Thermal / Heat Insulating Laminating Adhesives and Composite Resins
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]
- Features: Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
- Type / Form: Powder
from Master Bond, Inc.
Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]
- Features: Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Solvent Based; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]
- Features: Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours, low mixed... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Formulated for potting, coating and sealing applications, EP113 is a two component, nano silica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing. This low viscosity system bonds well to a wide variety of substrates including... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Flexible; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Sheldahl Flexible Technologies - a Flex company
We have core strength in vacuum deposition via sputtering ad thermal evaporation. Our materials are used for numerous applications, including passive thermal control for satellites and launch vehicles, thermal insulation for F1 racing cars and fire suits, and robust materials for audio and medical... [See More]
- Features: Flame Retardant; Thermal Insulation
- Industry: Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial
from FSI
OnePart is FSI ’s moisture-cure adhesive with time-tested results in a wide variety of commercial and industrial applications, including entry and garage doors, recreational vehicle components, building and construction products (like SIPs, structural insulated panels) and more. It ’s... [See More]
- Features: Thermal Insulation
- Chemical System: Polyurethane
- Substrate Compatibility: Plastic; Wood; Dissimilar Substrates
- Cure / Technology: Two Component ; Reactive or Moisture Cured