Electroless Plating Chemicals and Anodizing Chemicals

Portfolio of Metallization Processes for Molded Circuitry -- MID Series Metallization
from MacDermid Alpha Electronics Solutions

Our MID plating solutions are specifically designed and optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. From electroless copper, to surface finishes for a wide range of applications, we... [See More]

  • Chemical / Composition: Copper Plating; Gold Plating; Hard Nickel Plating; Platinum Plating; Silver Plating; Electroless
Electroless Nickel, Electroless Palladium, Immersion Gold -- TechniPad ENEPIG
from Technic, Inc.

TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts. [See More]

  • Chemical / Composition: Gold Plating; Hard Nickel Plating; Electroless; Palladium
SafeGard® CC-Plating Seal
from Sanchem, Inc.

can replace traditional time consuming zincate and copper strikes with an easy to use fast acting single stage plating seal that is used as a base coat for both standard nickel and electrolysis nickel when plating over aluminum, magnesium, beryllium, niobium and titanium. [See More]

  • Chemical / Composition: Hard Nickel Plating; Electroless
  • Form: Liquid / Solution
Electroless Nickel Plating -- MARQUEE® ENVY MP
from Columbia Chemical Corporation

MARQUEE ® ENVY MP is an ELV compliant, mid phosphorous, electroless nickel plating process. It contains no lead nor cadmium, and meets ASTM-B-733 and AMS2404 C specifications. Being a two component process, it is easy to use and has a 1:1 replenishment rate. It provides a deep, brilliant... [See More]

  • Chemical / Composition: Hard Nickel Plating; Electroless
  • Form: Liquid / Solution
uDiamond® Plating Additive for Electroless Nickel
from Advanced Abrasives Corp.

uDiamond ® Plating Additive. Introducing uDiamond ® Plating Additive for Electroless Nickel - the first ever custom designed NanoDiamond dispersion for electroless plating. Breakthrough in Wear Resistance. Introducing uDiamond ® Plating Additive for Electroless Nickel – the... [See More]

  • Chemical / Composition: Hard Nickel Plating; Electroless
  • Form: Liquid / Solution
Nickel Sulphate
from Umicore Materials

Umicore is one of the principal producers of nickel sulphate in the world. Our guaranteed supply and large installed capacity enables us to serve all applications of nickel sulphate. The main application of nickel sulphate is electroplating and within the electroless market, nickel sulphate is used... [See More]

  • Chemical / Composition: Hard Nickel Plating; Electroless