Electroless Plating Chemicals and Anodizing Chemicals
from MacDermid Alpha Electronics Solutions
Product Overview. MacuSpec VF-TH 500 is the latest innovation in the award-winning VF-TH series of plating processes. The technology is designed for High-Density Interconnect (HDI) boards that require simultaneous via filling and through-hole plating with excellent microdistribution for panel... [See More]
- Chemical / Composition: Copper Plating; Tin Plating; Electroless
from MacDermid Alpha Electronics Solutions
Product Overview. Blackhole is the lowest cost through hole metallization process available on the market. Trusted by over 250 of the world ’s leading manufacturers, our Blackhole process is the choice of fabricators worldwide who prefer an economical, environmentally friendly direct... [See More]
- Chemical / Composition: Copper Plating; Tin Plating; Electroless
from MacDermid Alpha Electronics Solutions
Product Overview. Shadow Plus is a graphite-based, patented wet-etch direct metallization technology designed to provide enhanced reliability for high-density applications. It enables the plating of microvias and through holes using graphite-based colloids and proprietary additives to make the holes... [See More]
- Chemical / Composition: Tin Plating; Electroless
from MacDermid Alpha Electronics Solutions
Product Overview. Via Dep ® 4550 electroless copper system is specially designed for difficult-to-plate substrates. The 4550 process offers superior adhesion on inert surfaces and difficult structural designs while maintaining structural integrity. The zero-stress, blister-free deposit for... [See More]
- Chemical / Composition: Copper Plating; Tin Plating; Electroless
from Columbia Chemical Corporation
MARQUEE ® ENVY MP is an ELV compliant, mid phosphorous, electroless nickel plating process. It contains no lead nor cadmium, and meets ASTM-B-733 and AMS2404 C specifications. Being a two component process, it is easy to use and has a 1:1 replenishment rate. It provides a deep, brilliant... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Advanced Abrasives Corp.
uDiamond ® Plating Additive. Introducing uDiamond ® Plating Additive for Electroless Nickel - the first ever custom designed NanoDiamond dispersion for electroless plating. Breakthrough in Wear Resistance. Introducing uDiamond ® Plating Additive for Electroless Nickel – the... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Technic, Inc.
TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts. [See More]
- Chemical / Composition: Gold Plating; Hard Nickel Plating; Electroless; Palladium
from Sanchem, Inc.
can replace traditional time consuming zincate and copper strikes with an easy to use fast acting single stage plating seal that is used as a base coat for both standard nickel and electrolysis nickel when plating over aluminum, magnesium, beryllium, niobium and titanium. [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Technic, Inc.
An extremely stable process capable of depositing over 10 microinches of Pd with a 2-3% phosphorus content. Techni EL Palladium AT7015 deposit is engineered for applications with gold wire bonding, touch contacts, or slide contacts. The deposit improves chemical resistance required in a high... [See More]
- Chemical / Composition: Electroless; Palladium
from Technic, Inc.
Technic EN AT5600 is the first electroless nickel with a new family of organic stabilizer that produces lateral nickel growth on copper. Lateral growth yields a flatter surface with less pronounced grain boundaries instead of the typical nodular, “cauliflower-like ” structure from older... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless