Copper Plating Plating Chemicals and Anodizing Chemicals

Advanced Via Fill Copper Metallization Chemical -- MacuSpec AVF-700
from MacDermid Alpha Electronics Solutions

The MacuSpec AVF-700 is an advanced via fill copper metallization that our customers building HDI choose when they need minimal surface copper under a wide variety of aspect ratios. The unique formula of chemical components and equipment parameters enables customers to plate a wide variety of blind... [See More]

  • Chemical / Composition: Copper Plating
High Throw DC Acid Copper Through Hole Plating Process -- MacuSpec HT 300
from MacDermid Alpha Electronics Solutions

MacuSpec HT 300 is the choice DC acid copper plating process that allows for pulse plating-like performance on thicker boards in standard DC copper plating equipment. This process is capable of plating copper with exceptional brightness, ductility and uniformity in through holes of up to 15:1 aspect... [See More]

  • Chemical / Composition: Copper Plating
Periodic Pulse Rectified Copper Through Hole Plating Process -- MacuSpec PPR
from MacDermid Alpha Electronics Solutions

MacuSpec PPR 200 is the electroplating process trusted worldwide by fabricators that demand precise thickness uniformity and overall productivity unattainable by conventional acid copper plating. Designed to work more effectively on today's multilayer PCB's, it can easily meet the most challenging... [See More]

  • Chemical / Composition: Copper Plating
Portfolio of Metallization Processes for Molded Circuitry -- MID Series Metallization
from MacDermid Alpha Electronics Solutions

Our MID plating solutions are specifically designed and optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. From electroless copper, to surface finishes for a wide range of applications, we... [See More]

  • Chemical / Composition: Copper Plating; Gold Plating; Hard Nickel Plating; Platinum Plating; Silver Plating; Electroless
Single Step Copper Through Hole Fill Electroplating Process -- MacuSpec THF 100
from MacDermid Alpha Electronics Solutions

The MacuSpec THF 100 single step copper through hole filling process is a high-performance plating technology that can completely fill through holes in a single plating step. Fabricators can achieve improved thermal conductivity over paste filling, skip resource intensive planarization steps, and... [See More]

  • Chemical / Composition: Copper Plating
Copper Plating Systems -- CoproPlate Brt
from Pavco, Inc.

CoproPlate Brt - is an additive package that produces an extremely bright, ductile deposit of copper when used in conjunction with the CoproPlate SB plating package. It plates at a very high rate of deposition with a layer of copper that is easily buffed if desired. [See More]

  • Chemical / Composition: Copper Plating
  • Form: Liquid / Solution
Acid Copper -- Copper U
from Technic, Inc.

One additive bright copper used for decorative and electroforming applications. [See More]

  • Chemical / Composition: Copper Plating
Acid Copper -- Technic CU 2800
from Technic, Inc.

TECHNIC CU 2800 is a truly unique acid copper plating process specifically designed to meet the demands of today ís complex printed circuit board designs. Providing excellent throwing power over a wide current density range, Technic CU 2800 offers specific advantages in: Low current density... [See More]

  • Chemical / Composition: Copper Plating
Elevate® Cu 6370
from Technic, Inc.

High-speed copper plating bath able to achieve very fast plating rates on a variety of semiconductor applications while maintaining good WIW and WID coplanarity. 4 microns/minute can be attained on bump on passivation, bump on pad and other advanced packaging structures. Electrolyte can be modified... [See More]

  • Chemical / Composition: Copper Plating
Elevate®Cu 6340
from Technic, Inc.

A low-stress copper bath that can be used for any application that requires a low-stress deposit such as a glass substrate. Plates at 1 – 2 microns/minute with virtually no internal stress. [See More]

  • Chemical / Composition: Copper Plating
Technic CU 2900
from Technic, Inc.

A truly unique acid copper plating process specifically designed to meet the demands of today ’s complex printed circuit board designs. Providing excellent throwing power over a wide current density range. Technic CU 2900 offers specific advantages: Low current density processing for improved... [See More]

  • Chemical / Composition: Copper Plating
Technic ISA
from Technic, Inc.

Technic ISA Insoluble Anode System: The Technic ISA system eliminates high consumption of additives and utilizes copper oxide to maintain copper concentration in the plating solution. By eliminating soluble anodes, the Technic ISA system provides;. A defect free surface by eliminating a major source... [See More]

  • Chemical / Composition: Copper Plating
TechniFlex CU 120
from Technic, Inc.

TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over 40 ASF (4 ASD) in standard process tanks. The use of unique leveling agents helps to overcome incomplete... [See More]

  • Chemical / Composition: Copper Plating
TechniPulse 5300
from Technic, Inc.

TechniPulse 5300 has been specifically engineered for pulse periodic reverse or complex pulse wave applications. In the pulse mode the TechniPulse 5300 will produce an even, semi-bright deposit from a stable electrolyte. TechniPulse 5300 can also be operated in the DC mode so that a single process... [See More]

  • Chemical / Composition: Copper Plating
TechniSol Cu 2440
from Technic, Inc.

TechniSol Cu 2440 is an electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits at 40 – 60 ASF that are ideal for use in a solar cell metal stack application. [See More]

  • Chemical / Composition: Copper Plating