Epoxy (EP) Laminating Adhesives and Composite Resins Datasheets

Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Substrate Compatibility: Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Filled
3M™ Scotch-Weld™ Structural Adhesive Film -- AF-3185
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Structural Adhesive AF 3185 film is a non-volatile, thermosetting epoxy laminating adhesive and glass cloth combination designed for the structural bonding and for the preparation of reinforced epoxy glass laminate. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
  • Type / Form: Sheet or Film
  • Industry: Aerospace; OEM or Industrial
Haprez™ 3742 General Purpose Epoxy Laminating Binder System -- 3742
from Hapco, Inc.

An economical, general purpose, epoxy laminating and binder system. A clear amber, general purpose system that can be used with a variety of fillers for virtually all room temperature casting and laminating applications. As a laminating system, the extremely low viscosity of HAPREZ ™ 3742... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type / Form: Liquid
  • Industry: Tooling
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Chemical System: Epoxy
  • Type / Form: Gel
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Composition: Unfilled