Tin Plating Plating Chemicals and Anodizing Chemicals

Metal-based Immersion Tin Chemical -- ORMECON CSN Classic
from MacDermid Alpha Electronics Solutions

ORMECONĀ CSN Classic is a series of extremely stable immersion tin processes. Based on a patented Organic MetalĀ pre-dip, the tin processes are production-proven to reduce copper-tin diffusion speed by as much as 65% and catalyze the tin deposition. As a result, exceptional solderability and... [See More]

  • Chemical / Composition: Tin Plating
Tin Plating -- COLGLEAM® Sn
from Columbia Chemical Corporation

COLGLEAM ® Sn is a process for bright acid tin plating. Baths are maintained with only one brightener additive, eliminating the need to juggle and balance brighteners. The COLGLEAM Sn process is extremely simple to control, requiring only a fraction of the lab and analysis time needed by... [See More]

  • Chemical / Composition: Tin Plating
  • Form: Liquid / Solution
Alloy Plating Systems -- Volta
from Pavco, Inc.

Volta - The PAVCO ® Volta Sn/Zn system is a sulfate based tin zinc electroplating process which produces an alloy containing 70% tin and 30% zinc. Deposits from Volta Sn/Zn process provide superior corrosion resistance versus conventional electroplating deposits. [See More]

  • Chemical / Composition: Tin Plating
  • Form: Liquid / Solution
Clarifies and Regenerates All of Technicecs Proprietary Tin and Tin/lead Plating Processes -- Techni Tin Lead Clear A Flock
from Technic, Inc.

Acts by coagulating and precipitating the stannic tin. Can be readily filtered, leaving behind a clear plating bath. [See More]

  • Chemical / Composition: Tin Plating
Tin Plating Systems -- PavBrite Sn
from Pavco, Inc.

PavBrite Sn - is a two-component bright acid tin-plating process that produces a brilliant, level tin electro-deposit, which exhibits excellent solderability. PavBrite SN baths,which require low tin levels, are extremely economical to operate. The control of the bath is simple because of the need... [See More]

  • Chemical / Composition: Tin Plating
  • Form: Liquid / Solution
Elevate® AuSn 8020
from Technic, Inc.

Gold-tin alloy plating process that produces alloy ranges from 75 – 82% gold content with a corresponding melting point of 280 °C – 320 °C. Optimum gold-tin alloys are produced from a one-step, single bath process. [See More]

  • Chemical / Composition: Gold Plating; Tin Plating
Elevate® Tin 5011
from Technic, Inc.

A High-speed pure tin process that produces a deposit that is fine-grained with low organic impurities and is whisker resistant. The process is formulated to provide excellent coplanarity across the wafer. [See More]

  • Chemical / Composition: Tin Plating
Passive Component Electroplating -- Ceramistan 1031
from Technic, Inc.

The Ceramistan 1031 process produces a dense small grain deposit that provides excellent solderability, even after parts have been exposed to extended steam age testing. In addition, deposits from Ceramistan 1031 can significantly reduce or completely eliminate spattering during reflow, a problem... [See More]

  • Chemical / Composition: Tin Plating
Technistan HTM 4089
from Technic, Inc.

Technistan HTM 4089 is a High Throw Matte (HTM) tin sulfate process engineered to increase yields in advanced printed circuit boards. The Technistan HTM 4089 additive suppresses deposit thickness on the surface creating a thicker deposit in the center of a high aspect ratio through hole or at the... [See More]

  • Chemical / Composition: Tin Plating
Tin & Tin Alloy Alloy -- Techni BT2
from Technic, Inc.

The Techni BT2 bright tin process is a low cost bright tin process based on sulfuric acid. It is designed for rack and barrel plating applications. The bright tin deposits have excellent solderability characteristics and are whisker resistant as defined by JEDEC JESD201A standards [See More]

  • Chemical / Composition: Tin Plating
Tin & Tin Alloy Electroplating -- Technistan EP
from Technic, Inc.

Technistan EP is a high speed, pure tin whisker resistant plating process based on Technic ’s proprietary and patented mixed acid technology. The process produces a fine-grained matte tin deposit with superior solderability and tin whisker performance, which satisfies all requirements of JEDEC... [See More]

  • Chemical / Composition: Tin Plating