Metal Laminating Adhesives and Composite Resins
from Ellsworth Adhesives
DYMAX Ultra Light-Weld 4-20418 Low Stress Plastic and Glass Bonder is a one component, UV light curing, urethane adhesive that is used for laminating and bonding metal, plastics, and glass. It is solvent free, good thermal cycling performance, and resistance to yellowing. 1 L Bottle. [See More]
- Substrate Compatibility: Metal; Plastic
- Viscosity: 450
- Cure / Technology: Single Component
- Tensile (Break): 1650
from Master Bond, Inc.
Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from AGC Chemicals Americas, Inc.
Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Glass Cloth, Polyimide, Various Metals
- Industry: Electronics; PBCs, Heat-resistant Insulating Tape, Heat-resistant Laminated Tubing, Interposers, Steel Plate Laminates
- Type / Form: Pellets
- Tensile (Break): 5221
from Ellsworth Adhesives
DYMAX Ultra Light-Weld 4-20418 Low Stress Plastic and Glass Bonder is a one component, UV light curing, urethane adhesive that is used for laminating and bonding metal, plastics, and glass. It is solvent free, good thermal cycling performance, and resistance to yellowing. 10 mL Syringe. [See More]
- Substrate Compatibility: Metal; Plastic
- Viscosity: 450
- Cure / Technology: Single Component
- Tensile (Break): 1650
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
DYMAX Ultra Light-Weld 4-20418 Low Stress Plastic and Glass Bonder is a one component, UV light curing, urethane adhesive that is used for laminating and bonding metal, plastics, and glass. It is solvent free, good thermal cycling performance, and resistance to yellowing. 30 mL Syringe. [See More]
- Substrate Compatibility: Metal; Plastic
- Viscosity: 450
- Cure / Technology: Single Component
- Tensile (Break): 239311
from Master Bond, Inc.
Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy; Polyurethane
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Henkel Loctite EA E-30CL is a low viscosity, impact resistant, industrial grade epoxy adhesive. When cured it can withstand exposure to a wide range of chemicals and solvents, and maintains stability over a wide temperature range. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 2250 to 10500
from Master Bond, Inc.
Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Henkel Loctite Technomelt PUR 513C Off-White is a one component, polyurethane reactive hot melt adhesive with long open time, high green strength, and aggressive tack. Ideal for laminating sandwich panel elements of particleboard, plywood, lauan, wood, fiberboard, EPS foam, PU foam, FRP, and surface... [See More]
- Substrate Compatibility: Metal; Wood
- Viscosity: 12000
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System Supreme 3HTND-1SM is a one component, exceptionally fast curing surface mount adhesive system with exceptional toughness and durability. It has high shear and peel strength for optimal bonding performance and is formulated to cure rapidly (5-10 minutes at 300 °F,... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
- Type / Form: Powder
- Chemical System: Epoxy
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Unfilled
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Type / Form: Liquid
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Type / Form: Liquid
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]
- Substrate Compatibility: Metal; Plastic
- Composition: Unfilled
- Type / Form: Gel
- Cure / Technology: Thermoset; Single Component
from Westech Aerosol Corporation
WT-HCC canister is based on the Westech's popular HSC-13 adhesive. It is supplied in a pressurized canister without hydrocarbon propellants so that it can be used with standard pneumatic spray equipment. This permits more flexibility in spray patterns from narrow to broad, fine to coarse pattern as... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Elastomeric
- Composition: Unfilled
from Epoxies Etc...
10-2000 is a one component, moisture curing polyurethane adhesive designed for bonding. and laminating. It may also be used to impregnate glass cloth and create a pipe repair. system. FEATURES: • Solvent Free. • No Mixing Required. • Resists Moisture, Solvents and Heat. • High... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Single Component; Reactive or Moisture Cured
- Chemical System: Polyurethane
- Industry: OEM or Industrial
from Phelps Industrial Products
Phelps Style 9750 is a Contact Cement that provides a long bonding range and excellent initial strength. Ideal for plastic laminates, paper honeycomb, rubber, cloth, metal and wood. Meets requirements of Mil-A-1154C, Mil-A-21366 and MMM-A-121. Ensure both surfaces are clean and dry. Apply coating to... [See More]
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates; Paper
- Cure / Technology: Air Setting / Film Drying
- Type / Form: Liquid
- Features: Sealant; Solvent Based