Electronics Thermoplastics and Thermoplastic Resins
from AGC Chemicals Americas, Inc.
CYTOP ™ amorphous fluoropolymers have the same excellent chemical, thermal, electrical and surface properties as conventional fluoropolymers like PTFEs, but also exhibit high optical transparency and good solubility in specific fluorinated solvents. CYTOP fluoropolymers are like transparent... [See More]
- Industry: Electronics; Semiconductors or IC Packaging; Optical Film, Antifouling Coatings for Photomasks
- Filler: Unfilled
- Chemical System: Fluoropolymer
- Resins & Compounds: MoldingCompound
from Victrex PLC
High performance thermoplastic material, 30% carbon fiber reinforced Poly Ether Ether Ketone (PEEK), semi crystalline, granules for injection molding, easy flow, FDA food contact compliant, color black. [See More]
- Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Energy, Textile, Industrial, Food, Oil/Gas
- Filler: Carbon or Graphite
- Chemical System: PEEK
- Resins & Compounds: Pellets; MoldingCompound
from ExxonMobil - Polypropylene Products
Challenge reality and rethink what ’s possible in automotive performance, packaging design, hygiene comfort and appliance appeal. Offering a new benchmark in performance compared to traditional polypropylene, Achieve Advanced PP eliminates trade-offs in performance, processing and end-of-life... [See More]
- Industry: Automotive; Electronics; Sanitary; OEM or Industrial
- Deflection Temperature: 200
- Chemical System: Polypropylene
- Elongation: 9.2
from AGC Chemicals Americas, Inc.
Melt processable copolymers composed of tetrafluoroethylene and ethylene, Fluon ® ETFE Resins offer superior physical toughness and adaptability to meet the ranging needs of simple, high-quality, complicated and even high-performance products. The fluoropolymers maintain stable mechanical and... [See More]
- Industry: Electronics
- Filler: Unfilled
- Chemical System: Fluoropolymer
- Resins & Compounds: Pellets; MoldingCompound
from AGC Chemicals Americas, Inc.
PREMINOL has ultra-low monol content, high molecular weight ranging from 3,000-18,000, and a narrow molecular weight distribution. This provides good mechanical properties, high flexibility, good durability and good workability for coatings, adhesives, sealants, and elastomer applications. [See More]
- Industry: Automotive; Electronics; Repair or Construction
- Resins & Compounds: MoldingCompound
- Chemical System: Fluoropolymer
from DuPont Plastics, Polymers & Resins
Crastin ® HR5330HF is a 30% glass reinforced PBT with high flow (HF), moderately toughened, hydrolysis resistant (HR) resin. Excellent balance of properties between terminal pullout and impact resistance. Developed for USCAR Class 3 and 4 environments. DuPont ™ Crastin® PBT thermoplastic... [See More]
- Industry: Electronics
- Filler: Glass or FRP
- Chemical System: Thermoplastic Polyester (PET, PBT, etc.)
- Tensile Modulus: 1218
from Toray Industries (America), Inc.
Nylon resin is a typical engineering plastic that features superior toughness, heat-resistance, and oil-resistance. Used chiefly in automobile parts, connectors and other electronics components, and mechanical parts, AMILAN ® also finds application in packaging and construction materials. More... [See More]
- Industry: Automotive; Electronics; Repair or Construction
- Resins & Compounds: MoldingCompound
- Chemical System: Polyamide
from Rieke Metals, Inc.
Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Teknor Apex Company
Material Status. Commercial: Active. Availability. Africa & Middle East. Asia Pacific. Europe. Latin America. North America. Uses. Automotive Electronics. Insulation. Wire & Cable Applications. Wire Types. GPT. Agency Ratings. SAE J1128. RoHS Compliance. RoHS Compliant. Forms. Pellets [See More]
- Industry: Automotive; Electronics; Automotive Electronics, Insulation, Wire & Cable Applications
- Resins & Compounds: Pellets
- Chemical System: Vinyl / PVC
- Tensile (Break): 3150
from Idemitsu Chemicals USA Corporation
Offering the ability to comply with the most stringent U.L. 94 flammability requirements the Xarec EA products offer a cost effective means to take advantage of the value that a styrenic product can offer your electronic and electrical applications: superior electrical insulation & durability. A... [See More]
- Industry: Electronics; Electrical Power or High Voltage
- Filler: Glass or FRP
- Chemical System: Styrene or Polystyrene
- Resins & Compounds: Pellets; MoldingCompound
from 3M Advanced Materials Division
In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]
- Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Marine; Sanitary; Military; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Oil &Gas Exploration
- Chemical System: Tertrafluoroethylene, Hexafluoropropylene; Fluoropolymer; Polypropylene; Polyamide
- Type: Optical
- Filler: Unfilled
from Port Plastics, Inc.
Duratron ® PAI T5030 GF PAI Extruded is 30% glass-reinforced. It offers high rigidity, retention of stiffness, a low expansion rate and improved load carrying capabilities. This grade is well suited for applications in the electrical/electronic, business equipment, aircraft and aerospace... [See More]
- Industry: Aerospace; Electronics; Electrical/electronic, business equipment, aircraft and aerospace industries
- Chemical System: Polyamide-imide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyolefin
- Features: UL; Thermally Conductive
from Eastman Chemical Company
Eastar ™ GN120 Copolyester is a high flow product and contains a mold release. Other outstanding features of Eastar ™ GN120 are easily maintained such as excellent appearance and clarity, good physical properties, chemical resistance, and easy processing. Eastar ™ GN120 is for sale... [See More]
- Industry: Electronics
- Deflection Temperature: 140
- Chemical System: Thermoplastic Polyester (PET, PBT, etc.)
- Tensile (Break): 3481
from MCG - Performance Polymers Division
KEY FEATURES. Halogen free flame retardant. Low smoke. Flexible. Heat-resistant. Scratch-resistant. Silane and e-beam cross-linked solutions for enhanced properties. APPLICATIONS. TRANSPORTATION. Automotive wires, up to ISO 6722 class D (150 °C). Railway rolling stock and network equipment. [See More]
- Industry: Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Repair or Construction
- Features: Flame Retardant
from Ensinger North America
Ensinger TECARAN ABS is a terpolymer and an amorphous resin. It is manufactured by combining three different compounds. The three that make up TECARAN ABS are acrylonitrile, butadiene, and styrene. TECARAN ABS occupies the unique position of being a bridge between the commodity and other higher... [See More]
- Industry: Automotive; Electronics; Sanitary
- Deflection Temperature: 177 to 200
- Chemical System: ABS
- CTE: 56
from Fluoro-Plastics, Inc.
PTFE can be etched with a sodium ammonia or sodium naphthalene etch so that its surface is chemically modified for adhesion to various substrates using ordinary commercial grade epoxies. When etched for bonding, PTFE can be used as chute liners, vessel linings, and glued to processing surfaces to... [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Fluoropolymer
- Resins & Compounds: ExtrusionGrade
from EMS-GRIVORY America
Characteristics. Processing. Extrusion - cast film, Other Extrusion. Delivery form. Granules. Special Characteristics. Improved UV resistance (outdoor use), Improved heat resistance. Regional Availability. North America, Europe, Asia Pacific, South and Central America, Near East/Africa. Product... [See More]
- Industry: Automotive; Electronics
- Filler: Unfilled
- Chemical System: Polyamide
- Resins & Compounds: Pellets; FilmGrade; ExtrusionGrade
from DuPont Plastics, Polymers & Resins
The thermoplastic rubber that resists oil and heat. DuPont ™ ETPV 95A02HS BK001 is a thermoplastic rubber with excellent oil and heat resistance with additional heat stabilizer. It can be processed by thermoplastic processing techniques such as extrusion and blow molding. DuPont ™ ETPV... [See More]
- Industry: Electronics
- Elongation: 223.0
- Tensile (Break): 1958
- Dielectric Strength: 508
from Toray Industries (America), Inc.
TORAYCON ® PBT resin is a polyester-based thermoplastic resin developed by combining Toray's technological expertise in polyester polymerization and resin-reinforced composites. Featuring outstanding long-term heat-resistance, chemical-resistance, weather resistance and electrical... [See More]
- Industry: Automotive; Electronics
- Resins & Compounds: MoldingCompound
- Chemical System: Thermoplastic Polyester (PET, PBT, etc.)
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Teknor Apex Company
Material Status. Commercial: Active. Availability. Africa & Middle East. Asia Pacific. Europe. Latin America. North America. Uses. Appliance Wire Insulation. Appliance Wire Jacketing. Cable Jacketing. Connectors. Electrical/Electronic Applications. Flexible Cord Jacketing. Industrial Cable... [See More]
- Industry: Electronics; OEM or Industrial; Appliance Wire Insulation, Appliance Wire Jacketing, Cable Jacketing, Connectors, Electrical/Electronic, Flexible Cord Jacketing, Industrial Cable ..
- Tensile (Break): 2800
- Resins & Compounds: Pellets; ExtrusionGrade
- Melt Flow: 2.00
from Idemitsu Chemicals USA Corporation
Offering the ability to comply with the most stringent U.L. 94 flammability requirements the Xarec EA products offer a cost effective means to take advantage of the value that a styrenic product can offer your electronic and electrical applications: superior electrical insulation & durability. A... [See More]
- Industry: Electronics; Electrical Power or High Voltage
- Filler: Glass or FRP
- Chemical System: Styrene or Polystyrene
- Resins & Compounds: Pellets; MoldingCompound
from Port Plastics, Inc.
Duratron ® T5530 is 30% glass reinforced, compression molded PAI. It is ideal for higher load structural or electronic applications. This grade is similar in composition to Duratron ® 5030 PAI. It is selected for larger shapes or when the greatest degree of dimensional control is required. [See More]
- Industry: Electronics; Ideal for higher load structural or electronic applications
- Chemical System: Polyamide-imide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Features: UL; Thermally Conductive
from MCG - Performance Polymers Division
VINIKA ™ is the brand name for vinyl compounds, including soft (PVC-P) and rigid (PVC-U) solutions. The flexible PVC-P range includes phthalate and phenol free solutions with low VOC (Volatile Organic Content) and the rigid PVC-U line is lead free formulated. ENHANCED SOLUTIONS FOR SPECIFIC... [See More]
- Industry: Automotive; Electronics; Electrical Power or High Voltage; Repair or Construction; OEM or Industrial
- Resins & Compounds: ExtrusionGrade; MoldingCompound
- Chemical System: Vinyl / PVC
- Features: Flame Retardant; Anti-static or ESD Control
from Ensinger North America
Ensinger TECARAN ABS material is a terpolymer and an amorphous resin. It is manufactured by combining three different compounds. The three that make up TECARAN ABS are acrylonitrile, butadiene, and styrene. TECARAN ABS occupies the unique position of being a bridge between the general industrial and... [See More]
- Industry: Automotive; Electronics; Sanitary
- Deflection Temperature: 177 to 200
- Chemical System: ABS
- CTE: 56
from Fluoro-Plastics, Inc.
High percentage of bronze powder (40-60%) yields high thermal conductivity and better creep resistance. Often used in hydraulic systems, particularly superb as linear bearings, e.g. slides, gibs, guide ways. Not suited for electrical applications. Bronze is attacked by certain chemicals. Compare... [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Metal or MIM
- Chemical System: Fluoropolymer
- Tensile (Break): 2000 to 2500
from Toray Industries (America), Inc.
Toray's high-performance engineering plastic TORELINA ® resin boasts excellent heat resistance, flame retardancy and chemical resistance, physical strength, and its superb fluidity leads to outstanding dimensional precision. These characteristics make it ideal for a wide range of applications:... [See More]
- Industry: Automotive; Electronics
- Resins & Compounds: MoldingCompound
- Chemical System: Polyphenyline Sulfide
- Features: Flame Retardant
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Teknor Apex Company
Material Status. Commercial: Active. Availability. Africa & Middle East. Asia Pacific. Europe. Latin America. North America. Uses. Appliance Wire Insulation. Appliance Wire Jacketing. Cable Jacketing. Connectors. Electrical/Electronic Applications. Flexible Cord Jacketing. Industrial Cable... [See More]
- Industry: Electronics; OEM or Industrial; Appliance Wire Insulation, Appliance Wire Jacketing, Cable Jacketing, Connectors, Electrical/Electronic, Flexible Cord Jacketing, Industrial Cable ..
- Tensile (Break): 2800
- Resins & Compounds: Pellets; ExtrusionGrade
- Melt Flow: 2.00
from Idemitsu Chemicals USA Corporation
Material: Xarec EA533. Lower hydraulic pressure, better flow than PBT. Better dimensional stability than PBT. Faster cycle time than PBT. Better electrical durability than PBT. Application Requirements: UL 94 V0. Good dimensional stability. [See More]
- Industry: Electronics; Electrical Power or High Voltage
- Filler: Glass or FRP
- Chemical System: Styrene or Polystyrene
- Resins & Compounds: Pellets; MoldingCompound
from Port Plastics, Inc.
Semitron ® ESd 480 PEEK uses PEEK as a base resin. PEEK offers excellent properties in terms of wear resistance, low coefficient of friction and low coefficient of thermal expansion. As well PEEK provides excellent strength, stiffness, and excellent dimensional stability for electronics... [See More]
- Industry: Electronics; Provides excellent strength, stiffness, and excellent dimensional stability for electronics applications
- Filler: Carbon or Graphite
- Chemical System: PEEK
- Features: Anti-static or ESD Control
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Features: UL; Thermally Conductive
from MCG - Performance Polymers Division
TEFABLOC ™ incorporates several technologies including TPE-S, TPO, TPE-E, as well as the newly developed non-food bio based TPU. Its many possible properties can also be boosted in process by reactor or dynamic cross-linking. A well-matched combination of features will satisfy even your most... [See More]
- Industry: Automotive; Electronics; Electrical Power or High Voltage; Sanitary
- Features: Flame Retardant
- Resins & Compounds: ExtrusionGrade; MoldingCompound
from Ensinger North America
TECAPEEK CMF is a composite material based on Victrex ® PEEK 450G polymer, that is filled with ceramic. This materials has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often intricate designs necessary for parts such as test sockets,... [See More]
- Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
- Filler: Ceramic
- Chemical System: PEEK
- Deflection Temperature: 551 to 572
from Fluoro-Plastics, Inc.
Lower deformation under load. Higher compressive and flex modulus and increased hardness. Chemically inert –can be used in strong alkali and in HF, where glass reinforced compounds fail. Good initial wear and rubbing or sliding characteristics in both dry and water applications. Frequently... [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Carbon or Graphite
- Chemical System: Fluoropolymer
- Tensile (Break): 1000 to 1600
from Toray Industries (America), Inc.
TOYOLAC ® ABS resin has an attractive appearance, well-balanced physical properties, and excellent moldability. It is used in a wide range of applications, from office equipment such as photocopiers to interior and exterior automobile components, household electrical goods, and miscellaneous... [See More]
- Industry: Automotive; Electronics
- Resins & Compounds: MoldingCompound
- Chemical System: ABS
- Features: Anti-static or ESD Control
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Idemitsu Chemicals USA Corporation
Material: Xarec N WA 7020, WA212. Better property retention after USCAR 3 & 4 vs. PBT. Lower hydraulic pressure, better flow than PBT. Better dimensional stability than PBT. Faster cycle time than PBT. Application Requirements: USCAR 2, 3 or 4. Good dimensional stability. [See More]
- Industry: Automotive; Electronics
- Filler: Glass or FRP; Nylon
- Chemical System: Styrene or Polystyrene; Polyamide
- Resins & Compounds: Pellets; MoldingCompound
from Port Plastics, Inc.
Semitron ® ESd 490 HR PEEK uses PEEK as a base resin. PEEK offers excellent properties in terms of wear resistance, low coefficient of friction and low coefficient of thermal expansion. As well PEEK provides excellent strength, stiffness, and excellent dimensional stability for electronics... [See More]
- Industry: Electronics; Provides excellent strength, stiffness, and excellent dimensional stability for electronics applications
- Filler: Carbon or Graphite
- Chemical System: PEEK
- Features: Anti-static or ESD Control
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Features: UL; Thermally Conductive
from MCG - Performance Polymers Division
G-Polymer ™, which can be used to freely control crystallinity and the cohesive power of the noncrystalline part, is the next generation of vinyl alcohol resins. KEY FEATURES. OUTSTANDING TRANSPARENCY AND SOLVENT RESISTANCE. In addition to outstanding transparency and solvent resistance,... [See More]
- Industry: Electronics; Sanitary
- Resins & Compounds: FilmGrade; ExtrusionGrade
- Chemical System: Vinyl / PVC
from Ensinger North America
PPE GF30 is a special 30% glass fibre reinforced product which is manufactured by Ensinger under the trade name TECANYL GF30. In comparison to unfilled TECANYL, the glass filled modification demonstrates optimized properties in a number of areas. It has a high rigidity, high mechanical strength,... [See More]
- Industry: Automotive; Electronics; Electrical Power or High Voltage
- Filler: Glass or FRP
- Chemical System: Polyphenylene Ether (PPE)
- Thermal Conductivity: 0.2800
from Fluoro-Plastics, Inc.
Surf Technologies is a leader in the manufacture of heavy walled PTFE tube, both in standard inch sizes and in AWG sizes. Tube is used in fluid handling applications for high temperature acids and caustics or where contamination is an issue, such as in wire braided hose. In applications where PTFE's... [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Fluoropolymer
- Resins & Compounds: ExtrusionGrade
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Idemitsu Chemicals USA Corporation
Lower dielectric heating than PPS due to low dissipation factor. Easier processing than PPS. Lower cost than PPS. Application Requirements: Heat and chemical resistance. Dimensional stability for part flatness. [See More]
- Industry: Electronics; OEM or Industrial
- Filler: Glass or FRP
- Chemical System: Styrene or Polystyrene
- Resins & Compounds: Pellets; MoldingCompound
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyolefin
- Features: UL; Thermally Conductive
from Ensinger North America
#8203;TECANYL PPE black, (made with Noryl ® EN265) due to its inherent chemical composition, exhibits unusually low moisture absorption. Therefore, good electrical insulating properties are realized over a wide range of humidity and temperature conditions. Chemical attack from water, most salt... [See More]
- Industry: Automotive; Electronics; Electrical Power or High Voltage; Sanitary
- Filler: Glass or FRP
- Chemical System: Polyphenylene Oxide
- Deflection Temperature: 254 to 279
from Fluoro-Plastics, Inc.
Most widely used filler in various percentages (5%, 10%, 15% and 25%). Improves creep resistance, both at low and high temperatures. Chemically stable (except for strong alkalis and hydrofluoric acid (HF). Little effect on the electrical properties of PTFE, and improves wear and friction behavior. [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Glass or FRP
- Chemical System: Fluoropolymer
- Resins & Compounds: ExtrusionGrade
from Rieke Metals, Inc.
Poly(3-decylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Features: Thermally Conductive
from Ensinger North America
#8203;Offering a level of performance above polysulfones, Ensinger's industrial grade TECASON P has increased temperature, impact and chemical resistance properties, as well as excellent resistance to repeated steam sterilization (autoclave) cycles. Main Features: High strength. High thermal and... [See More]
- Industry: Electronics; Sanitary
- Deflection Temperature: 405
- Chemical System: Polyphenylsulfone
- Thermal Conductivity: 0.2510
from Fluoro-Plastics, Inc.
Adds to hardness and stiffness. Reduces friction, especially starting coefficient of friction and steady-state wear. Effect on electrical properties is negligible. Unreactive chemically, and dissolves only in strong oxidizing acids [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Glass or FRP
- Chemical System: Fluoropolymer
- Tensile (Break): 2500 to 3000
from Rieke Metals, Inc.
Poly(3-dodecylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / <... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide; Polyimide
- Features: UL; Thermally Conductive
from Ensinger North America
DELRIN 511P is another Homopolymer acetal from DuPont that offers enhanced crystallization characteristics. This higher level of crystallization helps to augment aspects of the physical properties such as fatigue strength, stiffness, and creep resistance. Main Features: Good Machinability. High... [See More]
- Industry: Automotive; Electronics; Sanitary; Repair or Construction; OEM or Industrial
- Deflection Temperature: 325
- Chemical System: Acetal or Polyoxymethylene (POM)
- CTE: 68
from Fluoro-Plastics, Inc.
Crystalline modification of high purity carbon. Excellent wear properties, particularly against soft metals. High load-carrying capability in high speed contact applications. Chemically inert. Frequently used with other filler, e.g. carbon [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Carbon or Graphite
- Chemical System: Fluoropolymer
- Tensile (Break): 2400 to 2600
from Rieke Metals, Inc.
poly(3-butylthiophene-2,5-diyl ),regiorandom [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Ensinger North America
Delrin 150 black is a homopolymer acetal material that is manufactured by Ensinger (using black DuPont ™ Delrin ® resin) and sold under the tradename TECAFORM AD black. Delrin 150 black exhibits a high melting point and high strength, but is sensitive to hydrolysis with continuous exposure... [See More]
- Industry: Automotive; Electronics; Repair or Construction; OEM or Industrial
- Deflection Temperature: 208
- Chemical System: Acetal or Polyoxymethylene (POM)
- Tensile Modulus: 350
from Fluoro-Plastics, Inc.
PTFE with FDA compliant filler. For food processing and pharmaceutical bearing applications. Compatible with a wide variety of mating surfaces, both soft (e.g. mild steel) and harder surfaces. Compare this product to Rulon 641* [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Mineral or Inorganic
- Chemical System: Fluoropolymer
from Rieke Metals, Inc.
poly(3-hexylthiophene-2,5-diyl ),regiorandom [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Ensinger North America
TECAPEI black Ultem is a polyetherimide material with high mechanical strength and rigidity, that is also known for its good electrical properties. This material has a remarkably high creep resistance over a wide range of temperatures and furthermore, polyetherimides have a high permanent operating... [See More]
- Industry: Aerospace; Automotive; Electronics; Sanitary; Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Polyetherimide
- Deflection Temperature: 394
from Fluoro-Plastics, Inc.
Low Friction. Extremely low wear. Increased hardness. Operates well against soft mating surfaces like aluminum, mild steel, brass and plastics. Ideal for stop-start applications to eliminate stick-slip. Compare this product to Rulon J* [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Mineral or Inorganic
- Chemical System: Fluoropolymer
from Rieke Metals, Inc.
poly(3-octylthiophene-2,5-diyl ),regiorandom [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Ensinger North America
TECAPEI natural (PEI) is an unreinforced polyetherimide, suitable for contact with foods, that exhibits high mechanical strength and rigidity. The characteristic profile includes very good hydrolysis resistance, and dimensional stability, combined with a relatively high long term service... [See More]
- Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Polyetherimide
- Deflection Temperature: 394 to 410
from Fluoro-Plastics, Inc.
Molded plate is available in thicknesses from 3/8ths of an inch up to four inches. Plate is inventoried in sizes from one-foot square to four feet square (sixteen square feet per sheet). Thickness tolerances range from plus .038" to minus .019" for 3/8th ” plate, up to plus .087", minus .043"... [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Fluoropolymer
- Resins & Compounds: ExtrusionGrade
from Rieke Metals, Inc.
poly(3-decylthiophene-2,5-diyl ),regiorandom [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Ensinger North America
TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]
- Industry: Aerospace; Electronics; Sanitary; Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Polyimide
- Deflection Temperature: 600
from Fluoro-Plastics, Inc.
Rod is available in both virgin grades and reprocessed (mechanical) for less demanding applications. Surf Technologies extrudes rod in all standard sizes from 1/8th inch diameter up to 4 inches in diameter. Rod is inventoried in twelve foot lengths so it can be cut into six foot lengths (UPS... [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Fluoropolymer
- Resins & Compounds: ExtrusionGrade
from Rieke Metals, Inc.
poly(3-dodecylthiophene-2,5-diyl ),regiorandom [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Ensinger North America
TECASON S - PSU - is a transparent engineering plastic known for its chemical resistance, rigidity, and high-temperature performance. The polysulfone material's ability to operate in an autoclave environment while maintaining its excellent mechanical properties over a wide range of temperatures is... [See More]
- Industry: Electronics; Sanitary; Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Polysulphone
- Deflection Temperature: 345 to 358
from Fluoro-Plastics, Inc.
Skived sheet can be made in any thickness from 15 mils up to .250 inches. Fluoro-Plastics technology makes it possible to make in-between sizes. Thickness tolerances range from .0005 for sizes from .002" thick to .005" thick up to .003" tolerance for material that is over .060" thick. Skived sheet... [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Unfilled
- Chemical System: Fluoropolymer
- Resins & Compounds: ExtrusionGrade
from Rieke Metals, Inc.
polythiophene-2,5-diyl. Please contact us at sales@riekemetals.com for ordering and bulk pricing. Our products are available in an electronic database in either .db or .sd formats. Highly regioregular (98.5% or higher) as well as the regiorandom (1:1:1:1) poly(3-alkylthiophene-2,5-diyl) polymers... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Ensinger North America
TECAPAI CM XP403 green is a compression molded Torlon ® plastic material that is unreinforced and delivers an excellent combination of physical properties. Made from Solvay Torlon ® powder, this PAI material offers excellent ductility and toughness as well as good strength and stiffness at... [See More]
- Industry: Aerospace; Electronics
- Deflection Temperature: 494
- Chemical System: Polyamide-imide
- CTE: 22
from Fluoro-Plastics, Inc.
Extremely stiff and hard. High loading percentage (50% generally). Available in molded sheet only [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
- Filler: Metal or MIM
- Chemical System: Fluoropolymer
- Tensile (Break): 2500
from Rieke Metals, Inc.
Poly(3-pentylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly(3-heptylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly[3-(ethyl-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly[3-(potassium-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly[3-(potassium-5-pentanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly[3-(ethyl-5-pentanoate)thiophene-2,5-diyl],Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly[3-(potassium -6-hexanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly[3-(ethyl-6-hexanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly[3-(potassium-7-heptanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly[3-(ethyl-7-heptanoate)thiophene2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly [3-(3-carboxypropyl)thiophene-2,5-diyl] regioregular [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound
from Rieke Metals, Inc.
Poly [3-(4-carboxybutyl)thiophene-2,5-diyl] regioregular [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Resins & Compounds: Liquid
- Filler: Unfilled
- Features: Electrically Conductive Compound