Silver Plating Plating Chemicals and Anodizing Chemicals

Immersion Silver Surface Finish -- Sterling
from MacDermid Alpha Electronics Solutions

SterlingĀ is an immersion silver finish that provides exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility. It offers benefits throughout the supply chain: fabricators receive a versatile and flexible solution that can be applied with either... [See More]

  • Chemical / Composition: Silver Plating
Portfolio of Metallization Processes for Molded Circuitry -- MID Series Metallization
from MacDermid Alpha Electronics Solutions

Our MID plating solutions are specifically designed and optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. From electroless copper, to surface finishes for a wide range of applications, we... [See More]

  • Chemical / Composition: Copper Plating; Gold Plating; Hard Nickel Plating; Platinum Plating; Silver Plating; Electroless
Anodic, High Speed Silver Back-strip Solution -- Techni Silver Stripper 3500
from Technic, Inc.

The racks to be stripped are made anodic and the plated metal on the racks is dissolved into the electrolyte and subsequently deposited on steel or copper cathodes. [See More]

  • Chemical / Composition: Silver Plating
Argentomerse NC
from Technic, Inc.

Unlike most immersion silver processes on the market, the Argentomerse NC Process is both cyanide and nitrate-free. It will deposit approximately 0.125 microns (5 uin) of silver per minute on copper and copper alloys. Argentomerse NC is slightly alkaline and, unlike acid processes, the deposition of... [See More]

  • Chemical / Composition: Silver Plating
Techni Silver 1006
from Technic, Inc.

Techni Silver 1006 is an antimony brightened pure silver plating process that produces mirror bright ductile silver deposits with excellent wear resistance. [See More]

  • Chemical / Composition: Silver Plating
Techni Silver EHS 3R
from Technic, Inc.

Techni Silver EHS 3R is a high speed silver plating solution designed to deposit pure silver in spot plating and other automatic machine applications from a phosphate electrolyte. The bath is designed to operate at very low concentrations of free cyanide with inert anodes. Techni Silver EHS 3R can... [See More]

  • Chemical / Composition: Silver Plating
TechniSol Ag 2460
from Technic, Inc.

TechniSol Ag 2460 is a non-cyanide silver electrodeposition process used to enhance a silver paste seed layer or used as a solderable layer in a solar cell metal stack application. Ag 2460 is a high-speed, low-silver metal formulation that provides a very fine grain morphology, excellent thickness... [See More]

  • Chemical / Composition: Silver Plating