Tin Plating Plating Chemicals and Anodizing Chemicals
from MacDermid Alpha Electronics Solutions
Product Overview. Systek ETS features: Fine line pattern plating down to 5/5 µm line/space. High coplanarity of traces and pads with R-Values < 2 µm. Excellent trace profile for controlled impedance. Low-stress deposit exceeds IPC Class III standards for tensile strength and elongation... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. Redistribution layers in Integrated Circuit (IC) substrate manufacturing require metallization of fine structures, such as blind microvias, X-vias, and fine lines and pads. The Systek UVF Series enables 2-in-1 Redistribution Layer (RDL) plating of these features in a single bath. [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. MacuSpec VF-TH 500 is the latest innovation in the award-winning VF-TH series of plating processes. The technology is designed for High-Density Interconnect (HDI) boards that require simultaneous via filling and through-hole plating with excellent microdistribution for panel... [See More]
- Chemical / Composition: Copper Plating; Tin Plating; Electroless
from MacDermid Alpha Electronics Solutions
Product Overview. The MacuSpec VF-TH Series consists of copper plating baths that can simultaneously fill copper microvias and plate through-holes with aspect ratios up to 5:1 across a wide range of structure sizes, delivering excellent physical properties. Designed for use in Vertical Conveyor... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. ViaForm copper damascene chemistries deliver superior filling performance for wafer fabrication. Each chemistry is specifically designed for manufacturing advanced copper interconnects and provides a high degree of process control. ViaForm enables robust interconnect fill... [See More]
- Chemical / Composition: Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. Via Dep ® 4550 electroless copper system is specially designed for difficult-to-plate substrates. The 4550 process offers superior adhesion on inert surfaces and difficult structural designs while maintaining structural integrity. The zero-stress, blister-free deposit for... [See More]
- Chemical / Composition: Copper Plating; Tin Plating; Electroless
from MacDermid Alpha Electronics Solutions
Product Overview. MacuSpec HT 360 is a state-of-the-art Direct Current (DC) acid copper plating process that offers greater throwing power at current densities up to 35 ASF in through holes with aspect ratios up to 12:1. The increased throwing power and higher current density provide greater... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. The award-winning NOVAFAB Fine Grain Copper electroplating process produces a unique film that supports the mechanical and electrical requirements of advanced semiconductor packaging. Engineered for various wafer-level packaging applications, NOVAFAB Fine Grain Copper excels in... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from MacDermid Alpha Electronics Solutions
Product Overview. MacuSpec PPR 100 and 200 are industry-leading pulse plating processes trusted by fabricators worldwide who demand precise thickness uniformity and overall productivity that conventional acid copper plating cannot achieve. These processes are designed for the metallization of... [See More]
- Chemical / Composition: Copper Plating; Tin Plating
from Technic, Inc.
Acts by coagulating and precipitating the stannic tin. Can be readily filtered, leaving behind a clear plating bath. [See More]
- Chemical / Composition: Tin Plating
from Pavco, Inc.
Volta - The PAVCO ® Volta Sn/Zn system is a sulfate based tin zinc electroplating process which produces an alloy containing 70% tin and 30% zinc. Deposits from Volta Sn/Zn process provide superior corrosion resistance versus conventional electroplating deposits. [See More]
- Chemical / Composition: Tin Plating
- Form: Liquid / Solution
from Columbia Chemical Corporation
COLGLEAM ® Sn is a process for bright acid tin plating. Baths are maintained with only one brightener additive, eliminating the need to juggle and balance brighteners. The COLGLEAM Sn process is extremely simple to control, requiring only a fraction of the lab and analysis time needed by... [See More]
- Chemical / Composition: Tin Plating
- Form: Liquid / Solution
from Technic, Inc.
Gold-tin alloy plating process that produces alloy ranges from 75 – 82% gold content with a corresponding melting point of 280 °C – 320 °C. Optimum gold-tin alloys are produced from a one-step, single bath process. [See More]
- Chemical / Composition: Gold Plating; Tin Plating
from Pavco, Inc.
PavBrite Sn - is a two-component bright acid tin-plating process that produces a brilliant, level tin electro-deposit, which exhibits excellent solderability. PavBrite SN baths,which require low tin levels, are extremely economical to operate. The control of the bath is simple because of the need... [See More]
- Chemical / Composition: Tin Plating
- Form: Liquid / Solution
from Technic, Inc.
A High-speed pure tin process that produces a deposit that is fine-grained with low organic impurities and is whisker resistant. The process is formulated to provide excellent coplanarity across the wafer. [See More]
- Chemical / Composition: Tin Plating
from Technic, Inc.
The Ceramistan 1031 process produces a dense small grain deposit that provides excellent solderability, even after parts have been exposed to extended steam age testing. In addition, deposits from Ceramistan 1031 can significantly reduce or completely eliminate spattering during reflow, a problem... [See More]
- Chemical / Composition: Tin Plating
from Technic, Inc.
Technistan HTM 4089 is a High Throw Matte (HTM) tin sulfate process engineered to increase yields in advanced printed circuit boards. The Technistan HTM 4089 additive suppresses deposit thickness on the surface creating a thicker deposit in the center of a high aspect ratio through hole or at the... [See More]
- Chemical / Composition: Tin Plating
from Technic, Inc.
The Techni BT2 bright tin process is a low cost bright tin process based on sulfuric acid. It is designed for rack and barrel plating applications. The bright tin deposits have excellent solderability characteristics and are whisker resistant as defined by JEDEC JESD201A standards [See More]
- Chemical / Composition: Tin Plating
from Technic, Inc.
Technistan EP is a high speed, pure tin whisker resistant plating process based on Technic ’s proprietary and patented mixed acid technology. The process produces a fine-grained matte tin deposit with superior solderability and tin whisker performance, which satisfies all requirements of JEDEC... [See More]
- Chemical / Composition: Tin Plating