Liquid Thermoplastics and Thermoplastic Resins
from 3M Advanced Materials Division
In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]
- Type: Optical
- Filler: Unfilled
- Chemical System: Tertrafluoroethylene, Hexafluoropropylene; Fluoropolymer; Polypropylene; Polyamide
- Resins & Compounds: Pellets; Liquid; FilmGrade; ExtrusionGrade; MoldingCompound
from Rieke Metals, Inc.
Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Performance Polymers Group
The ChronoFlex AR and ChronoFlex AR-LT product lines are polycarbonate urethanes designed for molding, casting and dip coating applications. These unique materials are fully synthesized in liquid providing superior strength & elongation while maintaining the inherent polycarbonate advantage of... [See More]
- Chemical System: Polycarbonate; Polyurethane
- Features: BioMedical
- Resins & Compounds: Liquid; CastingResin; MoldingCompound
- Industry: Sanitary
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly(3-decylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
Poly(3-dodecylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / <... [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
poly(3-butylthiophene-2,5-diyl ),regiorandom [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
poly(3-hexylthiophene-2,5-diyl ),regiorandom [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging
from Rieke Metals, Inc.
poly(3-octylthiophene-2,5-diyl ),regiorandom [See More]
- Filler: Unfilled
- Features: Electrically Conductive Compound
- Resins & Compounds: Liquid
- Industry: Electronics; Semiconductors or IC Packaging