Copper Plating Plating Chemicals and Anodizing Chemicals
from MacDermid Alpha Electronics Solutions
High-speed, reel-to-reel or rack and barrel plating solutions with wide current density ranges. Product Overview. Our high-speed plating and cyanide-based copper strike solutions include: Bright, Matte. High-speed copper plating for mid to high current densities, available in either sulfuric acid or... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from Pavco, Inc.
CoproPlate Brt - is an additive package that produces an extremely bright, ductile deposit of copper when used in conjunction with the CoproPlate SB plating package. It plates at a very high rate of deposition with a layer of copper that is easily buffed if desired. [See More]
- Chemical / Composition: Copper Plating
- Form: Liquid / Solution
from Technic, Inc.
One additive bright copper used for decorative and electroforming applications. [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
TECHNIC CU 2800 is a truly unique acid copper plating process specifically designed to meet the demands of today ís complex printed circuit board designs. Providing excellent throwing power over a wide current density range, Technic CU 2800 offers specific advantages in: Low current density... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
High-speed copper plating bath able to achieve very fast plating rates on a variety of semiconductor applications while maintaining good WIW and WID coplanarity. 4 microns/minute can be attained on bump on passivation, bump on pad and other advanced packaging structures. Electrolyte can be modified... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
A low-stress copper bath that can be used for any application that requires a low-stress deposit such as a glass substrate. Plates at 1 – 2 microns/minute with virtually no internal stress. [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
A truly unique acid copper plating process specifically designed to meet the demands of today ’s complex printed circuit board designs. Providing excellent throwing power over a wide current density range. Technic CU 2900 offers specific advantages: Low current density processing for improved... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
Technic ISA Insoluble Anode System: The Technic ISA system eliminates high consumption of additives and utilizes copper oxide to maintain copper concentration in the plating solution. By eliminating soluble anodes, the Technic ISA system provides;. A defect free surface by eliminating a major source... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over 40 ASF (4 ASD) in standard process tanks. The use of unique leveling agents helps to overcome incomplete... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
TechniPulse 5300 has been specifically engineered for pulse periodic reverse or complex pulse wave applications. In the pulse mode the TechniPulse 5300 will produce an even, semi-bright deposit from a stable electrolyte. TechniPulse 5300 can also be operated in the DC mode so that a single process... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
TechniSol Cu 2440 is an electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits at 40 – 60 ASF that are ideal for use in a solar cell metal stack application. [See More]
- Chemical / Composition: Copper Plating