sealant with a 6 hr cure time. This asphalt & concrete sealant is waterproof. Perfect for patching applications. [See More]
- Features: Leveling Filling; Sealant
from R. S. Hughes Company, Inc.
Dap Silicone Plus gray asphalt & concrete sealant. This asphalt & concrete sealant is waterproof. Minimum to maximum operating temperatures are -65 F to +350 F. Perfect for sealing applications. [See More]
- Chemical System: Silicone
- Use Temperature: -65 to 350
- Features: Leveling Filling; Sealant