Electroless Plating Chemicals and Anodizing Chemicals
from MacDermid Alpha Electronics Solutions
Electroless nickel systems for memory disk provide superior corrosion resistance and excellent thermal magnetic stability. Product Overview. Our electroless nickel chemistries for memory disks produce high percentages of phosphorous deposits with superior corrosion resistance and excellent thermal... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
from Columbia Chemical Corporation
MARQUEE ® ENVY MP is an ELV compliant, mid phosphorous, electroless nickel plating process. It contains no lead nor cadmium, and meets ASTM-B-733 and AMS2404 C specifications. Being a two component process, it is easy to use and has a 1:1 replenishment rate. It provides a deep, brilliant... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Technic, Inc.
TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts. [See More]
- Chemical / Composition: Gold Plating; Hard Nickel Plating; Electroless; Palladium
from Advanced Abrasives Corp.
uDiamond ® Plating Additive. Introducing uDiamond ® Plating Additive for Electroless Nickel - the first ever custom designed NanoDiamond dispersion for electroless plating. Breakthrough in Wear Resistance. Introducing uDiamond ® Plating Additive for Electroless Nickel – the... [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Sanchem, Inc.
can replace traditional time consuming zincate and copper strikes with an easy to use fast acting single stage plating seal that is used as a base coat for both standard nickel and electrolysis nickel when plating over aluminum, magnesium, beryllium, niobium and titanium. [See More]
- Chemical / Composition: Hard Nickel Plating; Electroless
- Form: Liquid / Solution
from Technic, Inc.
An extremely stable process capable of depositing over 10 microinches of Pd with a 2-3% phosphorus content. Techni EL Palladium AT7015 deposit is engineered for applications with gold wire bonding, touch contacts, or slide contacts. The deposit improves chemical resistance required in a high... [See More]
- Chemical / Composition: Electroless; Palladium