Nickel Plating - Hard Plating Chemicals and Anodizing Chemicals
from MacDermid Alpha Electronics Solutions
General purpose bath for both nickel- and cobalt-hardened applications. Product Overview. Our Cobalt or Nickel process is a general-purpose bath suitable for both nickel and cobalt-hardened applications. [See More]
- Chemical / Composition: Hard Nickel Plating; Tin Plating
from Pavco, Inc.
Ziniloy ™ - An alkaline zinc/nickel plating process that deposits 12-15% nickel in the deposit. It offers an exceptional efficiency of 30% more than conventional processes, high corrosion-resistance and easy bath control due to its having a small number of additives. It demonstrates superior... [See More]
- Chemical / Composition: Hard Nickel Plating; Zinc Plating
- Form: Liquid / Solution
from Technic, Inc.
Designed for application where a very white level deposit is required for the final nickel plate. [See More]
- Chemical / Composition: Hard Nickel Plating
from Columbia Chemical Corporation
MARQUEE ® ENVY MP is an ELV compliant, mid phosphorous, electroless nickel plating process. It contains no lead nor cadmium, and meets ASTM-B-733 and AMS2404 C specifications. Being a two component process, it is easy to use and has a 1:1 replenishment rate. It provides a deep, brilliant... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Advanced Abrasives Corp.
uDiamond ® Plating Additive. Introducing uDiamond ® Plating Additive for Electroless Nickel - the first ever custom designed NanoDiamond dispersion for electroless plating. Breakthrough in Wear Resistance. Introducing uDiamond ® Plating Additive for Electroless Nickel – the... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Sanchem, Inc.
can replace traditional time consuming zincate and copper strikes with an easy to use fast acting single stage plating seal that is used as a base coat for both standard nickel and electrolysis nickel when plating over aluminum, magnesium, beryllium, niobium and titanium. [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Pavco, Inc.
Constellation - Superior, fast leveling, ultimately brilliant nickel system dsigned for low thickness deposits, and unparalleled for high spec nickel plating. Existing nickel baths can be easily converted to the Constellation system. [See More]
- Chemical / Composition: Hard Nickel Plating
- Form: Liquid / Solution
from Technic, Inc.
All purpose nickel sulfamate bath that provides a low stress and ductile deposit. Low maintenance and long bath life are prominent attributes of this process. [See More]
- Chemical / Composition: Hard Nickel Plating
from Pavco, Inc.
Lumina - The ultimate fast leveling system, specially designed for low thickness deposits, while being unparalleled for high spec nickel plating as well. Existing nickel baths can be easily converted to the Lumina system. [See More]
- Chemical / Composition: Hard Nickel Plating
- Form: Liquid / Solution
from Technic, Inc.
The Technic High Speed Nickel Sulfamate FFP process is designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit from either a sulfamate or sulfate electrolyte. [See More]
- Chemical / Composition: Hard Nickel Plating
from Technic, Inc.
Techni Nickel HSG is an environmentally friendly process designed for high speed, high current density plating in a variety of electronic plating applications. Techni Nickel HSG produces a low stress, semi-bright, ductile nickel deposit from a chemistry which is completely free of amines and is,... [See More]
- Chemical / Composition: Hard Nickel Plating
from Technic, Inc.
Techni Nickel HT-2 is a high throw electrolytic nickel that has been designed to improve the through-hole metallization of printed circuit boards. It will improve throwing power and surface to hole distribution and is ideally suited for use in printed wiring board applications where an increased... [See More]
- Chemical / Composition: Hard Nickel Plating
from Technic, Inc.
Technic EN AT5600 is the first electroless nickel with a new family of organic stabilizer that produces lateral nickel growth on copper. Lateral growth yields a flatter surface with less pronounced grain boundaries instead of the typical nodular, “cauliflower-like ” structure from older... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
from Technic, Inc.
TechniSol Ni 2420 is an electrodeposition nickel process that can be used with Light Induced Plating or conventional electroplating. It is ideal for use as a barrier layer over alternative seed layers such as nickel silicide and Laser Doped Selective Emitter. Produces a low stress, low resistivity... [See More]
- Chemical / Composition: Hard Nickel Plating