Unfilled Thermoplastics and Thermoplastic Resins
from APSX, LLC
Celcon M270 is Acetal Copolymer designed for superior moldability or hard to fill mold applications. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Acetal or Polyoxymethylene (POM)
- Tensile (Break): 9717
from Duvelco Limited
Ducoya® G001 is a remarkable material with unparalleled physical strength, elongation and toughness. Ducoya G001 can also continuously operate over a wide temperature range from near absolute zero to greater than 400°C in a favorable chemical environment. Its excellent electrical and thermal... [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets
- Chemical System: Polyimide
- Industry: Aerospace; Semiconductors or IC Packaging
from AGC Chemicals Americas, Inc.
CYTOP ™ amorphous fluoropolymers have the same excellent chemical, thermal, electrical and surface properties as conventional fluoropolymers like PTFEs, but also exhibit high optical transparency and good solubility in specific fluorinated solvents. CYTOP fluoropolymers are like transparent... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: Fluoropolymer
- Industry: Electronics; Semiconductors or IC Packaging; Optical Film, Antifouling Coatings for Photomasks
from Victrex PLC
High performance thermoplastic material, unreinforced Poly Ether Ether Ketone (PEEK), semi crystalline, coarse powder for extrusion compounding, easy flow, FDA food contact compliant, color natural. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; ExtrusionGrade; MoldingCompound
- Chemical System: PEEK
- Features: Flame Retardant; UL
from APSX, LLC
Delrin 900P BK602 is Acetal Homopolymer with low viscosity and improved processing. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Acetal or Polyoxymethylene (POM)
- Tensile (Break): 10153
from Duvelco Limited
Ducoya® G001 UP is an ultra-pure polyimide for semiconductors. The material is intended for use in the latest semiconductor manufacturing operations where feature sizes can be found in the low nanometer range. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets
- Chemical System: Polyimide
- Industry: Semiconductors or IC Packaging
from AGC Chemicals Americas, Inc.
AGC Fluor compounds Group has developed the next generation of non-conductive and anti-static compounds made with our Fluon ETFE based on the needs of our customers and OEMs. Improved adhesion, excellent conductivity levels, high temperature performance and a reliable supply chain are part of the... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: Fluoropolymer
- Features: Anti-static or ESD Control
from APSX, LLC
It is good as a purging material. HDPE is also used in the production of plastic bottles, corrosion-resistant piping and plastic lumber [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyethylene
- Tensile Modulus: 152
from AGC Chemicals Americas, Inc.
Melt processable copolymers composed of tetrafluoroethylene and ethylene, Fluon ® ETFE Resins offer superior physical toughness and adaptability to meet the ranging needs of simple, high-quality, complicated and even high-performance products. The fluoropolymers maintain stable mechanical and... [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Fluoropolymer
- Features: Flame Retardant; UL; Electrically Conductive Compound
from APSX, LLC
ALATHON H5234 is high flow injection molding grade for fast cycle and thin wall molding. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyethylene
- Deflection Temperature: 156
from AGC Chemicals Americas, Inc.
Highly cost-effective materials, Fluon ® PTFE (Polytetrafluoroethylene) Resins are the most widely used fluoropolymers found in many areas of modern life. Resin properties keep insulation thickness to a minimum while tolerating a wider range of temperatures (-180 °C to 260 °C) than other... [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets
- Chemical System: Fluoropolymer
- Features: Thermal Insulation
from APSX, LLC
Zytel 101L is an easy flowing, lubricated resin for injection molding. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyamide
- Tensile Modulus: 450
from AGC Chemicals Americas, Inc.
Copolymers of tetrafluoroethylene and a perfluorinated vinyl ether, Fluon ® PFA Resins can be used over a wide range of temperatures from extremely low to high (-200 °C to 260 °C) without losing excellent chemical, electrical, mechanical and surface properties. PFA resins retain many... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: Fluoropolymer
- Tensile (Break): 5655
from APSX, LLC
LEXAN HF1130 PC is UV-stabilized and has good clarity, heat resistance and dimensional stability. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polycarbonate
- Tensile (Break): 8992
from APSX, LLC
Polypropylene (PP) is a common thermoplastic resin typically used for injection molding applications. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polypropylene
from APSX, LLC
Polypropylene (PP) is a common thermoplastic resin typically used for injection molding applications. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polypropylene
from APSX, LLC
Pro-fax SG702 high flow, high impact Polypropylene (PP) copolymer resin is designed for injection molding applications. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polypropylene
- Melt Flow: 18.00
from APSX, LLC
Total Energies PP 4820WZ high melt flow, high impact resistance, excellent antistatic Polypropylene (PP) impact copolymer resin is designed for injection molding applications. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polypropylene
- Deflection Temperature: 212
from APSX, LLC
COPYLENE CM500LN Polypropylene (PP) is a high melt flow, medium impact PP copolymer designed for injection molding. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polypropylene
- Tensile (Break): 3002
from APSX, LLC
TOTAL 4720WZ is for injection molding of garden furniture, housewares and thin-walled articles [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polypropylene
- Deflection Temperature: 194
from APSX, LLC
Dynaflex G7980-9001-02 is designed for FDA compliance applications with rubbery feel and soft touch. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyethylene
- Tensile (Break): 980
from APSX, LLC
Hifax TRC 770P MX PK81 is designed for large automotive exterior applications for excellent part appearance. [See More]
- Filler: Unfilled
- Deflection Temperature: 257
- Resins & Compounds: Pellets; MoldingCompound
- Tensile Modulus: 232
from Ensinger North America
Medical PEEK natural is suitable for use in medical applications and combines the excellent property profile of standard PEEK with requirements for biocompatibility. Victrex ® PEEK polymer is used for these materials and processed in compliance with the relevant product quality requirements for... [See More]
- Filler: Unfilled
- Features: BioMedical
- Chemical System: PEEK
- Industry: Sanitary
from Plasco Inc.
PLASCO INC. 2829 SO. RODEO GULCH RD. #4. PLASCO DATA SHEET. SOQUEL, CA., 95073. TYPICAL PROPERTIES. 831-464-1111 831-464-1100 (FAX). MATERIAL: P-T3000DB. GENERIC: ABS BK. ASTM TEST METHODS. VALUE. SPECIFIC GRAVITY: D-792 g/cm3. 1.03. WATER ABSORPTION: D-570 24hrs %. MOLD SHRINK FLOW: D-955 in/in. [See More]
- Filler: Unfilled
- Tensile (Break): 5810
- Chemical System: ABS
- Tensile Modulus: 280
from 3M Advanced Materials Division
In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]
- Filler: Unfilled
- Chemical System: Tertrafluoroethylene, Hexafluoropropylene; Fluoropolymer; Polypropylene; Polyamide
- Type: Optical
- Resins & Compounds: Pellets; Liquid; FilmGrade; ExtrusionGrade; MoldingCompound
from Fluoro-Plastics, Inc.
PTFE can be etched with a sodium ammonia or sodium naphthalene etch so that its surface is chemically modified for adhesion to various substrates using ordinary commercial grade epoxies. When etched for bonding, PTFE can be used as chute liners, vessel linings, and glued to processing surfaces to... [See More]
- Filler: Unfilled
- Resins & Compounds: ExtrusionGrade
- Chemical System: Fluoropolymer
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
from Celanese Corporation
Celanese Acetate is the one of the largest manufacturers of cellulose acetate flake. HB-105 is a fiber-grade diacetate flake used primarily for our filter tow and Clarifoil® solvent cast film.VersatileManufactured by acetylation of cellulose acetate, flake can be converted into a wide range of... [See More]
- Filler: Unfilled
from Chi Mei Corporation
Chimei's thermoplastic rubber is a copolymerization of Styrene, butadiene, and styrene. Its segmented and radial molecular structure allows it to have the same flexible and physical properties of general rubber without the vulcanization process. Its middle segment is similar to rubber and has... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: Styrene Copolymer
- Industry: Asphalt modification / adhesives / shoe soles / industrial products / road surfaces
from Polyplastics USA, Inc.
POM is an acronym for the chemical name polyoxymethylene. It is generally referred to as polyacetal or acetal resin. It is a crystalline thermoplastic resin comprised chiefly of (-CH2O-) structural units. The two types of POM are homopolymer, which is comprised of a polyoxymethylene molecular chain... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: Acetal or Polyoxymethylene (POM)
- Deflection Temperature: 176
from EMS-GRIVORY America
Characteristics. Processing. Extrusion - cast film, Other Extrusion. Delivery form. Granules. Special Characteristics. Improved UV resistance (outdoor use), Improved heat resistance. Regional Availability. North America, Europe, Asia Pacific, South and Central America, Near East/Africa. Product... [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; FilmGrade; ExtrusionGrade
- Chemical System: Polyamide
- Industry: Automotive; Electronics
from Kraton Polymers LLC
The Kraton D SBS family of polymers is versatile with a combination of high strength, wide range of hardness, and low viscosity for easy thermoplastic melt processing or processing in solution. The SBS block copolymers are composed of blocks of styrene and butadiene. It is the material of choice for... [See More]
- Filler: Unfilled
- Industry: Sanitary; Adhesives, Sealant & Coatings, Bitumen Mod., Compounding & Personal Hygiene, Footwear, Impact Mod., Roads & Roofing, Pack. & Polymod, Personal Care
- Chemical System: Styrene Copolymer
- Melt Flow: 20.00
from Rieke Metals, Inc.
Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Nylatech, Inc.
Nylatech Nythane is chemically formulated copolymer designed to offer an engineering material with the High Tensile and Compressive properties of Cast Nylon, with the impact and wear resistance of polyurethane. Offered in 3 specific grades, Nylatech ® Nythane has proven successful for the most... [See More]
- Filler: Unfilled
- Resins & Compounds: CastingResin
- Chemical System: Polyamide
- Industry: OEM or Industrial
from Ensinger North America
This beige compression molded material is an unfilled Victrex ® PEEK polymer available in rods, tubes and plates. Main Features: Excellent chemical resistance. Hydrolysis and superheated steam resistant. Excellent mechanical properties. Easy to machine. High continuous use temperature. Good... [See More]
- Filler: Unfilled
- Industry: Sanitary; Semiconductors or IC Packaging
- Chemical System: PEEK
- Deflection Temperature: 300
from Fluoro-Plastics, Inc.
Surf Technologies is a leader in the manufacture of heavy walled PTFE tube, both in standard inch sizes and in AWG sizes. Tube is used in fluid handling applications for high temperature acids and caustics or where contamination is an issue, such as in wire braided hose. In applications where PTFE's... [See More]
- Filler: Unfilled
- Resins & Compounds: ExtrusionGrade
- Chemical System: Fluoropolymer
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
from Celanese Corporation
Celanese Acetate brings more than 40 years of experience to acetate tow production. Cellulose acetate tow is made from acetate flake and is clean, soft, odorless and tasteless. Derived from highly purified wood pulp from re-forested trees, it is a natural and environmentally friendly product. [See More]
- Filler: Unfilled
from Chi Mei Corporation
ABS is a copolymerization of styrene, acrylonitrile, and butadiene latex. Its heat and solvent resistance properties are better than HIPS and it has gloss characteristics. Because acrylonitrile has stronger nitrile polarity, it can enhance the interaction of the PS in the molecular chain. Therefore,... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: ABS
- Industry: Telephone casings / lamp seats / toys / office supplies / clock casings / buttons for household appliances
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Ensinger North America
Polyetheretherketone (PEEK) - TECAPEEK natural is a high performance, high temperature, semi crystalline thermoplastic manufactured by Ensinger and may use Victrex ® PEEK 450G or Solvay Ketaspire ® KT-820 polymer. The most well known and important member of the polyaryletherketone group... [See More]
- Filler: Unfilled
- Industry: Aerospace; Automotive; Sanitary; OEM or Industrial
- Chemical System: PEEK
- Deflection Temperature: 320
from Fluoro-Plastics, Inc.
Molded plate is available in thicknesses from 3/8ths of an inch up to four inches. Plate is inventoried in sizes from one-foot square to four feet square (sixteen square feet per sheet). Thickness tolerances range from plus .038" to minus .019" for 3/8th ” plate, up to plus .087", minus .043"... [See More]
- Filler: Unfilled
- Resins & Compounds: ExtrusionGrade
- Chemical System: Fluoropolymer
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
from Celanese Corporation
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Filler: Unfilled
- Features: UL
- Resins & Compounds: MoldingCompound
- Use Temperature: 248 to 266
from Chi Mei Corporation
To make transparency, we add an third element to adjust the refractive index of ABS and rubber matrix to be in consistency. Base on our exclusive technique, we developed transparent MABS PA-758, which demonstrates beautiful/stable color, good flowability and transparency. It is suitable to... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: ABS
- Industry: Air conditioning panels / wash machine covers / vacuum cleaner casings / 3c product casings / household appliances / stationery
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Ensinger North America
TECAPEI black Ultem is a polyetherimide material with high mechanical strength and rigidity, that is also known for its good electrical properties. This material has a remarkably high creep resistance over a wide range of temperatures and furthermore, polyetherimides have a high permanent operating... [See More]
- Filler: Unfilled
- Industry: Aerospace; Automotive; Electronics; Sanitary; Semiconductors or IC Packaging
- Chemical System: Polyetherimide
- Deflection Temperature: 394
from Fluoro-Plastics, Inc.
Rod is available in both virgin grades and reprocessed (mechanical) for less demanding applications. Surf Technologies extrudes rod in all standard sizes from 1/8th inch diameter up to 4 inches in diameter. Rod is inventoried in twelve foot lengths so it can be cut into six foot lengths (UPS... [See More]
- Filler: Unfilled
- Resins & Compounds: ExtrusionGrade
- Chemical System: Fluoropolymer
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
from Celanese Corporation
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Filler: Unfilled
- Features: UL
- Resins & Compounds: MoldingCompound
- Use Temperature: 248 to 266
from Chi Mei Corporation
This solid polymer is formed by heat polymerization of styrene monomer. This product is referred to as the general purpose polystyrene, also known as hard plastic. Generally speaking, general purpose polystyrene has the advantages of being bright, lightweight, transparent, low cost, etc. In... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: Styrene or Polystyrene
- Industry: TPE modifier can increase the hardness of the molded products
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Ensinger North America
TECAPEI natural (PEI) is an unreinforced polyetherimide, suitable for contact with foods, that exhibits high mechanical strength and rigidity. The characteristic profile includes very good hydrolysis resistance, and dimensional stability, combined with a relatively high long term service... [See More]
- Filler: Unfilled
- Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Semiconductors or IC Packaging
- Chemical System: Polyetherimide
- Deflection Temperature: 394 to 410
from Fluoro-Plastics, Inc.
Skived sheet can be made in any thickness from 15 mils up to .250 inches. Fluoro-Plastics technology makes it possible to make in-between sizes. Thickness tolerances range from .0005 for sizes from .002" thick to .005" thick up to .003" tolerance for material that is over .060" thick. Skived sheet... [See More]
- Filler: Unfilled
- Resins & Compounds: ExtrusionGrade
- Chemical System: Fluoropolymer
- Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
from Celanese Corporation
Long residence time needs to be avoided. Barrel zone temperatures may need to be lowered to maintain a proper melt temperature.. Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying may be necessary to... [See More]
- Filler: Unfilled
- Use Temperature: 176 to 212
- Resins & Compounds: Pellets; MoldingCompound
from Chi Mei Corporation
WONDERLITE ® is a polycarbonate resin polymerized using the double hydroxy compounds of BPA (bisphenol-A) and the diphenylcarbonates of carbonate compounds with the transesterification (melting) method. Absolutely no phosgene and chlorinated solvents such as dichloromethane were used during the... [See More]
- Filler: Unfilled
- Resins & Compounds: MoldingCompound
- Chemical System: Polycarbonate
- Industry: Sheet-extrusion / goggles / helmet visors
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Ensinger North America
Polyamide 66 has good rigidity, hardness, abrasion resistance and thermal dimensional stability. In addition, nylon 66 has outstanding wear resistance and low frictional properties. It also has very good temperature, chemical, and impact properties. Users should be aware of PA 66 propensity to... [See More]
- Filler: Unfilled
- Industry: Automotive; Sanitary; Repair or Construction; OEM or Industrial
- Chemical System: Polyamide
- Deflection Temperature: 194 to 450
from Celanese Corporation
Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying may be necessary to prevent splay and odor problems. [See More]
- Filler: Unfilled
- Use Temperature: 176 to 212
- Resins & Compounds: Pellets; ExtrusionGrade; MoldingCompound
from Rieke Metals, Inc.
Poly(3-decylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Ensinger North America
Due to its low level of crystallinity, Ensinger's polycarbonate, marketed as TECANAT natural, has a high level of transparency. The unmodified PC is characterized by high strength, rigidity and hardness, as well as good impact strength. However, as is the case with all amorphous thermoplastics,... [See More]
- Filler: Unfilled
- Industry: Aerospace; Sanitary
- Chemical System: Polycarbonate
- Deflection Temperature: 270 to 280
from Celanese Corporation
Assessment of mechanical values using an injection molding machine with dedicated screw. Impelementation: Feb. 2010. It is normally not necessary to dry CELSTRAN PP. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A... [See More]
- Filler: Unfilled
- Use Temperature: 194 to 212
- Resins & Compounds: ExtrusionGrade; MoldingCompound
- Elongation: 2.0
from Rieke Metals, Inc.
Poly(3-dodecylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / <... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Ensinger North America
TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]
- Filler: Unfilled
- Industry: Aerospace; Electronics; Sanitary; Semiconductors or IC Packaging
- Chemical System: Polyimide
- Deflection Temperature: 600
from Celanese Corporation
Assessment of mechanical values using an injection molding machine with dedicated screw. Implementation: Feb. 2010. It is normally not necessary to dry CELSTRAN PP. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A... [See More]
- Filler: Unfilled
- Use Temperature: 194 to 212
- Resins & Compounds: MoldingCompound
- Elongation: 2.2
from Rieke Metals, Inc.
poly(3-butylthiophene-2,5-diyl ),regiorandom [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Ensinger North America
Polyphenylenesulphide (PPS) - TECATRON - is a semi crystalline, high temperature thermoplastic. Due to its chemical structure, PPS is a very resistant polymer with high mechanical strength and rigidity, even at temperatures above 392 °F. In addition to the low water absorption, PPS also shows... [See More]
- Filler: Unfilled
- Industry: Electrical Power or High Voltage; Sanitary
- Chemical System: Polyphenylenesulphide
- Deflection Temperature: 220 to 400
from Celanese Corporation
FORTRON should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 30 ° C. The time between drying and processing should be as short as possible. [See More]
- Filler: Unfilled
- Use Temperature: 230 to 248
- Resins & Compounds: MoldingCompound
- Deflection Temperature: 220
from Rieke Metals, Inc.
poly(3-hexylthiophene-2,5-diyl ),regiorandom [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Ensinger North America
TECASON S - PSU - is a transparent engineering plastic known for its chemical resistance, rigidity, and high-temperature performance. The polysulfone material's ability to operate in an autoclave environment while maintaining its excellent mechanical properties over a wide range of temperatures is... [See More]
- Filler: Unfilled
- Industry: Electronics; Sanitary; Semiconductors or IC Packaging
- Chemical System: Polysulphone
- Deflection Temperature: 345 to 358
from Celanese Corporation
Polymer Resin [See More]
- Filler: Unfilled
- Use Temperature: 34
- Resins & Compounds: MoldingCompound
from Rieke Metals, Inc.
poly(3-octylthiophene-2,5-diyl ),regiorandom [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
Not for Injection Molding. For Compression Molding and Pressureless Sintering only. See Ticona for processing.. Not for Injection Molding. For Compression Molding and Pressureless Sintering only. See Ticona for processing. [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
- Chemical System: Polyethylene
- Dielectric Constant: 3
from Rieke Metals, Inc.
poly(3-decylthiophene-2,5-diyl ),regiorandom [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
Drying is not normally required. If material has come in contact with moisture through improper storage or handling or through regrind use, drying may be necessary to prevent splay and odor problems. [See More]
- Filler: Unfilled
- Use Temperature: 176 to 212
- Resins & Compounds: MoldingCompound
from Rieke Metals, Inc.
poly(3-dodecylthiophene-2,5-diyl ),regiorandom [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
Polymer Resin [See More]
- Filler: Unfilled
- Use Temperature: 248 to 284
- Resins & Compounds: MoldingCompound
- Water Absorption: 0.6500
from Rieke Metals, Inc.
polythiophene-2,5-diyl. Please contact us at sales@riekemetals.com for ordering and bulk pricing. Our products are available in an electronic database in either .db or .sd formats. Highly regioregular (98.5% or higher) as well as the regiorandom (1:1:1:1) poly(3-alkylthiophene-2,5-diyl) polymers... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
IMPET should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 30 ° C. The time between drying and processing should be as short as possible. [See More]
- Filler: Unfilled
- Use Temperature: 248 to 284
- Resins & Compounds: MoldingCompound
from Rieke Metals, Inc.
Poly(3-pentylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
Combine the look of metal and the design freedom of plastic with Ticona's MetaLX ™ metal-effect polymers. Hostaform® POM, Celanex® PBT and Riteflex® TPC ET allow companies to navigate between appealing designs that will attract customers, and lower costs that will maximize profit... [See More]
- Filler: Unfilled
- Resins & Compounds: Pellets; MoldingCompound
from Rieke Metals, Inc.
Poly(3-heptylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
To avoid hydrolytic degradation during processing, Riteflex resins have to be dried to a moisture level equal to or less than 0.05%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 225 °F (107 °C) for 4 hours. [See More]
- Filler: Unfilled
- Use Temperature: 212 to 230
- Resins & Compounds: MoldingCompound
- Melt Flow: 7.00
from Rieke Metals, Inc.
Poly[3-(ethyl-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
Polymer Resin [See More]
- Filler: Unfilled
- Use Temperature: 203 to ?
- Resins & Compounds: MoldingCompound
from Rieke Metals, Inc.
Poly[3-(potassium-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
To avoid hydrolytic degradation during processing, Vandar resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Filler: Unfilled
- Features: UL
- Resins & Compounds: MoldingCompound
- Use Temperature: 248 to 266
from Rieke Metals, Inc.
Poly[3-(potassium-5-pentanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
When using short metering strokes an accumulator is recommended to get short injection times. VECTRA should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 40 ° C. The time between... [See More]
- Filler: Unfilled
- Use Temperature: 302
- Resins & Compounds: MoldingCompound
from Rieke Metals, Inc.
Poly[3-(ethyl-5-pentanoate)thiophene-2,5-diyl],Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
When using short metering strokes an accumulator is recommended to get short injection times. VECTRA should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 40 ° C. The time between... [See More]
- Filler: Unfilled
- Use Temperature: 302
- Resins & Compounds: MoldingCompound
from Rieke Metals, Inc.
Poly[3-(potassium -6-hexanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Celanese Corporation
Polymer Resin [See More]
- Filler: Unfilled
- Features: UL
- Resins & Compounds: MoldingCompound
- Use Temperature: 302
from Rieke Metals, Inc.
Poly[3-(ethyl-6-hexanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly[3-(potassium-7-heptanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly[3-(ethyl-7-heptanoate)thiophene2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly [3-(3-carboxypropyl)thiophene-2,5-diyl] regioregular [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly [3-(4-carboxybutyl)thiophene-2,5-diyl] regioregular [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging