Copper Plating Plating Chemicals and Anodizing Chemicals
from MacDermid Alpha Electronics Solutions
Product Overview. Systek ETS features: Fine line pattern plating down to 5/5 µm line/space. High coplanarity of traces and pads with R-Values < 2 µm. Excellent trace profile for controlled impedance. Low-stress deposit exceeds IPC Class III standards for tensile strength and elongation... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. Redistribution layers in Integrated Circuit (IC) substrate manufacturing require metallization of fine structures, such as blind microvias, X-vias, and fine lines and pads. The Systek UVF Series enables 2-in-1 Redistribution Layer (RDL) plating of these features in a single bath. [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. MacuSpec VF-TH 500 is the latest innovation in the award-winning VF-TH series of plating processes. The technology is designed for High-Density Interconnect (HDI) boards that require simultaneous via filling and through-hole plating with excellent microdistribution for panel... [See More]
- Chemical / Composition: Copper Plating; Tin Plating; Electroless
from MacDermid Alpha Electronics Solutions
Product Overview. The MacuSpec VF-TH Series consists of copper plating baths that can simultaneously fill copper microvias and plate through-holes with aspect ratios up to 5:1 across a wide range of structure sizes, delivering excellent physical properties. Designed for use in Vertical Conveyor... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. Via Dep ® 4550 electroless copper system is specially designed for difficult-to-plate substrates. The 4550 process offers superior adhesion on inert surfaces and difficult structural designs while maintaining structural integrity. The zero-stress, blister-free deposit for... [See More]
- Chemical / Composition: Copper Plating; Tin Plating; Electroless
from MacDermid Alpha Electronics Solutions
Product Overview. MacuSpec HT 360 is a state-of-the-art Direct Current (DC) acid copper plating process that offers greater throwing power at current densities up to 35 ASF in through holes with aspect ratios up to 12:1. The increased throwing power and higher current density provide greater... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. The award-winning NOVAFAB Fine Grain Copper electroplating process produces a unique film that supports the mechanical and electrical requirements of advanced semiconductor packaging. Engineered for various wafer-level packaging applications, NOVAFAB Fine Grain Copper excels in... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. MacuSpec PPR 100 and 200 are industry-leading pulse plating processes trusted by fabricators worldwide who demand precise thickness uniformity and overall productivity that conventional acid copper plating cannot achieve. These processes are designed for the metallization of... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. MICROFAB DVF-200 is an acid copper plating process designed to fill TSVs without voids or other defects at high plating speeds. The process is specially formulated for vias with diameters ranging from 5 to 100 μm and aspect ratios of less than 10:1. Product Features. Reduced... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from Pavco, Inc.
CoproPlate Brt - is an additive package that produces an extremely bright, ductile deposit of copper when used in conjunction with the CoproPlate SB plating package. It plates at a very high rate of deposition with a layer of copper that is easily buffed if desired. [See More]
- Chemical / Composition: Copper Plating
- Form: Liquid / Solution
from Technic, Inc.
One additive bright copper used for decorative and electroforming applications. [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
TECHNIC CU 2800 is a truly unique acid copper plating process specifically designed to meet the demands of today ís complex printed circuit board designs. Providing excellent throwing power over a wide current density range, Technic CU 2800 offers specific advantages in: Low current density... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
High-speed copper plating bath able to achieve very fast plating rates on a variety of semiconductor applications while maintaining good WIW and WID coplanarity. 4 microns/minute can be attained on bump on passivation, bump on pad and other advanced packaging structures. Electrolyte can be modified... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
A low-stress copper bath that can be used for any application that requires a low-stress deposit such as a glass substrate. Plates at 1 – 2 microns/minute with virtually no internal stress. [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
A truly unique acid copper plating process specifically designed to meet the demands of today ’s complex printed circuit board designs. Providing excellent throwing power over a wide current density range. Technic CU 2900 offers specific advantages: Low current density processing for improved... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
Technic ISA Insoluble Anode System: The Technic ISA system eliminates high consumption of additives and utilizes copper oxide to maintain copper concentration in the plating solution. By eliminating soluble anodes, the Technic ISA system provides;. A defect free surface by eliminating a major source... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over 40 ASF (4 ASD) in standard process tanks. The use of unique leveling agents helps to overcome incomplete... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
TechniPulse 5300 has been specifically engineered for pulse periodic reverse or complex pulse wave applications. In the pulse mode the TechniPulse 5300 will produce an even, semi-bright deposit from a stable electrolyte. TechniPulse 5300 can also be operated in the DC mode so that a single process... [See More]
- Chemical / Composition: Copper Plating
from Technic, Inc.
TechniSol Cu 2440 is an electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits at 40 – 60 ASF that are ideal for use in a solar cell metal stack application. [See More]
- Chemical / Composition: Copper Plating