Polyimide Thermoplastics and Thermoplastic Resins

18 Results
Ducoya® -- G001
from Duvelco Limited

Ducoya® G001 is a remarkable material with unparalleled physical strength, elongation and toughness. Ducoya G001 can also continuously operate over a wide temperature range from near absolute zero to greater than 400°C in a favorable chemical environment. Its excellent electrical and thermal... [See More]

  • Chemical System: Polyimide
  • Resins & Compounds: Pellets
  • Filler: Unfilled
  • Industry: Aerospace; Semiconductors or IC Packaging
AURUM™ Thermoplastic polyimide
from Mitsui Chemicals America, Inc.

AURUM ™ challenges the conventional wisdom that while polyimides offer exceptional high-heat performance, they are difficult to process. Unlike traditional thermosetting polyimide, from which parts are often machined from stock shapes or thin sheets, AURUM ™ is a thermoplastic resin that... [See More]

  • Chemical System: Polyimide
Ducoya® -- G001 UP
from Duvelco Limited

Ducoya® G001 UP is an ultra-pure polyimide for semiconductors. The material is intended for use in the latest semiconductor manufacturing operations where feature sizes can be found in the low nanometer range. [See More]

  • Chemical System: Polyimide
  • Resins & Compounds: Pellets
  • Filler: Unfilled
  • Industry: Semiconductors or IC Packaging
Ducoya® -- G021
from Duvelco Limited

G021: High-performance polyimide with 15% graphite encapsulated into the polymer, combining low wear with balanced physical properties. [See More]

  • Chemical System: Polyimide
  • Resins & Compounds: Pellets
  • Filler: Carbon or Graphite
  • Industry: Aerospace; Automotive
Ducoya® -- G022
from Duvelco Limited

G022: Polyimide with 40% graphite encapsulated into the polymer, providing unparalleled dimensional stability for design flexibility. [See More]

  • Chemical System: Polyimide
  • Resins & Compounds: Pellets
  • Filler: Carbon or Graphite
Ducoya® -- G201 ESD
from Duvelco Limited

Ducoya® G201 ESD is a high-purity polyimide for semiconductor applications where an electrostatic dissipative capability is required. This material is intended for use in the latest semiconductor manufacturing operations, especially where movement could generate static electricity that must be... [See More]

  • Chemical System: Polyimide
  • Features: Anti-static or ESD Control
  • Resins & Compounds: Pellets
  • Industry: Semiconductors or IC Packaging
Ducoya® -- G202 C
from Duvelco Limited

Ducoya® G202 C is a high-purity-filled polyimide for semiconductor applications requiring electrically conductive material. This material is intended for use in the latest semiconductor manufacturing operations, especially where process conditions could generate static electricity. Connecting such... [See More]

  • Chemical System: Polyimide
  • Features: Electrically Conductive Compound
  • Resins & Compounds: Pellets
  • Industry: Semiconductors or IC Packaging
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyamide; Polyimide
  • Features: UL; Thermally Conductive
  • Resins & Compounds: Pellets; MoldingCompound
  • Industry: Electronics
DuPont™ Minlon® Mineral Reinforced Nylon Resin -- Minlon® 73GM40 NC010 -- PA6-(MD+GF)40
from DuPont Plastics, Polymers & Resins

Minlon ® 73GM40 NC010 is a 40% mineral/glass reinforced, heat stabilized polyamide 6 resin for injection molding. The DuPont ™ Minlon ® family of mineral and mineral/glass-reinforced nylon resins offers a unique balance of properties that allows designers to maintain the optimum... [See More]

  • Chemical System: Polyimide
  • CTE: 0
  • Filler: Glass or FRP
  • Tensile Modulus: 667
Graphite Reinforced Polymide -- TECASINT 2021 Black
from Ensinger North America

TECASINT 2021 is a plastic reinforced with 15% graphite and based on the base polymer TECASINT 2011. It is particularly suitable for tribological applications owing to its improved friction and wear behavior. Thanks to its self lubricating property, TECASINT 2021 is well suited to lubricated and dry... [See More]

  • Chemical System: Polyimide
  • Deflection Temperature: 600
  • Industry: Aerospace; Automotive; Sanitary; OEM or Industrial
  • CTE: 23
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyamide; Polyimide
  • Features: UL; Thermally Conductive
  • Resins & Compounds: Pellets; MoldingCompound
  • Industry: Electronics
DuPont™ Zytel® PLUS Nylon Resin -- Zytel® PLS90G30DR BK099 -- PA66-GF30
from DuPont Plastics, Polymers & Resins

Zytel ® PLS90G30DR BK099 is a 30% glass reinforced PA66 nylon resin having superior resistance to hot engine coolant. It is particularly suitable for automotive Radiator End Tanks and other parts in contact with engine coolant. The Breakthrough Plastic that Won ’t Break Through. DuPont... [See More]

  • Chemical System: Polyimide
  • Industry: Automotive
  • Filler: Glass or FRP
  • CTE: 1
Unfilled Polyimide -- TECASINT 2011 Brown
from Ensinger North America

TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]

  • Chemical System: Polyimide
  • Industry: Aerospace; Electronics; Sanitary; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Deflection Temperature: 600
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyamide; Polyimide
  • Features: UL; Thermally Conductive
  • Resins & Compounds: Pellets; MoldingCompound
  • Industry: Electronics
DuPont™ Zytel® RS Renewably Sourced™ Polyamides -- Zytel® RS LC1000 BK385 Renewably Sourced™ Polyamide -- PA1010
from DuPont Plastics, Polymers & Resins

Zytel ® RS LC1000 BK385 is a renewable sourced Polyamide 1010 containing a minimum of 90% renewably sourced ingredient by weight. The material is flexible, unreinforced, UV and heat stabilized and suitable for multiple extrusion applications. The Zytel ® RS product family comprises all... [See More]

  • Chemical System: Polyimide
  • Tensile Modulus: 168
  • Industry: Automotive
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyamide; Polyimide
  • Features: Thermally Conductive
  • Resins & Compounds: Pellets; MoldingCompound
  • Industry: Electronics
TECHNOMELT PA 668 -- 8805825445889
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyamide; Polyimide
  • Features: Flame Retardant; UL; Thermally Conductive
  • Resins & Compounds: Pellets; MoldingCompound
  • Industry: Electronics
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyamide; Polyimide
  • Features: UL; Thermally Conductive
  • Resins & Compounds: Pellets; MoldingCompound
  • Industry: Electronics