Gold Plating Plating Chemicals and Anodizing Chemicals

Electroless Nickel Palladium Immersion Gold Plating Chemicals -- Affinity ENEPIG 2.0
from MacDermid Alpha Electronics Solutions

MacDermid Enthone's Affinity ENEPIG is the latest electroless nickel/electroless palladium/immersion gold plating process designed specifically to deliver a high reliability wire bondabale surface finish with high yields. By combining the advances of Affinity ENIG and a stable palladium plating... [See More]

  • Chemical / Composition: Gold Plating; Hard Nickel Plating
Portfolio of Metallization Processes for Molded Circuitry -- MID Series Metallization
from MacDermid Alpha Electronics Solutions

Our MID plating solutions are specifically designed and optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. From electroless copper, to surface finishes for a wide range of applications, we... [See More]

  • Chemical / Composition: Copper Plating; Gold Plating; Hard Nickel Plating; Platinum Plating; Silver Plating; Electroless
Cobalt Hardened Flash Gold Plating Process -- Techni Gold® Flash 950
from Technic, Inc.

Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys. [See More]

  • Chemical / Composition: Gold Plating
Elevate® AuSn 8020
from Technic, Inc.

Gold-tin alloy plating process that produces alloy ranges from 75 – 82% gold content with a corresponding melting point of 280 °C – 320 °C. Optimum gold-tin alloys are produced from a one-step, single bath process. [See More]

  • Chemical / Composition: Gold Plating; Tin Plating
Elevate® Gold 7934
from Technic, Inc.

A cyanide based electrolytic gold plating process that produces a deposit that exhibits excellent functional performance such as wire bonding and solderability from a very stable and simple to operate solution. [See More]

  • Chemical / Composition: Gold Plating
Elevate® Gold 7990
from Technic, Inc.

Electrolytic sulfite gold process that produces pure, soft gold deposits. Operates at an acidic pH, making it compatible with almost all photoresists. Elevate Gold 7990 produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. Provides excellent coplanarity and... [See More]

  • Chemical / Composition: Gold Plating
Orosene 80RC
from Technic, Inc.

Orosene 80RC is the industry standard colbalt brightened acid gold process. The deposit meets the requirements for type I and II, gradeC, of ASTM B488-01. The solution is compatible with aqueous dry film and can be utilized in high speed or rack plating operations. The Orosene 80RC operates in a... [See More]

  • Chemical / Composition: Gold Plating
Orosene 990HS
from Technic, Inc.

Orosene 990 HS is a high speed, high efficiency hard gold formulation that mini- mizes hydrogen evolution and provides improved edge adhesion on dry film resists. It has a stable and controllable electrolyte designed to produce a deposit with consistent physical and functional performance. Orosene... [See More]

  • Chemical / Composition: Gold Plating
Techni IM Gold AT6100
from Technic, Inc.

Techni IM Gold AT6100 is a cyanide based immersion gold that deposits pore free gold without removing Ni. The Techni IM Gold AT6100 utilizes a proprietary electron donor that will only become active in the presence of a base metal like nickel. This is called substrate catalyzed gold reduction and... [See More]

  • Chemical / Composition: Gold Plating
Techni IM Gold AT8000
from Technic, Inc.

A cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and Techni IM Gold AT6100 additive. During this reaction Ni is not removed from the substrate. This eliminates all of the corrosion associated with black pad and hyper corrosion... [See More]

  • Chemical / Composition: Gold Plating
Techni-Gold 1020C (HS) / Techni Gold 1020N (HS)
from Technic, Inc.

Techni Gold 1020C (HS) is a mildly acidic cobalt brightened gold plating solution recommended for use in high speed and selective plating applications. The solution operates at relatively low gold metal concentrations while producing deposits with low porosity.. Techni Gold 1020N (HS) is used for... [See More]

  • Chemical / Composition: Gold Plating
Techni-Gold 434HS
from Technic, Inc.

Techni-Gold 434 HS is ideally suited to meet the pure soft gold requirements of wire bonding. Techni-Gold 434 HS Acid Pure Gold has been designed to produce a gold deposit that has 99.99+ % purity with a hardness of of 80-90 Knoop 25. The deposit meets Mil-G-45204C, Type III, Grade A requirements. [See More]

  • Chemical / Composition: Gold Plating
Technic Orostrike C
from Technic, Inc.

Technic ’s pure gold process for depositing ultra-thin layers of pure gold to enhance wire bonding / solderability performance in PPF applications. Operates at very low gold metal concentration with high current density range. [See More]

  • Chemical / Composition: Gold Plating