High Purity Plating Chemicals and Anodizing Chemicals
2 Results
Display Driver Interface (DDI) -- MICROFAB ® AU3151
from MacDermid Alpha Electronics Solutions
from MacDermid Alpha Electronics Solutions
Product Overview. MICROFAB Au3151 enables high-hardness gold bumping through the use of an organic hardness adjuster —something not achievable with conventional gold processes. It is ideal for semiconductor wafer applications requiring gold bump plating or minimal grain growth during heat... [See More]
- Chemical / Composition: Tin Plating; Soft / High Purity
Hybrid Bonding Materials for Advanced Semiconductor Packaging -- NOVAFAB ® NANOTWIN Cu
from MacDermid Alpha Electronics Solutions
from MacDermid Alpha Electronics Solutions
Product Overview. NOVAFAB NANOTWIN Cu is a high-purity copper electroplating process which produces a <111 > oriented deposit with a high fraction of nano-twinning. It is specially formulated for the fabrication of pillars or pads for wafer level packaging applications that require hybrid... [See More]
- Chemical / Composition: Tin Plating; Soft / High Purity