Nickel Plating - Hard Plating Chemicals and Anodizing Chemicals

Electroless Nickel Palladium Immersion Gold Plating Chemicals -- Affinity ENEPIG 2.0
from MacDermid Alpha Electronics Solutions

MacDermid Enthone's Affinity ENEPIG is the latest electroless nickel/electroless palladium/immersion gold plating process designed specifically to deliver a high reliability wire bondabale surface finish with high yields. By combining the advances of Affinity ENIG and a stable palladium plating... [See More]

  • Chemical / Composition: Gold Plating; Hard Nickel Plating
Portfolio of Metallization Processes for Molded Circuitry -- MID Series Metallization
from MacDermid Alpha Electronics Solutions

Our MID plating solutions are specifically designed and optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. From electroless copper, to surface finishes for a wide range of applications, we... [See More]

  • Chemical / Composition: Copper Plating; Gold Plating; Hard Nickel Plating; Platinum Plating; Silver Plating; Electroless
uDiamond® Plating Additive for Electroless Nickel
from Advanced Abrasives Corp.

uDiamond ® Plating Additive. Introducing uDiamond ® Plating Additive for Electroless Nickel - the first ever custom designed NanoDiamond dispersion for electroless plating. Breakthrough in Wear Resistance. Introducing uDiamond ® Plating Additive for Electroless Nickel – the... [See More]

  • Chemical / Composition: Hard Nickel Plating; Electroless
  • Form: Liquid / Solution
Bright Nickel Plating Process -- MX8-M
from Technic, Inc.

Designed for application where a very white level deposit is required for the final nickel plate. [See More]

  • Chemical / Composition: Hard Nickel Plating
Electroless Nickel Plating -- MARQUEE® ENVY MP
from Columbia Chemical Corporation

MARQUEE ® ENVY MP is an ELV compliant, mid phosphorous, electroless nickel plating process. It contains no lead nor cadmium, and meets ASTM-B-733 and AMS2404 C specifications. Being a two component process, it is easy to use and has a 1:1 replenishment rate. It provides a deep, brilliant... [See More]

  • Chemical / Composition: Hard Nickel Plating; Electroless
  • Form: Liquid / Solution
SafeGard® CC-Plating Seal
from Sanchem, Inc.

can replace traditional time consuming zincate and copper strikes with an easy to use fast acting single stage plating seal that is used as a base coat for both standard nickel and electrolysis nickel when plating over aluminum, magnesium, beryllium, niobium and titanium. [See More]

  • Chemical / Composition: Hard Nickel Plating; Electroless
  • Form: Liquid / Solution
Nickel Sulphamate
from Umicore Materials

Umicore produces a very high quality nickel sulphamate on all continents to serve our international customer base. Nickel sulphamate is used in high end plating applications. [See More]

  • Chemical / Composition: Hard Nickel Plating
Alloy Compliant Chemistry Systems -- Ziniloy™
from Pavco, Inc.

Ziniloy ™ - An alkaline zinc/nickel plating process that deposits 12-15% nickel in the deposit. It offers an exceptional efficiency of 30% more than conventional processes, high corrosion-resistance and easy bath control due to its having a small number of additives. It demonstrates superior... [See More]

  • Chemical / Composition: Hard Nickel Plating; Zinc Plating
  • Form: Liquid / Solution
Elevate® Ni 5910
from Technic, Inc.

All purpose nickel sulfamate bath that provides a low stress and ductile deposit. Low maintenance and long bath life are prominent attributes of this process. [See More]

  • Chemical / Composition: Hard Nickel Plating
Nickel Sulphate
from Umicore Materials

Umicore is one of the principal producers of nickel sulphate in the world. Our guaranteed supply and large installed capacity enables us to serve all applications of nickel sulphate. The main application of nickel sulphate is electroplating and within the electroless market, nickel sulphate is used... [See More]

  • Chemical / Composition: Hard Nickel Plating; Electroless
Nickel Plating System -- Constellation
from Pavco, Inc.

Constellation - Superior, fast leveling, ultimately brilliant nickel system dsigned for low thickness deposits, and unparalleled for high spec nickel plating. Existing nickel baths can be easily converted to the Constellation system. [See More]

  • Chemical / Composition: Hard Nickel Plating
  • Form: Liquid / Solution
High Speed Nickel Sulfamate FFP
from Technic, Inc.

The Technic High Speed Nickel Sulfamate FFP process is designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit from either a sulfamate or sulfate electrolyte. [See More]

  • Chemical / Composition: Hard Nickel Plating
Nickel Plating System -- Lumina
from Pavco, Inc.

Lumina - The ultimate fast leveling system, specially designed for low thickness deposits, while being unparalleled for high spec nickel plating as well. Existing nickel baths can be easily converted to the Lumina system. [See More]

  • Chemical / Composition: Hard Nickel Plating
  • Form: Liquid / Solution
Techni Nickel HSG
from Technic, Inc.

Techni Nickel HSG is an environmentally friendly process designed for high speed, high current density plating in a variety of electronic plating applications. Techni Nickel HSG produces a low stress, semi-bright, ductile nickel deposit from a chemistry which is completely free of amines and is,... [See More]

  • Chemical / Composition: Hard Nickel Plating
Techni Nickel HT-2
from Technic, Inc.

Techni Nickel HT-2 is a high throw electrolytic nickel that has been designed to improve the through-hole metallization of printed circuit boards. It will improve throwing power and surface to hole distribution and is ideally suited for use in printed wiring board applications where an increased... [See More]

  • Chemical / Composition: Hard Nickel Plating