UL Approved Thermoplastics and Thermoplastic Resins
from AGC Chemicals Americas, Inc.
Melt processable copolymers composed of tetrafluoroethylene and ethylene, Fluon ® ETFE Resins offer superior physical toughness and adaptability to meet the ranging needs of simple, high-quality, complicated and even high-performance products. The fluoropolymers maintain stable mechanical and... [See More]
- Features: Flame Retardant; UL; Electrically Conductive Compound
- Filler: Unfilled
- Chemical System: Fluoropolymer
- Resins & Compounds: Pellets; MoldingCompound
from Victrex PLC
High performance thermoplastic material, 30% carbon fiber reinforced Poly Ether Ether Ketone (PEEK), semi crystalline, granules for injection molding, easy flow, FDA food contact compliant, color black. [See More]
- Features: Flame Retardant; UL
- Filler: Carbon or Graphite
- Chemical System: PEEK
- Resins & Compounds: Pellets; MoldingCompound
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyolefin
- Industry: Electronics
from Celanese Corporation
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 248 to 266
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Industry: Electronics
from Celanese Corporation
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 248 to 266
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Industry: Electronics
from Celanese Corporation
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 248 to 284
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Industry: Electronics
from Celanese Corporation
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul [See More]
- Features: UL
- Filler: Unfilled
- Chemical System: Acetal or Polyoxymethylene (POM)
- Resins & Compounds: ExtrusionGrade; MoldingCompound
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyolefin
- Industry: Electronics
from Celanese Corporation
To avoid hydrolytic degradation during processing, Impet resins have to be dried to a moisture level equal to or less than 0.01%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 275 °F (135 °C) for 4 hours. [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 266 to 284
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Industry: Electronics
from Celanese Corporation
Polymer Resin [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Dielectric Strength: 310
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Industry: Electronics
from Celanese Corporation
Polymer Resin [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 203 to ?
from Celanese Corporation
To avoid hydrolytic degradation during processing, Vandar resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 248 to 266
from Celanese Corporation
When using short metering strokes an accumulator is recommended to get short injection times. VECTRA should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 40 ° C. The time between... [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 302
from Celanese Corporation
When using short metering strokes an accumulator is recommended to get short injection times. VECTRA should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 40 ° C. The time between... [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 302
from Celanese Corporation
Polymer Resin [See More]
- Features: UL
- Resins & Compounds: MoldingCompound
- Filler: Unfilled
- Use Temperature: 302